Abstract: An integrated circuit may include integrated memory that is formed from a chain of memory blocks. Each memory block may have configurable input and output circuits. The configurable input and output circuits may be interposed between memory circuitry such as a memory array from circuitry external to the memory circuitry. The configurable input and output circuits may have upstream and downstream memory block connection ports. In such a way, configurable input and output circuits in a first memory block may pass control and address signals and data to configurable input and output circuits in a second memory block. By using the configurable input and output circuits, the integrated memory in the integrated circuit may operate to accommodate large bandwidth flows without using the general routing fabric of the integrated circuit.

Abstract: Systems and methods for an interface with a widened interface-to-fabric shoreline between semiconductor circuits and a narrower interface-to-memory controller shoreline. The interface providing transitions from a first clock of a first circuit (e.g., field-programmable gate array (FPGA)), a second clock of a second circuit (e.g., high-bandwidth memory generation 2 (HBM2) stack, and a third clock of a physical layer of the second circuit. A first transfer between the first clock and the second clock may use a first set of first-in first-outs (FIFO) buffers, such as rate-matching FIFO buffers. A second transfer between the second clock and the third clock may use a second set of FIFO buffers, such as phase compensation FIFOs.

Abstract: Described herein are memory controllers for integrated circuits that implement network-on-chip (NoC) to provide access to memory to couple processing cores of the integrated circuit to a memory device. The NoC may be dedicated to service the memory controller and may include one or more routers to facilitate management of the access to the memory controller.

Abstract: Systems or methods of the present disclosure may improve scalability (e.g., component scalability, product variation scalability) of integrated circuit systems by disaggregating periphery intellectual property (IP) circuitry into modular periphery IP tiles that can be installed as modules. Such an integrated circuit system may include a first die that includes programmable fabric circuitry and a second die that that includes a periphery IP tile. The periphery IP tile may be disaggregated from the programmable fabric die and may be communicatively coupled to the first die via a modular interface.

Abstract: An integrated circuit may include memory interface circuitry for communicating with an external or in-package memory module. The integrated circuit may also include out-of-order (OOO) clients and in-order (IO) clients that issue read and write commands to the memory interface circuitry. The memory interface circuitry may include a memory controller having an OOO command scheduler, a write data buffer, and a simple read data pipeline. The memory interface circuitry may also include a multiport arbitration circuit for interfacing with the multiple clients and also OOO adaptor circuits interposed between the multiport arbitration circuit and the IO clients. Each of the OOO adaptor circuits may include an ID generator and a local reordering buffer and may allow the memory controller to return data to the various clients without throttling.

Abstract: Systems and methods for providing capability of access to distributed memory blocks using a global address scheme in a programmable logic device. Each of the distributed memory blocks includes routing circuitry that receives data, and in a first mode, decodes whether the data is intended for a respective distributed memory block. In a second mode, the data may bypass routing circuitry. Furthermore, the data may be received at the distributed memory block via cascade connections of distributed memory blocks in a column and/or via register in the programmable fabric of the programmable logic device.

Abstract: Integrated circuits that include memory interface and controller circuitry for communicating with external memory are provided. The memory interface and controller circuitry may include a user logic interface, a memory controller, and a physical layer input-output interface. The user logic interface may be operated in a first clock domain. The memory controller may be operated in a second clock domain. The physical layer interface may be operated in a third clock domain that is an integer multiple of the second clock domain. The user logic interface may include only user-dependent blocks. The physical layer interface may include memory protocol agnostic blocks and/or memory protocol specific blocks. The memory controller may include both memory protocol agnostic blocks and memory protocol dependent blocks. The memory controller may include one or more color pipelines for scheduling memory requests in a parallel arbitration scheme.

Abstract: An integrated circuit device or devices is presented that include internal connection ports to transmit data to or receive data from a first portion of the integrated circuit device. The integrated circuit device(s) also include external connection ports to transmit data to or receive data from outside the integrated circuit device, such as between integrated circuit devices. The integrated circuit device also includes remapping circuitry that remaps from a first connection between a first internal connection port of the internal connection ports and a first external connection port of the external connection ports to a second connection between a second internal connection port of the internal connection ports and a second external connection port of the external connection ports.

Abstract: An integrated circuit device or devices is presented that include internal connection ports to transmit data to or receive data from a first portion of the integrated circuit device. The integrated circuit device(s) also include external connection ports to transmit data to or receive data from outside the integrated circuit device, such as between integrated circuit devices. The integrated circuit device also includes remapping circuitry that remaps from a first connection between a first internal connection port of the internal connection ports and a first external connection port of the external connection ports to a second connection between a second internal connection port of the internal connection ports and a second external connection port of the external connection ports.

Abstract: A multichip package having a main die coupled to one or more daughter dies is provided. The main die may include embedded universal interface blocks (UIB) each of which can be used to interface with a corresponding daughter die to support high bandwidth parallel or serial communications. Each UIB may include an integrated processor subsystem and associated pattern sequencing logic to perform interface initialization and margining operations. Each UIB may perform simultaneous accesses to a daughter die across one or more channels. Each UIB may also include multiple phase-locked loop circuits for providing different clock signals to different portions of the UIB and a 2× clock phase generation logic. Each UIB may include multiple IO modules, each of which may optionally include its own duty cycle correction circuit. Each IO module may include buffer circuits, each of which may have a de-emphasis control logic for adjusting buffer drive strength.

Abstract: Integrated circuits that include memory interface and controller circuitry for communicating with external memory are provided. The memory interface and controller circuitry may include a user logic interface, a memory controller, and a physical layer input-output interface. The user logic interface may be operated in a first clock domain. The memory controller may be operated in a second clock domain. The physical layer interface may be operated in third clock domain that is an integer multiple of the second clock domain. The user logic interface may include only user-dependent blocks. The physical layer interface may include memory protocol agnostic blocks and/or memory protocol specific blocks. The memory controller may include both memory protocol agnostic blocks and memory protocol dependent blocks. The memory controller may include one or more color pipelines for scheduling memory requests in a parallel arbitration scheme.

Abstract: A method for dynamically configuring multiple processors based on needs of applications includes receiving, from an application, an acceleration request message including a task to be accelerated. The method further includes determining a type of the task and searching a database of available accelerators to dynamically select a first accelerator based on the type of the task. The method further includes sending the acceleration request message to a first acceleration interface located at a configurable processing circuit. The first acceleration interface sends the acceleration request message to a first accelerator, and the first accelerator accelerates the task upon receipt of the acceleration request message.

Abstract: One embodiment relates to a memory structure that includes a bank group and a port emulation circuit module. The bank group includes a plurality of memory banks, each memory bank having one read port and one write port. The port emulation circuit module provides a group read/write port and a group read port for the bank group. Another embodiment relates to a port emulation circuit module. The port emulation circuit module includes a port emulation control circuit that receives control signals including a first address for a group read/write port and a second address for a group read port, a first data path circuit for the group read/write port, and a second data path circuit for the group read port, wherein the second data path circuit outputs a second read data. Other embodiments and features are also disclosed.

Abstract: A multichip package having a main die coupled to one or more daughter dies is provided. The main die may include embedded universal interface blocks (UIB) each of which can be used to interface with a corresponding daughter die to support high bandwidth parallel or serial communications. Each UIB may include an integrated processor subsystem and associated pattern sequencing logic to perform interface initialization and margining operations. Each UIB may perform simultaneous accesses to a daughter die across one or more channels. Each UIB may also include multiple phase-locked loop circuits for providing different clock signals to different portions of the UIB and a 2× clock phase generation logic. Each UIB may include multiple IO modules, each of which may optionally include its own duty cycle correction circuit. Each IO module may include buffer circuits, each of which may have a de-emphasis control logic for adjusting buffer drive strength.

Abstract: An offloading engine integrated circuit that includes soft processors may be implemented using an aggregated profiler and a soft processor system generation tool. In particular, the aggregated profiler may generate a suggested configuration for soft processors within the integrated circuit. The soft processor system generation tool may use inputs based on the suggested configuration to generate a configuration bit stream that is used to configure the integrated circuit. Soft processors within the integrated circuits may be arranged in soft processors columns. Parameters for the soft processors and the soft processor columns may be dynamically reconfigured. The parameters may include sizes for each soft processor column, a number of soft processor columns, types (e.g., processor architecture types) of each processor. Multiple soft processor columns may also be grouped together to complete a single task. Interface circuitry may regulate information flow to and from the soft processor columns.

Abstract: A multichip package is provided that includes multiple integrated circuit (IC) dies mounted on a shared interposer. The IC dies may communicate with one another via corresponding input-output (IO) elements on the dies. The interposer may include a system-level power management block that is configured to coordinate low-power entry and exit for the IO elements based on customer application needs. Performing application-specific power gating, which may include a combination of coarse-grained and fine-grained power gating control of the IO elements while the IO interface is sitting idle, can help maximize power savings in memory and a variety of other user applications.

Abstract: Integrated circuits that include memory interface and controller circuitry for communicating with external memory are provided. The memory interface and controller circuitry may include a user logic interface, a memory controller, and a physical layer input-output interface. The user logic interface may be operated in a first clock domain. The memory controller may be operated in a second clock domain. The physical layer interface may be operated in a third clock domain that is an integer multiple of the second clock domain. The user logic interface may include only user-dependent blocks. The physical layer interface may include memory protocol agnostic blocks and/or memory protocol specific blocks. The memory controller may include both memory protocol agnostic blocks and memory protocol dependent blocks. The memory controller may include one or more color pipelines for scheduling memory requests in a parallel arbitration scheme.

Abstract: Systems and methods for interface block. The interface block includes input/output modules distributed along the interface block and a mid-stack module interspersed within the input/output modules. The input/output modules include at least one data module and at least one command module. At least one of the input/output modules is shared by an adjacent pair of channels. Each of the input/output modules is configured to interface with a memory device via a silicon interposer or equivalent. The mid-stack module is in communication with the input/output modules via programmable logic circuitry. The mid-stack module may include independent clock quadrants. Each clock quadrant is configured to operate at different phases where each phase is aligned to a respective core clock.

Abstract: Integrated circuits that include memory interface and controller circuitry for communicating with external memory are provided. The memory interface and controller circuitry may include a user logic interface, a memory controller, and a physical layer input-output interface. The user logic interface may be operated in a first clock domain. The memory controller may be operated in a second clock domain. The physical layer interface may be operated in a third clock domain that is an integer multiple of the second clock domain. The user logic interface may include only user-dependent blocks. The physical layer interface may include memory protocol agnostic blocks and/or memory protocol specific blocks. The memory controller may include both memory protocol agnostic blocks and memory protocol dependent blocks. The memory controller may include one or more color pipelines for scheduling memory requests in a parallel arbitration scheme.

Abstract: A method for dynamically configuring multiple processors based on needs of applications includes receiving, from an application, an acceleration request message including a task to be accelerated. The method further includes determining a type of the task and searching a database of available accelerators to dynamically select a first accelerator based on the type of the task. The method further includes sending the acceleration request message to a first acceleration interface located at a configurable processing circuit. The first acceleration interface sends the acceleration request message to a first accelerator, and the first accelerator accelerates the task upon receipt of the acceleration request message.