Patents by Inventor Chee Yang Ng

Chee Yang Ng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210193560
    Abstract: A semiconductor device includes a conductive frame comprising a die attach surface that is substantially planar, a semiconductor die comprising a first load on a rear surface and a second terminal disposed on a main surface, a first conductive contact structure disposed on the die attach surface, and a second conductive contact structure on the main surface. The first conductive contact structure vertically extends past a plane of the main surface of the semiconductor die. The first conductive contact structure is electrically isolated from the main surface of the semiconductor die by an electrical isolation structure. An upper surface of the electrical isolation structure is below the main surface of the semiconductor die.
    Type: Application
    Filed: December 18, 2019
    Publication date: June 24, 2021
    Inventors: Stuart Cardwell, Chee Yang Ng, Josef Maerz, Clive O'Dell, Mark Pavier
  • Patent number: 11039231
    Abstract: In accordance with an embodiment a package includes: a package structure which defines inner surfaces delimiting an inner volume and outer surfaces directed towards an exterior of the package; at least one acoustic sensor element applied to at least one of the inner surfaces, to convert acoustic waves arriving from the exterior of the package into acoustic information in the form of electric signals; a plurality of millimeter wave sensing elements applied to at least one of the outer surfaces, to receive reflected radar signals from objects in the exterior of the package; and a circuitry applied to at least one of the inner surfaces of the package structure, wherein the circuitry is electrically connected to the at least one acoustic sensor element and the plurality of millimeter wave sensing elements to process the acoustic information and the reflected radar signals.
    Type: Grant
    Filed: November 13, 2019
    Date of Patent: June 15, 2021
    Assignee: INFINEON TECHNOLOGIES AG
    Inventors: Kok Yau Chua, Chee Yang Ng
  • Publication number: 20200381380
    Abstract: Embodiments of molded packages and corresponding methods of manufacture are provided. In an embodiment of a molded package, the molded package includes a laser-activatable mold compound having a plurality of laser-activated regions which are plated with an electrically conductive material to form metal pads and/or metal traces at a first side of the laser-activatable mold compound. A semiconductor die embedded in the laser-activatable mold compound has a plurality of die pads. An interconnect electrically connects the plurality of die pads of the semiconductor die to the metal pads and/or metal traces at the first side of the laser-activatable mold compound.
    Type: Application
    Filed: May 28, 2020
    Publication date: December 3, 2020
    Inventors: Chee Hong Lee, Kok Yau Chua, Chii Shang Hong, Swee Kah Lee, Chee Yang Ng, Klaus Schiess
  • Patent number: 10770399
    Abstract: A semiconductor package includes a frame having an insulative body with a first main surface and a second main surface opposite the first main surface, a first plurality of metal traces at the first main surface, and a first cavity in the insulative body. A thermally and/or electrically conductive material filling the first cavity in the insulative body and having a different composition than the first plurality of metal traces. The thermally and/or electrically conductive material provides a thermally and/or electrically conductive path between the first and the second main surfaces of the insulative body. A semiconductor die attached to the frame at the first main surface of the insulative body is electrically connected to the first plurality of metal traces and to the thermally and/or electrically conductive material filling the first cavity in the insulative body. A corresponding method of manufacture is also described.
    Type: Grant
    Filed: February 13, 2019
    Date of Patent: September 8, 2020
    Assignee: Infineon Technologies AG
    Inventors: Chee Yang Ng, Hock Siang Chua, Stefan Macheiner, Josef Maerz, Nurfarena Othman, Joseph Victor Soosai Prakasam, Hong Hock Tay
  • Publication number: 20200258842
    Abstract: A semiconductor package includes a frame having an insulative body with a first main surface and a second main surface opposite the first main surface, a first plurality of metal traces at the first main surface, and a first cavity in the insulative body. A thermally and/or electrically conductive material filling the first cavity in the insulative body and having a different composition than the first plurality of metal traces. The thermally and/or electrically conductive material provides a thermally and/or electrically conductive path between the first and the second main surfaces of the insulative body. A semiconductor die attached to the frame at the first main surface of the insulative body is electrically connected to the first plurality of metal traces and to the thermally and/or electrically conductive material filling the first cavity in the insulative body. A corresponding method of manufacture is also described.
    Type: Application
    Filed: February 13, 2019
    Publication date: August 13, 2020
    Inventors: Chee Yang Ng, Hock Siang Chua, Stefan Macheiner, Josef Maerz, Nurfarena Othman, Joseph Victor Soosai Prakasam, Hong Hock Tay
  • Publication number: 20200154183
    Abstract: In accordance with an embodiment a package includes: a package structure which defines inner surfaces delimiting an inner volume and outer surfaces directed towards an exterior of the package; at least one acoustic sensor element applied to at least one of the inner surfaces, to convert acoustic waves arriving from the exterior of the package into acoustic information in the form of electric signals; a plurality of millimeter wave sensing elements applied to at least one of the outer surfaces, to receive reflected radar signals from objects in the exterior of the package; and a circuitry applied to at least one of the inner surfaces of the package structure, wherein the circuitry is electrically connected to the at least one acoustic sensor element and the plurality of millimeter wave sensing elements to process the acoustic information and the reflected radar signals.
    Type: Application
    Filed: November 13, 2019
    Publication date: May 14, 2020
    Inventors: Kok Yau Chua, Chee Yang Ng
  • Publication number: 20200048075
    Abstract: An embodiment device includes a body structure having an interior cavity, a control chip disposed on a first interior surface of the interior cavity, and a sensor attached, at a first side, to a second interior surface of the interior cavity opposite the first interior surface. The sensor has a mounting pad on a second side of the sensor that faces the first interior surface, and the sensor is vertically spaced apart from the control chip by an air gap, with the sensor is aligned at least partially over the control chip. The device further includes an interconnect having a first end mounted on the mounting pad, the interconnect extending through the interior cavity toward the first interior surface, and the control chip is in electrical communication with the sensor by way of the interconnect.
    Type: Application
    Filed: October 22, 2019
    Publication date: February 13, 2020
    Inventors: Sook Woon Chan, Chau Fatt Chiang, Kok Yau Chua, Swee Kah Lee, Chee Yang Ng
  • Patent number: 10549985
    Abstract: A semiconductor package includes a semiconductor die having a sensor structure disposed at a first side of the semiconductor die, and a first port extending through the semiconductor die from the first side to a second side of the semiconductor die opposite the first side, so as to provide a link to the outside environment. Corresponding methods of manufacture are also provided.
    Type: Grant
    Filed: August 31, 2017
    Date of Patent: February 4, 2020
    Assignee: Infineon Technologies AG
    Inventors: Dominic Maier, Matthias Steiert, Chau Fatt Chiang, Christian Geissler, Bernd Goller, Thomas Kilger, Johannes Lodermeyer, Franz-Xaver Muehlbauer, Chee Yang Ng, Beng Keh See, Claus Waechter
  • Patent number: 10501312
    Abstract: An embodiment device includes a body structure having an interior cavity, a control chip disposed on a first interior surface of the interior cavity, and a sensor attached, at a first side, to a second interior surface of the interior cavity opposite the first interior surface. The sensor has a mounting pad on a second side of the sensor that faces the first interior surface, and the sensor is vertically spaced apart from the control chip by an air gap, with the sensor is aligned at least partially over the control chip. The device further includes an interconnect having a first end mounted on the mounting pad, the interconnect extending through the interior cavity toward the first interior surface, and the control chip is in electrical communication with the sensor by way of the interconnect.
    Type: Grant
    Filed: July 18, 2017
    Date of Patent: December 10, 2019
    Assignee: Infineon Technologies AG
    Inventors: Sook Woon Chan, Chau Fatt Chiang, Kok Yau Chua, Swee Kah Lee, Chee Yang Ng
  • Patent number: 10304780
    Abstract: A device includes a substrate that includes conductive structures and has a first surface that is opposite to a second surface. Conductive pillars are built up over and electrically coupled to at least one of the conductive structures. An integrated circuit is disposed over the first surface and electrically coupled to the conductive structures. A molding compound is formed over the first surface of the substrate.
    Type: Grant
    Filed: July 2, 2018
    Date of Patent: May 28, 2019
    Assignee: Infineon Technologies AG
    Inventors: Chau Fatt Chiang, Kok Yau Chua, Swee Kah Lee, Chee Yang Ng, Valentyn Solomko
  • Patent number: 10224260
    Abstract: A semiconductor package includes a semiconductor die having a first main side and a second main side opposite the first main side, the first main side having an inner region surrounded by a periphery region. The semiconductor package further includes a film covering the semiconductor die and adhered to the periphery region of the first main side of the semiconductor die. The film has a curved surface so that the inner region of the first main side of the semiconductor die is spaced apart from the film by an air gap. Electrical conductors are attached at a first end to pads at the periphery region of the first main side of the semiconductor die. A corresponding method of manufacture is also provided.
    Type: Grant
    Filed: November 26, 2013
    Date of Patent: March 5, 2019
    Assignee: Infineon Technologies AG
    Inventor: Chee Yang Ng
  • Publication number: 20190023561
    Abstract: An embodiment device includes a body structure having an interior cavity, a control chip disposed on a first interior surface of the interior cavity, and a sensor attached, at a first side, to a second interior surface of the interior cavity opposite the first interior surface. The sensor has a mounting pad on a second side of the sensor that faces the first interior surface, and the sensor is vertically spaced apart from the control chip by an air gap, with the sensor is aligned at least partially over the control chip. The device further includes an interconnect having a first end mounted on the mounting pad, the interconnect extending through the interior cavity toward the first interior surface, and the control chip is in electrical communication with the sensor by way of the interconnect.
    Type: Application
    Filed: July 18, 2017
    Publication date: January 24, 2019
    Inventors: Sook Woon Chan, Chau Fatt Chiang, Kok Yau Chua, Swee Kah Lee, Chee Yang Ng
  • Patent number: 10163812
    Abstract: A device includes a substrate that includes conductive structures and has a first surface that is opposite to a second surface. Conductive pillars are built up over and electrically coupled to at least one of the conductive structures. An integrated circuit is disposed over the first surface and electrically coupled to the conductive structures. A molding compound is formed over the first surface of the substrate.
    Type: Grant
    Filed: October 19, 2016
    Date of Patent: December 25, 2018
    Assignee: Infineon Technologies AG
    Inventors: Chau Fatt Chiang, Kok Yau Chua, Swee Kah Lee, Chee Yang Ng, Valentyn Solomko
  • Publication number: 20180308804
    Abstract: A device includes a substrate that includes conductive structures and has a first surface that is opposite to a second surface. Conductive pillars are built up over and electrically coupled to at least one of the conductive structures. An integrated circuit is disposed over the first surface and electrically coupled to the conductive structures. A molding compound is formed over the first surface of the substrate.
    Type: Application
    Filed: July 2, 2018
    Publication date: October 25, 2018
    Applicant: Infineon Technologies AG
    Inventors: Chau Fatt Chiang, Kok Yau Chua, Swee Kah Lee, Chee Yang NG, Valentyn Solomko
  • Patent number: 10109592
    Abstract: A semiconductor device includes a semiconductor chip having a first main surface, a second main surface opposite to the first main surface, and a side wall surface. An electrical contact area is exposed at the side wall surface of the semiconductor chip. An electrically conducting layer covers at least partially the second main surface and the electrical contact area.
    Type: Grant
    Filed: November 26, 2013
    Date of Patent: October 23, 2018
    Assignee: Infineon Technologies AG
    Inventor: Chee Yang Ng
  • Publication number: 20180148322
    Abstract: A semiconductor package includes a semiconductor die having a sensor structure disposed at a first side of the semiconductor die, and a first port extending through the semiconductor die from the first side to a second side of the semiconductor die opposite the first side, so as to provide a link to the outside environment. Corresponding methods of manufacture are also provided.
    Type: Application
    Filed: August 31, 2017
    Publication date: May 31, 2018
    Inventors: Dominic Maier, Matthias Steiert, Chau Fatt Chiang, Christian Geissler, Bernd Goller, Thomas Kilger, Johannes Lodermeyer, Franz-Xaver Muehlbauer, Chee Yang Ng, Beng Keh See, Claus Waechter
  • Publication number: 20180108616
    Abstract: A device includes a substrate that includes conductive structures and has a first surface that is opposite to a second surface. Conductive pillars are built up over and electrically coupled to at least one of the conductive structures. An integrated circuit is disposed over the first surface and electrically coupled to the conductive structures. A molding compound is formed over the first surface of the substrate.
    Type: Application
    Filed: October 19, 2016
    Publication date: April 19, 2018
    Applicant: Infineon Technologies AG
    Inventors: Chau Fatt Chiang, Kok Yau Chua, Swee Kah Lee, Chee Yang NG, Valentyn Solomko
  • Patent number: 9868632
    Abstract: A base plate with a first side having an elevated portion, a recessed portion laterally surrounding the elevated portion, and a vertical face extending from the recessed portion to the elevated portion is provided. At least a part of the vertical face is covered with a metal layer. A mold compound structure is formed on the first side with the metal layer disposed between the first side and the mold compound structure such that the mold compound structure includes an elevated portion laterally surrounding a recessed portion, and opposing edge faces that vertically extend from the recessed portion to the elevated portion. At least a part of the base plate is subsequently removed such that the recessed portion of the mold compound structure is uncovered from the base plate and such that the metal layer remains on at least one uncovered section of the mold compound structure.
    Type: Grant
    Filed: March 24, 2016
    Date of Patent: January 16, 2018
    Assignee: Infineon Technologies AG
    Inventors: Chau Fatt Chiang, Kok Yau Chua, Swee Kah Lee, Chee Yang Ng, Horst Theuss
  • Publication number: 20170275159
    Abstract: A base plate with a first side having an elevated portion, a recessed portion laterally surrounding the elevated portion, and a vertical face extending from the recessed portion to the elevated portion is provided. At least a part of the vertical face is covered with a metal layer. A mold compound structure is formed on the first side with the metal layer disposed between the first side and the mold compound structure such that the mold compound structure includes an elevated portion laterally surrounding a recessed portion, and opposing edge faces that vertically extend from the recessed portion to the elevated portion. At least a part of the base plate is subsequently removed such that the recessed portion of the mold compound structure is uncovered from the base plate and such that the metal layer remains on at least one uncovered section of the mold compound structure.
    Type: Application
    Filed: March 24, 2016
    Publication date: September 28, 2017
    Inventors: Chau Fatt Chiang, Kok Yau Chua, Swee Kah Lee, Chee Yang Ng, Horst Theuss
  • Patent number: 9628918
    Abstract: A semiconductor device includes a microphone module implemented on a first semiconductor die and a signal processing module implemented on a second semiconductor die. The microphone module includes a movable microphone element arranged at a main side of the first semiconductor die and the second semiconductor die is mounted to the main side of the first semiconductor die.
    Type: Grant
    Filed: November 25, 2013
    Date of Patent: April 18, 2017
    Assignee: Infineon Technologies AG
    Inventor: Chee Yang Ng