Patents by Inventor Cheeman Yu

Cheeman Yu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10229886
    Abstract: A system is disclosed for providing backward and forward traceability by a methodology which identifies discrete components (die, substrate and/or passives) that are included in a semiconductor device. The present technology further includes a system for generating a unique identifier and marking a semiconductor device with the unique identifier enabling the semiconductor device, and the discrete components within that device, to be tracked and traced through each process and test in the production of the semiconductor device.
    Type: Grant
    Filed: February 25, 2016
    Date of Patent: March 12, 2019
    Assignee: SanDisk Semiconductor (Shanghai) Co. Ltd.
    Inventors: Cheeman Yu, Didier Chavet
  • Patent number: 10051733
    Abstract: A printed circuit board is disclosed having coextensive electrical connectors and contact pad areas. Areas of the contact pads where the traces and/or vias are located may be etched away to ensure electrical isolation between the traces, vias and contact pads.
    Type: Grant
    Filed: April 13, 2015
    Date of Patent: August 14, 2018
    Assignee: SanDisk Technologies Inc.
    Inventors: Chih-Chin Liao, Han-Shiao Chen, Chin-Tien Chiu, Ken Jian Ming Wang, Cheeman Yu, Hem Takiar
  • Patent number: 9773766
    Abstract: A semiconductor package including a plurality of stacked semiconductor die, and methods of forming the semiconductor package, are disclosed. In order to ease wirebonding requirements on the controller die, the controller die may be mounted directly to the substrate in a flip chip arrangement requiring no wire bonds or footprint outside of the controller die. Thereafter, a spacer layer may be affixed to the substrate around the controller die to provide a level surface on which to mount one or more flash memory die. The spacer layer may be provided in a variety of different configurations.
    Type: Grant
    Filed: January 9, 2013
    Date of Patent: September 26, 2017
    Assignees: SanDisk Information Technology (Shanghai) Co., Ltd., SanDisk Semiconductor (Shanghai) Co. Ltd.
    Inventors: Ning Ye, Chin-Tien Chiu, Suresh Upadhyayula, Peng Fu, Zhong Lu, Cheeman Yu, Yuang Zhang, Li Wang, Pradeep Kumar Rai, Weili Wang, Enyong Tai, King Hoo Ong, Kim Lee Bock
  • Patent number: 9704797
    Abstract: A wire bonded structure for a semiconductor device is disclosed. The wire bonded structure comprises a bonding pad; and a continuous length of wire mutually diffused with the bonding pad, the wire electrically coupling the bonding pad with a first electrical contact and a second electrical contact different from the first electrical contact.
    Type: Grant
    Filed: May 18, 2011
    Date of Patent: July 11, 2017
    Assignee: SanDisk Information Technology (Shanghai) Co., Ltd.
    Inventors: Zhong Lu, Fen Yu, Chin Tien Chiu, Cheeman Yu, Fuqiang Xiao
  • Publication number: 20160181205
    Abstract: A system is disclosed for providing backward and forward traceability by a methodology which identifies discrete components (die, substrate and/or passives) that are included in a semiconductor device. The present technology further includes a system for generating a unique identifier and marking a semiconductor device with the unique identifier enabling the semiconductor device, and the discrete components within that device, to be tracked and traced through each process and test in the production of the semiconductor device.
    Type: Application
    Filed: February 25, 2016
    Publication date: June 23, 2016
    Applicant: SanDisk Semiconductor (Shanghai) Co. Ltd.
    Inventors: Cheeman Yu, Didier Chavet
  • Patent number: 9362244
    Abstract: A memory device, and a method of making the memory device, are disclosed. The memory device is fabricated by mounting one or more semiconductor die on a substrate, and wire bonding the die to the substrate. The die and wire bonds are encapsuated, and the encapsulated device is singulated. The wire bonds are severed during the singulation step, and thereafter the severed wire bonds are connected to the substrate by external connectors on one or more surfaces of the molding compound.
    Type: Grant
    Filed: October 22, 2012
    Date of Patent: June 7, 2016
    Assignee: SanDisk Information Technology (Shanghai) Co., Ltd.
    Inventors: Chin Tien Chiu, Cheeman Yu, Hem Takiar
  • Patent number: 9337153
    Abstract: A memory device including a metallic layer shielding electromagnetic radiation and/or dissipating heat, and a method of making the memory device, are disclosed. The metallic layer is formed on a metallic layer transfer assembly. The metallic layer transfer assembly and the unencapsulated memory device are placed in a mold and encapsulated. During the encapsulation and curing of the molding compound, the metallic layer is transferred from the shield to the encapsulated memory device.
    Type: Grant
    Filed: December 16, 2011
    Date of Patent: May 10, 2016
    Assignee: SanDisk Information Technology (Shanghai) Co., Ltd.
    Inventors: Peng Fu, Shan Luo, Zhong Lu, Kaiyou Qian, Chin Tien Chiu, Cheeman Yu, Hem Takiar, Ye Bai
  • Patent number: 9331045
    Abstract: A laminating device (230) and method are disclosed for laminating semiconductor die (220) on substrates on a panel (200) of substrates. The laminating device (230) includes lamination units (234,236,238,240) that operate independently of each other so that a row or column of semiconductor die (220) may be independently laminated onto a row or column of substrates simultaneously.
    Type: Grant
    Filed: May 7, 2012
    Date of Patent: May 3, 2016
    Assignees: SanDisk Information Technology (Shanghai) Co., Ltd., SanDisk Semiconductor (Shanghai) Co., Ltd.
    Inventors: Wei Gu, Zhong Lu, Cheeman Yu, Chin-Tien Chiu, En-Yong Tai, Min Ni
  • Publication number: 20160086827
    Abstract: A memory device including graphical content and a method of making the memory device with graphical content are disclosed. The graphical content is formed on a release media. The release media and the unencapsulated memory device are placed in a mold and encapsulated. During the encapsulation and curing of the molding compound, the graphical content is transferred from the release media to the encapsulated memory device.
    Type: Application
    Filed: December 4, 2015
    Publication date: March 24, 2016
    Inventors: Peng Fu, Zhong Lu, Chin Tien Chiu, Cheeman Yu, Matthew Chen, Weiting Jiang
  • Patent number: 9240393
    Abstract: A semiconductor device including two or more die stacks mounted to a substrate. The first die stack is mounted, at least partially encapsulated, and then tested. If the first die stack functions within predefined parameters, a second die stack is mounted on the first die stack, and then the device may undergo a second encapsulation process. Testing the first die stack before mounting the second improves yield by identifying faulty semiconductor die before all die are mounted within the semiconductor device.
    Type: Grant
    Filed: August 1, 2014
    Date of Patent: January 19, 2016
    Assignee: SanDisk Information Technology (Shanghai) Co., Ltd.
    Inventors: Cheeman Yu, Zhong Lu, Gursharan Singh, Wei Gu
  • Patent number: 9236368
    Abstract: A semiconductor device includes a substrate (102) with a cavity (112) formed therein for receiving a semiconductor die. In examples, the semiconductor die is a controller die (114). The controller die (114) may be electrically connected to the substrate (102) with electrical traces (120) which may be formed for example by printing. After the controller die (114) is electrically connected to the substrate (102), one or more memory die (150) may be affixed to the substrate (102), over the cavity (112) and controller die (114).
    Type: Grant
    Filed: January 28, 2013
    Date of Patent: January 12, 2016
    Assignee: SanDisk Information Technology (Shanghai) Co., Ltd.
    Inventors: Shiv Kumar, Chin-Tien Chiu, Kaiyou Qian, Cheeman Yu
  • Patent number: 9230919
    Abstract: A rigid wave pattern formed on a first side of a substrate in a semiconductor die package. The rigid wave pattern aligns with and overlies the contact fingers formed on the second side of the substrate. The rigid wave pattern includes a first pattern with an etched portion and an unetched portion around the etched portion. When the substrate and dice are encased during the molding process, the rigid wave pattern effectively reduces deformation of and stresses on the dice, therefore substantially alleviating die cracking.
    Type: Grant
    Filed: October 30, 2014
    Date of Patent: January 5, 2016
    Assignee: SanDisk Technologies Inc.
    Inventors: Chin-Tien Chiu, Chih-Chin Liao, Ken Jian Ming Wang, Han-Shiao Chen, Cheeman Yu, Hem Takiar
  • Patent number: 9209159
    Abstract: A strengthened semiconductor die substrate and package are disclosed. The substrate may include contact fingers formed with nonlinear edges. Providing a nonlinear contour to the contact finger edges reduces the mechanical stress exerted on the semiconductor die which would otherwise occur with straight edges to the contact fingers. The substrate may additionally or alternatively include plating traces extending at an angle from the contact fingers. Extending at an angle, at least the ends of the plating traces at the edge of the substrate are covered beneath a lid in which the semiconductor package is encased. Thus, when in use with a host device, contact between the ends of the plating traces beneath the lid and contact pins of the host device is avoided.
    Type: Grant
    Filed: March 2, 2012
    Date of Patent: December 8, 2015
    Assignee: SanDisk Technologies Inc.
    Inventors: Hem Takiar, Cheeman Yu, Ken Jian Ming Wang, Chin-Tien Chiu, Han-Shiao Chen, Chih-Chin Liao
  • Publication number: 20150223335
    Abstract: A printed circuit board is disclosed having coextensive electrical connectors and contact pad areas. Areas of the contact pads where the traces and/or vias are located may be etched away to ensure electrical isolation between the traces, vias and contact pads.
    Type: Application
    Filed: April 13, 2015
    Publication date: August 6, 2015
    Applicant: SANDISK TECHNOLOGIES INC.
    Inventors: Chih-Chin Liao, Han-Shiao Chen, Chin-Tien Chiu, Ken Jian Ming Wang, Cheeman Yu, Hem Takiar
  • Publication number: 20150221624
    Abstract: A semiconductor package including a plurality of stacked semiconductor die, and methods of forming the semiconductor package, are disclosed. In order to ease wirebonding requirements on the controller die, the controller die may be mounted directly to the substrate in a flip chip arrangement requiring no wire bonds or footprint outside of the controller die. Thereafter, a spacer layer may be affixed to the substrate around the controller die to provide a level surface on which to mount one or more flash memory die. The spacer layer may be provided in a variety of different configurations.
    Type: Application
    Filed: January 9, 2013
    Publication date: August 6, 2015
    Applicants: SANDISK SEMICONDUCTOR (SHANGHAI) CO., LTD., SANDISK INFORMATION TECHNOLOGY (SHANGHAI) CO., LTD.
    Inventors: Ning Ye, Chin-Tien Chiu, Suresh Upadhyayula, Peng Fu, Zhong Lu, Cheeman Yu, Yuang Zhang, Li Wang, Pradeep Kumar Rai, Weili Wang, Enyong Tai, King Hoo Ong, Kim Lee Bock
  • Publication number: 20150214206
    Abstract: A semiconductor device includes a substrate (102) with a cavity (112) formed therein for receiving a semiconductor die. In examples, the semiconductor die is a controller die (114). The controller die (114) may be electrically connected to the substrate (102) with electrical traces (120) which may be formed for example by printing. After the controller die (114) is electrically connected to the substrate (102), one or more memory die (150) may be affixed to the substrate (102), over the cavity (112) and controller die (114).
    Type: Application
    Filed: January 28, 2013
    Publication date: July 30, 2015
    Applicant: SANDISK INFORMATION TECHNOLOGY (SHANGHAI) CO., LTD.
    Inventors: Shiv Kumar, Chin-Tien Chiu, Kaiyou Qian, Cheeman Yu
  • Publication number: 20150115479
    Abstract: A laminating device (230) and method are disclosed for laminating semiconductor die (220) on substrates on a panel (200) of substrates. The laminating device (230) includes lamination units (234,236,238,240) that operate independently of each other so that a row or column of semiconductor die (220) may be independently laminated onto a row or column of substrates simultaneously.
    Type: Application
    Filed: May 7, 2012
    Publication date: April 30, 2015
    Applicants: SANDISK SEMICONDUCTOR (SHANGHAI) CO., LTD., SANDISK INFORMATION TECHNOLOGY (SHANGHAI) CO., LTD.
    Inventors: Wei Gu, Zhong Lu, Cheeman Yu, Chin-Tien Chiu, En-Yong Tai, Min Ni
  • Publication number: 20150061157
    Abstract: A semiconductor device including two or more die stacks mounted to a substrate. The first die stack is mounted, at least partially encapsulated, and then tested. If the first die stack functions within predefined parameters, a second die stack is mounted on the first die stack, and then the device may undergo a second encapsulation process. Testing the first die stack before mounting the second improves yield by identifying faulty semiconductor die before all die are mounted within the semiconductor device.
    Type: Application
    Filed: August 1, 2014
    Publication date: March 5, 2015
    Inventors: Cheeman Yu, Zhong Lu, Gursharan Singh, Wei Gu
  • Publication number: 20150054177
    Abstract: A rigid wave pattern formed on a first side of a substrate in a semiconductor die package. The rigid wave pattern aligns with and overlies the contact fingers formed on the second side of the substrate. The rigid wave pattern includes a first pattern with an etched portion and an unetched portion around the etched portion. When the substrate and dice are encased during the molding process, the rigid wave pattern effectively reduces deformation of and stresses on the dice, therefore substantially alleviating die cracking.
    Type: Application
    Filed: October 30, 2014
    Publication date: February 26, 2015
    Applicant: SANDISK TECHNOLOGIES INC.
    Inventors: Chin-Tien Chiu, Chih-Chin Liao, Ken Jian Ming Wang, Han-Shiao Chen, Cheeman Yu, Hem Takiar
  • Publication number: 20150001739
    Abstract: A memory device, and a method of making the memory device, are disclosed. The memory device is fabricated by mounting one or more semiconductor die on a substrate, and wire bonding the die to the substrate. The die and wire bonds are encapsuated, and the encapsulated device is singulated. The wire bonds are severed during the singulation step, and thereafter the severed wire bonds are connected to the substrate by external connectors on one or more surfaces of the molding compound.
    Type: Application
    Filed: October 22, 2012
    Publication date: January 1, 2015
    Inventors: Chin Tien Chiu, Cheeman Yu, Hem Takiar