Abstract: A method includes forming a set of through-vias in a substrate, the set of through-vias partially penetrating a thickness of the substrate. First connectors are formed over the set of through-vias on a first side of the substrate. The first side of the substrate is attached to a carrier. The substrate is thinned from the second side to expose the set of through-vias. Second connectors are formed over the set of through-vias on the second side of the substrate. A device die is bonded to the second connectors. The substrate is singulated into multiple packages.

Abstract: Disclosed is a thermal conduction-electrical conduction isolated circuit board with a ceramic substrate and a power transistor embedded, mainly comprising: a dielectric material layer, a heat-dissipating ceramic block, a securing portion, a stepped metal electrode layer, a power transistor, and a dielectric material packaging, wherein a via hole is formed in the dielectric material layer, the heat-dissipating ceramic block is correspondingly embedded in the via hole, the heat-dissipating ceramic block has a thermal conductivity higher than that of the dielectric material layer and a thickness less than that of the dielectric material layer, the stepped metal electrode layer conducts electricity and heat for the power transistor, the dielectric material packaging is configured to partially expose the source connecting pin, drain connecting pin, and gate connecting pin of the encapsulated stepped metal electrode layer.

Abstract: A method includes forming a set of through-vias in a substrate, the set of through-vias partially penetrating a thickness of the substrate. First connectors are formed over the set of through-vias on a first side of the substrate. The first side of the substrate is attached to a carrier. The substrate is thinned from the second side to expose the set of through-vias. Second connectors are formed over the set of through-vias on the second side of the substrate. A device die is bonded to the second connectors. The substrate is singulated into multiple packages.

Abstract: A semiconductor package includes a first semiconductor die, a second semiconductor die, a semiconductor bridge, an integrated passive device, a first redistribution layer, and connective terminals. The second semiconductor die is disposed beside the first semiconductor die. The semiconductor bridge electrically connects the first semiconductor die with the second semiconductor die. The integrated passive device is electrically connected to the first semiconductor die. The first redistribution layer is disposed over the semiconductor bridge. The connective terminals are disposed on the first redistribution layer, on an opposite side with respect to the semiconductor bridge. The first redistribution layer is interposed between the integrated passive device and the connective terminals.

Abstract: A connecting structure for a liquid container includes a receiving groove. The liquid container having a suction tube is disposed in the receiving groove. A top end of the receiving groove is engaged with a connecting base. A front side of the connecting base is pivotally connected to a locking assembly protruding frontwards. A liftable base being movable along a top-bottom direction and a front-rear direction is disposed in an inner side of the connecting base, and has a bottom frame engaging with a sleeve that is for being connected to and communicating with a liquid pipeline and fits around the suction tube. Two extending arms extending frontwards out of the bottom frame are pivotally connected to the locking assembly. A left side and a right side of the bottom frame are pivotally connected to two swinging arms that extend backwards and are pivotally connected to the connecting base.

Abstract: A method includes forming a set of through-vias in a substrate, the set of through-vias partially penetrating a thickness of the substrate. First connectors are formed over the set of through-vias on a first side of the substrate. The substrate is singulated to form dies. The first side of the dies are attached to a carrier. The dies are thinned from the second side to expose the set of through-vias. Second connectors are formed over the set of through-vias on the second side of the dies. A device die is bonded to the second connectors. The dies and device dies are singulated into multiple packages.

Abstract: The present disclosure provides a method for disease control of plants, comprising predicting the probability of a disease occurrence and suggesting a suitable and effective control measure for the identified pathogen and/or host. The present disclosure also provides an advisory service with recommended management actions and other alerts and notifications.

Abstract: A Luggage can be detachably assembled with a movable lining. The movable lining includes a plurality of positioning belts. The luggage includes two luggage bodies and a plurality of positioning pieces. Each of the luggage bodies includes an opening. The positioning pieces are provided on the opening of the two luggage bodies. The position of the positioning pieces correspond to that of the positioning belts. The positioning pieces are used to be assembled with the positioning belts, respectively, such that the movable lining is positioned and assembled with the luggage.

Abstract: A suitcase includes a main body, a removable compartment, at least one first main fastening unit, at least one second main fastening unit and a plurality of fastening rings. The main body includes a containing groove. The removable compartment is movably located in the containing groove, and the removable compartment includes a base layer, a covering layer, at least one hole and an inner opening unit. The covering layer covers the base layer. The at least one hole is located in the base layer. The inner opening unit is movably connected to the covering layer, and the inner opening unit is used for allowing the covering layer to be opened or closed; when the covering layer is opened, the base layer will be exposed to the outside. The at least one first main fastening unit is located in the containing groove.

Abstract: A suitcase includes a main body, a removable compartment, at least one first main fastening unit, at least one second main fastening unit and a plurality of fastening rings. The main body includes a containing groove. The removable compartment is movably located in the containing groove, and the removable compartment includes a base layer, a covering layer, at least one hole and an inner opening unit. The covering layer covers the base layer. The at least one hole is located in the base layer. The inner opening unit is movably connected to the covering layer, and the inner opening unit is used for allowing the covering layer to be opened or closed; when the covering layer is opened, the base layer will be exposed to the outside. The at least one first main fastening unit is located in the containing groove.

Abstract: A substrate structure is provided. The substrate structure includes a number of traces, a substrate core, a number of first metal tiles, a number of second metal tiles, a number of first electrically-functioning circuits, and a number of second electrically-functioning circuits. The substrate core has a first surface and a second surface opposite to the first surface. The traces, the first metal tiles, and the first electrically-functioning circuits are disposed on the first surface and add up to a first metal structure proportion, and the second metal tiles and the second electrically-functioning circuits are disposed on the second surface and add up to a second metal structure proportion. The difference between the first metal structure proportion and the second metal structure proportion is within 15%.

Abstract: A manufacturing method of a circuit board comprises the following steps. Firstly, provide a first core layer, a second core material layer, and a central dielectric material layer. Secondly, press the first core layer, the second core material layer, and the central dielectric material layer to form a composite circuit structure. Thirdly, removing a portion of the central dielectric material layer located at a periphery of a pre-removing area and a portion of the second core material layer located at the periphery of the pre-removing area. Finally, remove a portion of the central dielectric material layer located within the pre-removing area and a portion of the second core material layer located within the pre-removing area to form a central dielectric layer and a second core layer.

Abstract: A method, for fabricating a heat dissipation substrate, includes the steps of: providing a substrate, with the substrate including a metal layer, an insulation layer, and a first conductive layer, with the insulation layer positioned between the metal layer and the first conductive layer, and with the metal layer thicker than the first conductive layer; removing part of the metal layer for forming a metal bulk; providing an adhesive layer including an opening, with the opening corresponding to the metal bulk; providing a second conductive layer; laminating the second conductive layer, the adhesive layer and the substrate; forming a hole in the insulation layer and the first conductive layer, with the hole positioned under the metal bulk; and forming a third conductive layer in the hole.

Abstract: A manufacturing method of a circuit board is provided. Providing a substrate, where a first laser resistant structure is disposed on a first dielectric layer and at the periphery of a pre-removing area, a second dielectric layer covers the first laser resistant structure, a circuit layer is disposed on the second dielectric layer, a second laser resistant structure is disposed on the second dielectric layer and at the periphery of the pre-removing area, a third dielectric layer covers the circuit layer and the second laser resistant structure. There are gaps between the second laser resistant structure and the circuit layer, and the vertical projection of the gaps on the first dielectric layer overlaps the first laser resistant structure. A laser machining process is performed to etch the third dielectric layer at the periphery of the pre-removing area. The portion of the third dielectric layer within the pre-removing area is removed.

Abstract: A system and a computer-implemented methods for email management are disclosed. The method includes storing messages for electronic mail accounts provided by remote electronic mail server systems. The method further includes determining that the remote electronic mail server systems each have a different hostname than the others of the remote electronic mail server systems. The method further includes displaying messages from a first one of the electronic mail accounts and displaying a hostname of a first remote electronic mail server system providing the first one of the electronic mail accounts. The method further includes receiving a request to view messages from a second one of the electronic mail accounts. The method further includes displaying messages from the second one of the electronic mail accounts and displaying a hostname of a second remote electronic mail server system providing the second one of the electronic mail accounts.