Abstract: Processes for packing -memory cards includes a step of preparing a base circuit board; a step of disposing passing members on the base circuit; a step of installing chips on each of the passive members; a step of using a single mold to glue or mold the chips on the passive members so as to form a plurality of circuit areas; a step of cutting the circuit areas from the base circuit board to be circuit pieces, and a step of installing each of the circuit pieces into casings respectively to obtain memory cards. The processes require only a single mold so as to reduce the expense of the mold and is suitable for mass production.

Abstract: A memory card includes a base plate on which IC chips are connected and a housing is mounted to the base plate. The housing has at least one recess defined in an underside of the housing and sealed by a top which is in flush with the outside of the housing. At leas tone of the IC chips is accommodated in the recess.