Patents by Inventor Chen Feng

Chen Feng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10733748
    Abstract: An optical dimensioning system includes light emitting assemblies configured to project a predetermined pattern on an object. The optical dimensioning system further includes an imaging assembly configured to sense light scattered and/or reflected of the object, and to capture an image of the object while the pattern is projected. A processing assembly, in the optical dimensioning system, is configured to analyze the image of the object to determine one or more dimension parameters of the object.
    Type: Grant
    Filed: July 24, 2017
    Date of Patent: August 4, 2020
    Assignee: Hand Held Products, Inc.
    Inventors: Chen Feng, Tao Xian
  • Patent number: 10720788
    Abstract: Wireless charging devices, methods of manufacture thereof, and methods of charging electronic devices are disclosed. In some embodiments, a wireless charging device includes a controller, a molding material disposed around the controller, and an interconnect structure disposed over the molding material and coupled to the controller. The wireless charging device includes a wireless charging coil coupled to the controller. The wireless charging coil comprises a first portion disposed in the interconnect structure and a second portion disposed in the molding material. The wireless charging coil is adapted to provide an inductance to charge an electronic device.
    Type: Grant
    Filed: October 9, 2015
    Date of Patent: July 21, 2020
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chen-Hua Yu, Chita Chuang, Chen-Shien Chen, Ming Hung Tseng, Sen-Kuei Hsu, Yu-Feng Chen, Yen-Liang Lin
  • Patent number: 10719426
    Abstract: A system and method for utilizing metadata of a client computer in form of transactions and/or software operations (e.g., actions) in an enterprise system hosted by a host entity, such as in a cloud environment for testing the software operations is disclosed. The host entity stores metadata (e.g., response time, delay, processing time, usage) about the transactions in a database for the client computer system's actions. The host entity then uses the stored metadata to automatically generate a test script based on actual user interactions with the software operations of the enterprise resource planning system for specific data range and environment in order to test functionality of a plurality of software operations in the enterprise resource planning systems being operated by users of the client computers.
    Type: Grant
    Filed: March 29, 2018
    Date of Patent: July 21, 2020
    Assignee: Velocity Technology Solutions, Inc.
    Inventors: Travis Tuttle, John Waite, Ping-Haur Jen, Pritesh Gaikwad, Chen-Feng Yang
  • Publication number: 20200227782
    Abstract: The present disclosure provides a polymer solid electrolyte comprising a high molecular polymer and a lithiated carbon dot, wherein the lithiated carbon dot is obtained by lithiating a carbon dot with lithium hydroxide. The present application also provides a method for preparing a lithiated carbon dot and a method for preparing a polymer solid electrolyte. In the polymer solid electrolyte provided in the present application, the lithiated carbon dot is used as lithium salts, and the introduction of the lithiated carbon dot effectively reduces the crystal phase of the polymer matrix in the electrolyte, and significantly improves the electrochemical properties such as the ionic conductivity and ionic mobility of the polymer solid electrolyte.
    Type: Application
    Filed: May 1, 2019
    Publication date: July 16, 2020
    Inventors: Wei Feng, Zeyu Li, Yu Li, Chen Cao
  • Publication number: 20200227534
    Abstract: In a method of manufacturing a semiconductor device, a fin structure, in which first semiconductor layers and second semiconductor layers are alternately stacked, is formed. A sacrificial gate structure is formed over the fin structure. A source/drain region of the fin structure, which is not covered by the sacrificial gate structure, is etched, thereby forming a source/drain space. The first semiconductor layers are laterally etched through the source/drain space. An inner spacer made of a dielectric material is formed on an end of each of the etched first semiconductor layers. A source/drain epitaxial layer is formed in the source/drain space to cover the inner spacer. A lateral end of each of the first semiconductor layers has a V-shape cross section after the first semiconductor layers are laterally etched.
    Type: Application
    Filed: April 1, 2020
    Publication date: July 16, 2020
    Inventors: Kuo-Cheng CHIANG, Chen-Feng HSU, Chao-Ching CHENG, Tzu-Chiang CHEN, Tung Ying LEE, Wei-Sheng YUN, Yu-Lin YANG
  • Patent number: 10714592
    Abstract: In a method of manufacturing a semiconductor device, a fin structure, in which first semiconductor layers and second semiconductor layers are alternately stacked, is formed. A sacrificial gate structure is formed over the fin structure. A source/drain region of the fin structure, which is not covered by the sacrificial gate structure, is etched, thereby forming a source/drain space. The first semiconductor layers are laterally etched through the source/drain space. An inner spacer made of a dielectric material is formed on an end of each of the etched first semiconductor layers. A source/drain epitaxial layer is formed in the source/drain space to cover the inner spacer. A lateral end of each of the first semiconductor layers has a V-shape cross section after the first semiconductor layers are laterally etched.
    Type: Grant
    Filed: October 30, 2017
    Date of Patent: July 14, 2020
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chao-Ching Cheng, Chen-Feng Hsu, Tzu-Chiang Chen, Tung Ying Lee, Wei-Sheng Yun, Yu-Lin Yang
  • Publication number: 20200216707
    Abstract: An aqueous polymer composition comprising a multiethylenically unsaturated carboxylic acid monohydrazide and a keto-functionalized polymer, and an aqueous coating composition comprising such aqueous polymer composition and providing coatings with improved water resistance and alcohol resistance without compromising early block resistance.
    Type: Application
    Filed: September 25, 2017
    Publication date: July 9, 2020
    Applicants: Dow Global Technologies LLC, Rohm and Haas Company, Rohm and Haas Company
    Inventors: Chen Chen, Baoqing Zheng, Yawei Xu, Xiaohong Yang, Shaoguang Feng, Yujiang Wang, Brough Richey, Fengzhe Shi
  • Publication number: 20200210663
    Abstract: An aimer pattern projector assembly (200, 300) includes an LED light source (212, 312), an LED aperture plate (204, 304), and a projector lens (206, 306) disposed in front of and coaxial with the LED aperture plate (204, 304) and the LED light source (212, 312). The LED light source (212, 312), aperture plate (204, 304), and projector lens (206, 306) each have a central opening configured to accommodate and coaxially align with a line of sight of an imaging lens. The LED light source (212, 312) can include two or more LEDs operably coupled to a PCB. A coaxial aimer imager assembly (100) can include an imaging lens-sensor module (102) and the aimer pattern projector assembly. A method for scanning includes generating a combined aimer pattern coaxially aligned with a line of sight of an image of the object.
    Type: Application
    Filed: July 19, 2017
    Publication date: July 2, 2020
    Inventors: Chen FENG, Jie REN, Yunxin OUYANG
  • Patent number: 10700205
    Abstract: A method for forming a semiconductor structure includes receiving a substrate including a dielectric structure; forming a first recess in the substrate; forming a dielectric spacer over a sidewall of the first recess; forming a first semiconductor layer to fill the first recess; removing the dielectric structure to form a second recess over the substrate; and forming a second semiconductor layer to fill the second recess. The dielectric spacer is sandwiched between the first semiconductor layer and the second semiconductor layer.
    Type: Grant
    Filed: May 6, 2019
    Date of Patent: June 30, 2020
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Chao-Ching Cheng, Chen-Feng Hsu, Yu-Lin Yang, Jung-Piao Chiu, Tzu-Chiang Chen
  • Patent number: 10699653
    Abstract: A pixel circuit includes a first switch, a storage circuit, a second switch, and a liquid crystal capacitor. The first node of the first switch is configured to receive a data signal, and the second node of the first switch is coupled with a first node point. The storage circuit is coupled with the first node point, and configured to receive a common voltage. The first node of the second switch is coupled with the storage circuit, and the second node of the second switch is configured to receive a boost signal. The liquid crystal capacitor is coupled between the first node point and the storage circuit. In response to the first switch is conducted, the second switch is conducted, or in response to the second switch is conducted, the first switch is conducted.
    Type: Grant
    Filed: August 31, 2018
    Date of Patent: June 30, 2020
    Assignee: AU OPTRONICS CORPORATION
    Inventors: Dong-Hun Lim, Shu-Hao Huang, Chen-Feng Fan
  • Publication number: 20200193936
    Abstract: An electronic device using an under-display fingerprint identification technology and a waking method of the electronic device are provided. The electronic device includes a display panel, a central processing unit and a fingerprint sensing module. The electronic device executes an operating system. When the central processing unit and the operating system are in a power-saving mode, the fingerprint sensing module enters a default operation mode and the display panel enters an always-on display mode. Then, the fingerprint sensing module senses a specified region of the display panel to acquire a first image. If the content of the first image contains an image of a finger, the fingerprint sensing module issues an interrupt signal to the central processing unit. Consequently, the central processing unit is woken up from the power-saving mode and the operating system is woken up.
    Type: Application
    Filed: October 15, 2019
    Publication date: June 18, 2020
    Inventors: TONG-LONG FU, CHEN-CHIH FAN, CHUN-CHING TSENG, WEI-JUNG WANG, CHUN-FENG KAO, YUNG-FU CHEN
  • Patent number: 10685910
    Abstract: A method includes forming a plurality of dielectric layers, forming a plurality of redistribution lines in the plurality of dielectric layers, forming stacked vias in the plurality of dielectric layers with the stacked vias forming a continuous electrical connection penetrating through the plurality of dielectric layers, forming a dielectric layer over the stacked vias and the plurality of dielectric layers, forming a plurality of bond pads in the dielectric layer, and bonding a device die to the dielectric layer and a first portion of the plurality of bond pads through hybrid bonding.
    Type: Grant
    Filed: August 12, 2019
    Date of Patent: June 16, 2020
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chen-Hua Yu, Sung-Feng Yeh, Ming-Fa Chen, Hsien-Wei Chen
  • Publication number: 20200185330
    Abstract: A method of forming semiconductor structure includes attaching backsides of top dies to a front side of a bottom wafer, the bottom wafer comprising a plurality of bottom dies; forming first conductive pillars on the front side of the bottom wafer adjacent to the top dies; forming a first dielectric material on the front side of the bottom wafer around the top dies and around the first conductive pillars; and dicing the bottom wafer to form a plurality of structures, each of the plurality of structures comprising at least one of the top dies and at least one of the bottom dies.
    Type: Application
    Filed: April 1, 2019
    Publication date: June 11, 2020
    Inventors: Chen-Hua Yu, Tzuan-Horng Liu, Ming-Fa Chen, Chao-Wen Shih, Sung-Feng Yeh
  • Publication number: 20200171592
    Abstract: The present invention relates to an electrochemical machining method for manufacturing a cone. One or more conductive column and an electrode are driven to perform relative convolute motion. Then the conductive column is driven to perform electrochemical machining on the electrode for forming one or more hole in the electrode. Afterwards, the periphery of the hole in the electrode to perform electrochemical machining on the conductive column for forming a cone at one end of the conductive column.
    Type: Application
    Filed: December 4, 2018
    Publication date: June 4, 2020
    Inventors: ZHI-WEN FAN, DA-YU LIN, CHEN-HUI CHANG, CHUN-WEI CHEN, CHIU-FENG LIN
  • Publication number: 20200177260
    Abstract: A communication method applied to an communication device comprising M first type antenna following a first communication standard and N second type antennas following a second communication standard, M and N are positive integers. The communication method comprises: (a) measuring usage time of the second type antennas; and (b) controlling a number of the antennas that the communication device use according to the usage time of the second type antennas.
    Type: Application
    Filed: August 1, 2019
    Publication date: June 4, 2020
    Inventors: Tsai-Yuan Hsu, Chen-Feng Liu, Yuan-Chin Wen, Shun-Yong Huang
  • Patent number: 10672674
    Abstract: In an embodiment, a method includes: stacking a plurality of first dies to form a device stack; revealing testing pads of a topmost die of the device stack; testing the device stack using the testing pads of the topmost die; and after testing the device stack, forming bonding pads in the topmost die, the bonding pads being different from the testing pads.
    Type: Grant
    Filed: June 29, 2018
    Date of Patent: June 2, 2020
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chen-Hua Yu, Sung-Feng Yeh, Ming-Fa Chen, Hsien-Wei Chen, Hui-Wen Liu, Ching-Pin Yuan
  • Publication number: 20200166952
    Abstract: A coach apparatus and a cooperative operation controlling method for a coach-driven multi-robot cooperative operation system are provided. The coach apparatus connects with a plurality of action robots and receives state space data from each action robot. The coach apparatus divides the action robots into a plurality of action group. The coach apparatus reduces the state space data of the action robots in each action group to generate reduced state space data of each action group, and trains and builds a cooperative model based on the reduced state space data. In addition, for each action group, the coach apparatus selects a group strategy based on the reduced state space data, and transmits the cooperative model and the group strategy to the action robots in the action group to make them carry out an action mission according to the cooperative model and the group strategy.
    Type: Application
    Filed: December 11, 2018
    Publication date: May 28, 2020
    Inventors: Ping-Feng WANG, Jong-Yih KUO, Chen-Ti WANG
  • Patent number: 10665748
    Abstract: A light-emitting diode includes from bottom to up: a substrate, a first-conductive type semiconductor layer, a super lattice, a multi-quantum well layer and a second-conductive type semiconductor layer. At least one layer of granular medium layer is inserted in the super lattice. The granular medium layer is used for forming V pits with different widths and depths in the super lattice. The multi-quantum well layer fills up the V pits and is over the top surface of the super lattice. The number of micro-particle generations, positions and densities can be adjusted by introducing granular medium layers and controlling the number of layers, position and growth conditions during super lattice growth process, to ensure V pits of different depths and densities. This can change hole injection effect, effectively improve hole injection efficiency and distribution uniformity in all quantum wells, thus improving LED light-emitting efficiency.
    Type: Grant
    Filed: December 20, 2017
    Date of Patent: May 26, 2020
    Assignee: XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD.
    Inventors: Jie Zhang, Xiangxu Feng, Chengxiao Du, Jianming Liu, Chen-ke Hsu
  • Patent number: 10661408
    Abstract: A stopper includes a head portion sized and configured to be coupled to an upper platen of a chemical-mechanical planarization system and a stopper leg sized and configured to direct a flow of liquid slurry applied to an upper planar surface of the upper platen substantially away from a lower surface of the upper platen.
    Type: Grant
    Filed: January 29, 2018
    Date of Patent: May 26, 2020
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Yu-Feng Han, Cheng-Yi Huang, Fang-Chi Chien, Chen-shih Chung, Sheng-Tai Peng
  • Patent number: 10658556
    Abstract: An LED package structure includes a multilayer circuit board, an LED chip, and a cover. The multilayer circuit board has a conductive layer, a first resin layer disposed on the conductive layer, and a first circuit layer disposed on the first resin layer. The first resin layer has a first opening, and a portion of the conductive layer is partially exposed from the first resin layer via the first opening such that a mounting region is exposed. The first circuit layer has a second opening, and the second opening exposes the mounting region. The LED chip is fixed on the mounting region by passing it through the first and second openings, and the LED chip is connected to the first circuit layer by wires. The cover is disposed on the first resin layer and covers the LED chip and the first circuit layer.
    Type: Grant
    Filed: November 15, 2018
    Date of Patent: May 19, 2020
    Assignees: LITE-ON OPTO TECHNOLOGY (CHANGZHOU) CO., LTD., LITE-ON TECHNOLOGY CORPORATION
    Inventors: Chen-Hsiu Lin, Tsung-Kang Ying, Pin-Feng Hung