Abstract: An optical dimensioning system includes light emitting assemblies configured to project a predetermined pattern on an object. The optical dimensioning system further includes an imaging assembly configured to sense light scattered and/or reflected of the object, and to capture an image of the object while the pattern is projected. A processing assembly, in the optical dimensioning system, is configured to analyze the image of the object to determine one or more dimension parameters of the object.

Abstract: Wireless charging devices, methods of manufacture thereof, and methods of charging electronic devices are disclosed. In some embodiments, a wireless charging device includes a controller, a molding material disposed around the controller, and an interconnect structure disposed over the molding material and coupled to the controller. The wireless charging device includes a wireless charging coil coupled to the controller. The wireless charging coil comprises a first portion disposed in the interconnect structure and a second portion disposed in the molding material. The wireless charging coil is adapted to provide an inductance to charge an electronic device.

Abstract: A system and method for utilizing metadata of a client computer in form of transactions and/or software operations (e.g., actions) in an enterprise system hosted by a host entity, such as in a cloud environment for testing the software operations is disclosed. The host entity stores metadata (e.g., response time, delay, processing time, usage) about the transactions in a database for the client computer system's actions. The host entity then uses the stored metadata to automatically generate a test script based on actual user interactions with the software operations of the enterprise resource planning system for specific data range and environment in order to test functionality of a plurality of software operations in the enterprise resource planning systems being operated by users of the client computers.

Abstract: The present disclosure provides a polymer solid electrolyte comprising a high molecular polymer and a lithiated carbon dot, wherein the lithiated carbon dot is obtained by lithiating a carbon dot with lithium hydroxide. The present application also provides a method for preparing a lithiated carbon dot and a method for preparing a polymer solid electrolyte. In the polymer solid electrolyte provided in the present application, the lithiated carbon dot is used as lithium salts, and the introduction of the lithiated carbon dot effectively reduces the crystal phase of the polymer matrix in the electrolyte, and significantly improves the electrochemical properties such as the ionic conductivity and ionic mobility of the polymer solid electrolyte.

Abstract: In a method of manufacturing a semiconductor device, a fin structure, in which first semiconductor layers and second semiconductor layers are alternately stacked, is formed. A sacrificial gate structure is formed over the fin structure. A source/drain region of the fin structure, which is not covered by the sacrificial gate structure, is etched, thereby forming a source/drain space. The first semiconductor layers are laterally etched through the source/drain space. An inner spacer made of a dielectric material is formed on an end of each of the etched first semiconductor layers. A source/drain epitaxial layer is formed in the source/drain space to cover the inner spacer. A lateral end of each of the first semiconductor layers has a V-shape cross section after the first semiconductor layers are laterally etched.

Abstract: In a method of manufacturing a semiconductor device, a fin structure, in which first semiconductor layers and second semiconductor layers are alternately stacked, is formed. A sacrificial gate structure is formed over the fin structure. A source/drain region of the fin structure, which is not covered by the sacrificial gate structure, is etched, thereby forming a source/drain space. The first semiconductor layers are laterally etched through the source/drain space. An inner spacer made of a dielectric material is formed on an end of each of the etched first semiconductor layers. A source/drain epitaxial layer is formed in the source/drain space to cover the inner spacer. A lateral end of each of the first semiconductor layers has a V-shape cross section after the first semiconductor layers are laterally etched.

Abstract: An aqueous polymer composition comprising a multiethylenically unsaturated carboxylic acid monohydrazide and a keto-functionalized polymer, and an aqueous coating composition comprising such aqueous polymer composition and providing coatings with improved water resistance and alcohol resistance without compromising early block resistance.

Abstract: An aimer pattern projector assembly (200, 300) includes an LED light source (212, 312), an LED aperture plate (204, 304), and a projector lens (206, 306) disposed in front of and coaxial with the LED aperture plate (204, 304) and the LED light source (212, 312). The LED light source (212, 312), aperture plate (204, 304), and projector lens (206, 306) each have a central opening configured to accommodate and coaxially align with a line of sight of an imaging lens. The LED light source (212, 312) can include two or more LEDs operably coupled to a PCB. A coaxial aimer imager assembly (100) can include an imaging lens-sensor module (102) and the aimer pattern projector assembly. A method for scanning includes generating a combined aimer pattern coaxially aligned with a line of sight of an image of the object.

Abstract: A method for forming a semiconductor structure includes receiving a substrate including a dielectric structure; forming a first recess in the substrate; forming a dielectric spacer over a sidewall of the first recess; forming a first semiconductor layer to fill the first recess; removing the dielectric structure to form a second recess over the substrate; and forming a second semiconductor layer to fill the second recess. The dielectric spacer is sandwiched between the first semiconductor layer and the second semiconductor layer.

Abstract: A pixel circuit includes a first switch, a storage circuit, a second switch, and a liquid crystal capacitor. The first node of the first switch is configured to receive a data signal, and the second node of the first switch is coupled with a first node point. The storage circuit is coupled with the first node point, and configured to receive a common voltage. The first node of the second switch is coupled with the storage circuit, and the second node of the second switch is configured to receive a boost signal. The liquid crystal capacitor is coupled between the first node point and the storage circuit. In response to the first switch is conducted, the second switch is conducted, or in response to the second switch is conducted, the first switch is conducted.

Abstract: An electronic device using an under-display fingerprint identification technology and a waking method of the electronic device are provided. The electronic device includes a display panel, a central processing unit and a fingerprint sensing module. The electronic device executes an operating system. When the central processing unit and the operating system are in a power-saving mode, the fingerprint sensing module enters a default operation mode and the display panel enters an always-on display mode. Then, the fingerprint sensing module senses a specified region of the display panel to acquire a first image. If the content of the first image contains an image of a finger, the fingerprint sensing module issues an interrupt signal to the central processing unit. Consequently, the central processing unit is woken up from the power-saving mode and the operating system is woken up.

Abstract: A method includes forming a plurality of dielectric layers, forming a plurality of redistribution lines in the plurality of dielectric layers, forming stacked vias in the plurality of dielectric layers with the stacked vias forming a continuous electrical connection penetrating through the plurality of dielectric layers, forming a dielectric layer over the stacked vias and the plurality of dielectric layers, forming a plurality of bond pads in the dielectric layer, and bonding a device die to the dielectric layer and a first portion of the plurality of bond pads through hybrid bonding.

Abstract: A method of forming semiconductor structure includes attaching backsides of top dies to a front side of a bottom wafer, the bottom wafer comprising a plurality of bottom dies; forming first conductive pillars on the front side of the bottom wafer adjacent to the top dies; forming a first dielectric material on the front side of the bottom wafer around the top dies and around the first conductive pillars; and dicing the bottom wafer to form a plurality of structures, each of the plurality of structures comprising at least one of the top dies and at least one of the bottom dies.

Abstract: The present invention relates to an electrochemical machining method for manufacturing a cone. One or more conductive column and an electrode are driven to perform relative convolute motion. Then the conductive column is driven to perform electrochemical machining on the electrode for forming one or more hole in the electrode. Afterwards, the periphery of the hole in the electrode to perform electrochemical machining on the conductive column for forming a cone at one end of the conductive column.

Abstract: A communication method applied to an communication device comprising M first type antenna following a first communication standard and N second type antennas following a second communication standard, M and N are positive integers. The communication method comprises: (a) measuring usage time of the second type antennas; and (b) controlling a number of the antennas that the communication device use according to the usage time of the second type antennas.

Abstract: In an embodiment, a method includes: stacking a plurality of first dies to form a device stack; revealing testing pads of a topmost die of the device stack; testing the device stack using the testing pads of the topmost die; and after testing the device stack, forming bonding pads in the topmost die, the bonding pads being different from the testing pads.

Abstract: A coach apparatus and a cooperative operation controlling method for a coach-driven multi-robot cooperative operation system are provided. The coach apparatus connects with a plurality of action robots and receives state space data from each action robot. The coach apparatus divides the action robots into a plurality of action group. The coach apparatus reduces the state space data of the action robots in each action group to generate reduced state space data of each action group, and trains and builds a cooperative model based on the reduced state space data. In addition, for each action group, the coach apparatus selects a group strategy based on the reduced state space data, and transmits the cooperative model and the group strategy to the action robots in the action group to make them carry out an action mission according to the cooperative model and the group strategy.

Abstract: A light-emitting diode includes from bottom to up: a substrate, a first-conductive type semiconductor layer, a super lattice, a multi-quantum well layer and a second-conductive type semiconductor layer. At least one layer of granular medium layer is inserted in the super lattice. The granular medium layer is used for forming V pits with different widths and depths in the super lattice. The multi-quantum well layer fills up the V pits and is over the top surface of the super lattice. The number of micro-particle generations, positions and densities can be adjusted by introducing granular medium layers and controlling the number of layers, position and growth conditions during super lattice growth process, to ensure V pits of different depths and densities. This can change hole injection effect, effectively improve hole injection efficiency and distribution uniformity in all quantum wells, thus improving LED light-emitting efficiency.

Abstract: A stopper includes a head portion sized and configured to be coupled to an upper platen of a chemical-mechanical planarization system and a stopper leg sized and configured to direct a flow of liquid slurry applied to an upper planar surface of the upper platen substantially away from a lower surface of the upper platen.

Abstract: An LED package structure includes a multilayer circuit board, an LED chip, and a cover. The multilayer circuit board has a conductive layer, a first resin layer disposed on the conductive layer, and a first circuit layer disposed on the first resin layer. The first resin layer has a first opening, and a portion of the conductive layer is partially exposed from the first resin layer via the first opening such that a mounting region is exposed. The first circuit layer has a second opening, and the second opening exposes the mounting region. The LED chip is fixed on the mounting region by passing it through the first and second openings, and the LED chip is connected to the first circuit layer by wires. The cover is disposed on the first resin layer and covers the LED chip and the first circuit layer.