Abstract: A method includes putting a first package component into contact with a second package component. The first package component comprises a first dielectric layer including a first dielectric material, and the first dielectric material is a silicon-oxide-based dielectric material. The second package component includes a second dielectric layer including a second dielectric material different from the first dielectric material. The second dielectric material comprises silicon and an element selected from the group consisting of carbon, nitrogen, and combinations thereof. An annealing process is performed to bond the first dielectric layer to the second dielectric layer.

Abstract: In a general aspect, parametric amplification is performed in a quantum computing system. In some cases, a traveling wave parametric amplifier (TWPA) includes a plurality of Josephson junctions connected in series. The plurality of Josephson junctions includes a first Josephson junction, which includes a first superconducting electrode on a surface of a substrate, a second superconducting electrode that overlaps the first superconducting electrode, and a barrier sandwiched between overlapping sections of the first and second superconducting electrodes. The barrier defines a footprint with a tapered shape over the surface of the substrate.

Abstract: A method for operating a conveying system is provided. An overhead hoist transport (OHT) vehicle is provided, wherein the OHT vehicle includes a gripping member configured to grip and hold a carrier, and a receiver configured to receive a signal. The signal is transmitted to the receiver of the OHT vehicle. The OHT vehicle is moved toward the carrier, and the carrier is gripped by the gripping member of the OHT vehicle. A lifting force is determined based on a weight of a carrier, a number of workpieces in the carrier, or a vertical distance between the OHT vehicle and the carrier, and the lifting force is applied to the carrier.

Abstract: Methods, apparatuses, and systems associated with a sample testing device are provided.

Abstract: Disclosed are a special fertilizer for intercropping maize and peanuts and a cultivation method for maintaining soil organic carbon (SOC) balance, belonging to the technical field of SOC balance. The special fertilizer for intercropping maize and peanuts includes the following raw materials: coated urea, heavy superphosphate, ammonium sulfate, fermented soybean meal, bentonite, sodium molybdate, borax, humic acid, ammonium dihydrogen phosphate, plant ash and zinc sulfate heptahydrate. The cultivation method includes the steps of land selection, land preparation, fertilizing, sowing, field management, and rotation.

Abstract: A method, computer system, and computer program product for data monitoring management are provided. A first invalid zero value candidate from a data stream is received. A memory location for the first invalid zero value candidate is received. At a first time an access connection to the memory location is established. At a second time subsequent to the first time the access connection to the memory location is checked. Based on the checking, a determination is made whether the first invalid zero value candidate contains an invalid zero value.

Abstract: Embodiments of the present disclosure include near co-axial polarized illuminator apparatuses and uses thereof. The near co-axial polarized illuminator is internally positionable in near co-axial alignment with one or more imager(s) utilized to capture a representation of a field of view illuminated by the near co-axial polarized illuminator. Embodiments include small form factor reader(s) that utilize a near co-axial polarized illuminator to improve illumination of a field of view captured via multiple imagers for detecting and/or decoding machine-readable symbologies, such as barcodes. Some embodiments include a DPM channel image sensor, a standard range channel image sensor, a near co-axial polarizer light source positioned adjacent to the DPM channel image sensor and adjacent to the standard range channel image sensor, a near co-axial polarizer aligned with the near co-axial polarizer light source, and an analyzer aligned with the DPM channel image sensor and/or the standard range channel image sensor.

Abstract: A memory device includes a substrate, a bottom electrode disposed over the substrate, a top electrode disposed over the bottom electrode, and a phase change layer disposed between the top electrode and bottom electrode. The phase change layer includes a GeSbTe material that contains a Ge content of about 20 at % or less, a Sb content of about 30 at % or more, and a Te content of about 40 at % at or more.

Abstract: The present disclosure provides a multi-state one-time programmable (MSOTP) memory circuit including a memory cell and a programming voltage driving circuit. The memory cell includes a MOS storage transistor, a first MOS access transistor and a second MOS access transistor electrically connected to store two bits of data. When the memory cell is in a writing state, the programming voltage driving circuit outputs a writing control potential to the gate of the MOS storage transistor, and when the memory cell is in a reading state, the programming voltage driving circuit outputs a reading control potential to the gate of the MOS storage transistor.

Abstract: A method for fabricating light emitting diode (LED) dice includes the steps of: providing a substrate, and forming a plurality of die sized semiconductor structures on the substrate. The method also includes the steps of providing a receiving plate having an elastomeric polymer layer, placing the substrate and the receiving plate in physical contact with an adhesive force applied by the elastomeric polymer layer, and performing a laser lift-off (LLO) process by directing a uniform laser beam through the substrate to the semiconductor layer at an interface with the substrate to lift off the semiconductor structures onto the elastomeric polymer layer. During the laser lift-off (LLO) process the elastomeric polymer layer functions as a shock absorber to reduce momentum transfer, and as an adhesive surface to hold the semiconductor structures in place on the receiving plate.

Abstract: Systems and methods provide reception of a call to a first function, determination of a first configuration file associated with the first function, the first configuration file indicating a primary function, a secondary function and a relationship between a first property of the primary function and a second property of the secondary function, calling of the primary function and reception of a corresponding first result set, calling of the secondary function, the call to the secondary function including a filter on the second property based on values of the first result set associated with the first property, reception of a second result set corresponding to the call to the secondary function, generation of a composed result set based on the first result set, the second result set, and the relationship, and return of the composed result set in response to the call to the first function.

Abstract: A single piece light pipe is designed to provide dual-field, multi-color, multi-directional illumination. The light pipe is combined with a single PCB having a plurality of LEDs to create a compact illuminator that can selectively provide dark field and bright field with red, green, blue color, broad spectrum, or combination of any color in horizontal, vertical, diagonal, or combination of any direction. The single piece light pipe is compact in size and light in weight. The non-closed form option not only can further reduce the weight but also can allow arrange opening area clearance for: (1) visual aiming and alignment in application, especially for hand held application; (2) reducing illumination crosstalk to unwanted directions; and for (3) mechanical integration. The improvements allow the illuminator to read direct product marking (DPM) type of barcodes.

Abstract: The invention provides a method for detecting the back surface of a wafer, which comprises providing a wafer and performing a detection step on the back surface of the wafer, wherein the detection step comprises capturing a gray scale map of the back surface of the wafer, finding out at least one defect of the back surface of the wafer according to a deviation of the gray scale map, and transmitting the data of the at least one defect back to a system, and the system performs a judgment step according to the data of the at least one defect.

Abstract: A memory device includes a substrate, a bottom electrode disposed over the substrate, a memory layer disposed over the bottom electrode, a selector layer disposed over the memory layer, and a top electrode disposed over the selector layer. The selector layer is an oxygen-doped chalcogenide based film, and an oxygen content of the selector layer is about 10 at % or less.

Abstract: A pixel circuit including a switching circuit, a storage circuit, a driving circuit, and a pull-down circuit is disclosed. The switching circuit is configured for providing first and second power signals to the storage circuit according to a first gate-driving signal. The storage circuit is configured for providing a corresponding one of first and second data signals to a first node in response to one of the first and second power signals. The driving circuit is configured for writing the voltage signal of the first node into the pixel electrode according to a second gate-driving signal. The circuit structure of the pixel circuit of the present disclosure is relatively simplified. The number of transistors used is less, such that the occupied area is small, thereby facilitating realization of a high-resolution display device.

Abstract: A wireless communication includes a control circuit and a receiver (RX) circuit. The control circuit obtains indicator information from another wireless communication system, identifies a transmitter (TX) and receiver (RX) packet delivery scenario as one of a packet overlapping scenario and a packet non-overlapping scenario according to the indicator information, and generates RX gain control information in response to the TX and RX packet delivery scenario. The RX circuit refers to the RX gain control information to set an RX gain used for receiving data.

Abstract: A voltage converter having a voltage input and a voltage output, the voltage converter including a first and second transistors and an average current control circuit. The first transistor has a first control input, a first current terminal, and a second current terminal. The first current terminal is adapted to be coupled to a switch node. The second transistor has a second control input, a third current terminal, and a fourth current terminal. The third current terminal is adapted to be coupled to an inductor. The average current control circuit is coupled to the third current terminal and the fourth current terminal. The average current control circuit is configured to determine an average current level of current flowing through the second transistor and to control a voltage on the first control input of the first terminal based on the determined average current level.

Abstract: Apparatuses, systems, and methods for providing a one sensor near far solution to minimize field of view mismatch and aiming offsets are provided. For example, an indicia reader utilizing dual optics may include an engine comprising a near field imaging optic and a far field imaging optic that split an imaging sensor array and a aimer; wherein the near field imaging optic, the far field imaging optic, and the aimer are configured in a triangular arrangement to minimize the field of mismatch and aiming offsets. In some embodiments, the far field imaging optic may be configured to utilize a two or more mirrors to provide a periscope configuration.

Abstract: Embodiments of the present disclosure provide for improved projecting of aimer illumination utilizing an off-axis aimer alignment. Some embodiments reduce the negative impact of light reflectivity on components of an apparatus from an aimer illumination while simultaneously enhancing the intensity level of the aimer illumination at greater ranges from a target object. One example embodiment includes an integrated molded off-axis aimer lens including a light focusing lens having an input face and an output face, an axis redirecting lens having an angled front surface, where the axis redirecting lens is oriented along a first axis, where the axis redirecting lens is aligned with the output face of the light focusing lens, and an aimer light source aligned with the input face of the light focusing lens, where the aimer light source is oriented along a second axis that differs from the first axis.

Abstract: A fin structure is on a substrate. The fin structure includes an epitaxial region having an upper surface and an under-surface. A contact structure on the epitaxial region includes an upper contact portion and a lower contact portion. The upper contact portion includes a metal layer over the upper surface and a barrier layer over the metal layer. The lower contact portion includes a metal-insulator-semiconductor (MIS) contact along the under-surface. The MIS contact includes a dielectric layer on the under-surface and the barrier layer on the dielectric layer.