Abstract: Disclosed is a semiconductor package including an encapsulant having a top surface and a bottom surface opposite to the top surface; a semiconductor chip embedded in the encapsulant having an active surface, an inactive surface opposite to the active surface, and lateral surfaces interconnecting the active surface and the inactive surface, wherein the active surface protrudes from the bottom surface of the encapsulant and the semiconductor chip further has a plurality of electrode pads disposed on the active surface; a positioning member layer formed on a portion of the bottom surface of the encapsulant, covering the lateral surfaces of the semiconductor chip that protrude therefrom, and exposing the active surface; and a build-up trace structure disposed on the active surface of the semiconductor chip and the positioning member layer formed on the bottom surface of the encapsulant. The present invention also provides a method of fabricating a semiconductor package.

Abstract: A fabrication method of a package structure having MEMS elements includes: disposing a plate on top of a wafer having MEMS elements and second alignment keys; cutting the plate to form therein a plurality of openings exposing the second alignment keys; performing a wire bonding process and disposing block bodies corresponding to the second alignment keys, respectively; forming an encapsulant and partially removing the encapsulant and the block bodies from the top of the encapsulant; and aligning through the second alignment keys so as to form on the encapsulant a plurality of metal traces. The present invention eliminates the need to form through holes in a silicon substrate as in the prior art so as to reduce the fabrication costs. Further, since the plate only covers the MEMS elements and the encapsulant is partially removed, the overall thickness and size of the package structure are reduced.

Abstract: A package structure having MEMS elements includes: a wafer having MEMS elements, electrical contacts and second alignment keys; a plate disposed over the MEMS elements and packaged airtight; transparent bodies disposed over the second alignment keys via an adhesive; an encapsulant disposed on the wafer to encapsulate the plate, the electrical contacts and the transparent bodies; bonding wires embedded in the encapsulant and each having one end connecting a corresponding one of the electrical contacts and the other end exposed from a top surface of the encapsulant; and metal traces disposed on the encapsulant and electrically connected to the electrical contacts via the bonding wires. The present invention eliminates the need to form through holes in a silicon substrate as in the prior art so as to reduce fabrication costs. Further, the present invention accomplishes wiring processes by using a common alignment device to thereby reduce equipment costs.

Abstract: A fabrication method of a package structure having MEMS elements includes: disposing a plate on top of a wafer having MEMS elements and second alignment keys; cutting the plate to form therein a plurality of openings exposing the second alignment keys; performing a wire bonding process and disposing block bodies corresponding to the second alignment keys, respectively; forming an encapsulant and partially removing the encapsulant and the block bodies from the top of the encapsulant; and aligning through the second alignment keys so as to form on the encapsulant a plurality of metal traces. The present invention eliminates the need to form through holes in a silicon substrate as in the prior art so as to reduce the fabrication costs. Further, since the plate only covers the MEMS elements and the encapsulant is partially removed, the overall thickness and size of the package structure are reduced.

Abstract: A package structure having MEMS elements includes: a wafer having MEMS elements, electrical contacts and second alignment keys; a plate disposed over the MEMS elements and packaged airtight; transparent bodies disposed over the second alignment keys via an adhesive; an encapsulant disposed on the wafer to encapsulate the plate, the electrical contacts and the transparent bodies; bonding wires embedded in the encapsulant and each having one end connecting a corresponding one of the electrical contacts and the other end exposed from a top surface of the encapsulant; and metal traces disposed on the encapsulant and electrically connected to the electrical contacts via the bonding wires. The present invention eliminates the need to form through holes in a silicon substrate as in the prior art so as to reduce fabrication costs. Further, the present invention accomplishes wiring processes by using a common alignment device to thereby reduce equipment costs.

Abstract: A feeding device is installed on a machine and is utilized to convey a workpiece to be machined. The feeding device includes first and second feeding apparatus and in conveying the workpiece the workpiece has two lateral sides engaged by the first and second feeding apparatuses respectively. A clamping device is installed on the machine and is utilized to hold the moving workpiece. The clamping device includes first clamping mechanism including first and second clamping apparatuses and a second clamping mechanism including a third clamping apparatus, with the first and second clamping device holding the lateral sides of the workpiece and with the third clamping apparatus holding the top side of the workpiece.

Abstract: A feeding device is installed on a machine and is utilized to convey a workpiece to be machined. The feeding device includes first and second feeding apparatus and in conveying the workpiece the workpiece has two lateral sides engaged by the first and second feeding apparatuses respectively. A clamping device is installed on the machine and is utilized to hold the moving workpiece. The clamping device includes first clamping mechanism including first and second clamping apparatuses and a second clamping mechanism including a third clamping apparatus, with the first and second clamping device holding the lateral sides of the workpiece and with the third clamping apparatus holding the top side of the workpiece.