Patents by Inventor Chen-Hsin Huang
Chen-Hsin Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230129823Abstract: A driving mechanism is provided, including a fixed part, a movable part, and a driving assembly. The movable part is movably connected to the fixed part for holding an optical element, wherein the optical element defines an optical axis. The driving assembly is configured to drive the movable part to move relative to the fixed part.Type: ApplicationFiled: October 24, 2022Publication date: April 27, 2023Inventors: Guan-Bo WANG, Yi-Chi HSIEH, Chen-Hsin HUANG, Kai-Po FAN, Sheng-Chang LIN
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Patent number: 11630282Abstract: An optical element driving mechanism includes a fixed portion, a movable portion, a driving assembly, and a circuit assembly. The movable portion is connected to the optical element and is movable relative to the fixed portion. The driving assembly drives the movable portion to move relative to the fixed portion. The circuit assembly is connected to the driving assembly. The driving assembly is electrically connected to an external circuit via the circuit assembly.Type: GrantFiled: October 23, 2020Date of Patent: April 18, 2023Assignee: TDK TAIWAN CORP.Inventors: Yi-Ho Chen, Chen-Hsin Huang, Chao-Chang Hu, Chen-Chi Kuo, Ying-Jen Wang, Ya-Hsiu Wu, Sin-Jhong Song, Che-Hsiang Chiu, Kuen-Wang Tsai, Mao-Kuo Hsu, Tun-Ping Hsueh, I-Hung Chen, Chun-Chia Liao, Wei-Zhong Luo, Wen-Chang Lin
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Patent number: 11619800Abstract: An optical element driving mechanism is provided and includes a fixed assembly, a movable assembly, a driving assembly and a circuit assembly. The movable assembly is configured to connect an optical element, the movable assembly is movable relative to the fixed assembly, and the optical element has an optical axis. The driving assembly is configured to drive the movable assembly to move relative to the fixed assembly. The circuit assembly includes a plurality of circuits and is affixed to the fixed assembly.Type: GrantFiled: October 9, 2020Date of Patent: April 4, 2023Assignee: TDK TAIWAN CORP.Inventors: Sin-Hong Lin, Yung-Ping Yang, Wen-Yen Huang, Yu-Cheng Lin, Kun-Shih Lin, Chao-Chang Hu, Yung-Hsien Yeh, Mao-Kuo Hsu, Chih-Wei Weng, Ching-Chieh Huang, Chih-Shiang Wu, Chun-Chia Liao, Chia-Yu Chang, Hung-Ping Chen, Wei-Zhong Luo, Wen-Chang Lin, Shou-Jen Liu, Shao-Chung Chang, Chen-Hsin Huang, Meng-Ting Lin, Yen-Cheng Chen, I-Mei Huang, Yun-Fei Wang, Wei-Jhe Shen
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Publication number: 20220146781Abstract: An optical component driving mechanism is provided, including a holder, a fixed portion, a driving assembly, and a first circuit assembly. The holder is used to connect the optical component. The holder is movable relative to the fixed portion. The driving assembly is used to drive the holder to move relative to the fixed portion. The first circuit assembly is fixedly disposed on the holder. The first circuit assembly is electrically connected to the driving assembly.Type: ApplicationFiled: November 9, 2021Publication date: May 12, 2022Inventors: Guan-Bo WANG, Shao-Chung CHANG, Chen-Hsin HUANG, Liang-Ting HO, Chih-Wen CHIANG, Kai-Po FAN
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Publication number: 20220132002Abstract: An optical mechanism is provided. The optical mechanism includes an immovable part, a movable part, and a drive assembly. The movable part is connected to an optical element. The movable part is movable relative to the immovable part. The drive assembly drives the movable part to move relative to the immovable part. The immovable part includes a frame. The frame includes a receiving space receiving the movable part.Type: ApplicationFiled: October 22, 2021Publication date: April 28, 2022Inventors: Chen-Hsin Huang, Yi-Ho Chen, Shou-Jen Liu, Chen-Yu Yu
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Publication number: 20220132003Abstract: An optical mechanism is provided. The optical mechanism includes an immovable part, a movable part, a drive assembly, and a guidance assembly. The movable part is connected to an optical element. The movable part is movable relative to the immovable part. The drive assembly drives the movable part to move relative to the immovable part. The guidance assembly guides the movable part to move along a first axis.Type: ApplicationFiled: October 22, 2021Publication date: April 28, 2022Inventors: Chen-Hsin Huang, Yi-Ho Chen, Ya-Hsiu Wu, Shou-Jen Liu
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Patent number: 11300755Abstract: A driving mechanism for driving an optical element to move is provided, including a movable part, a fixed part, a housing connected to the fixed part, and a buffer member. The movable part is configured to hold the optical element. The fixed part is connected to the movable part, wherein the movable part is movable relative to the fixed part. The housing has a top cover and at least a sidewall connected to the top cover. The buffer member is disposed on the housing and extends from the top cover to the sidewall.Type: GrantFiled: May 15, 2020Date of Patent: April 12, 2022Assignee: TDK TAIWAN CORP.Inventors: Chen-Hsin Huang, Shao-Chung Chang, Shou-Jen Liu, Chen-Chi Kuo
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Publication number: 20220082785Abstract: An optical driving mechanism is provided, including a movable portion, a fixed portion, a driving component and a first stopper component. The movable portion is configured to connect an optical element. The movable portion is movable relative to the fixed portion. The driving component is configured to drive the movable portion to move relative to the fixed portion. The first stopper component is configured to limit the range of movement of the movable portion relative to the fixed portion.Type: ApplicationFiled: September 15, 2021Publication date: March 17, 2022Inventors: Shou-Jen LIU, Man-Ting LU, Chen-Yu YU, Chen-Hsin HUANG, Yi-Chieh LIN
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Publication number: 20210124144Abstract: An optical element driving mechanism includes a fixed portion, a movable portion, a driving assembly, and a circuit assembly. The movable portion is connected to the optical element and is movable relative to the fixed portion. The driving assembly drives the movable portion to move relative to the fixed portion. The circuit assembly is connected to the driving assembly. The driving assembly is electrically connected to an external circuit via the circuit assembly.Type: ApplicationFiled: October 23, 2020Publication date: April 29, 2021Inventors: Yi-Ho CHEN, Chen-Hsin HUANG, Chao-Chang HU, Chen-Chi KUO, Ying-Jen WANG, Ya-Hsiu WU, Sin-Jhong SONG, Che-Hsiang CHIU, Kuen-Wang TSAI, Mao-Kuo HSU, Tun-Ping HSUEH, I-Hung CHEN, Chun-Chia LIAO, Wei-Zhong LUO, Wen-Chang LIN
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Publication number: 20210109314Abstract: An optical element driving mechanism is provided and includes a fixed assembly, a movable assembly, a driving assembly and a circuit assembly. The movable assembly is configured to connect an optical element, the movable assembly is movable relative to the fixed assembly, and the optical element has an optical axis. The driving assembly is configured to drive the movable assembly to move relative to the fixed assembly. The circuit assembly includes a plurality of circuits and is affixed to the fixed assembly.Type: ApplicationFiled: October 9, 2020Publication date: April 15, 2021Inventors: Sin-Hong LIN, Yung-Ping YANG, Wen-Yen HUANG, Yu-Cheng LIN, Kun-Shih LIN, Chao-Chang HU, Yung-Hsien YEH, Mao-Kuo HSU, Chih-Wei WENG, Ching-Chieh HUANG, Chih-Shiang WU, Chun-Chia LIAO, Chia-Yu CHANG, Hung-Ping CHEN, Wei-Zhong LUO, Wen-Chang LIN, Shou-Jen LIU, Shao-Chung CHANG, Chen-Hsin HUANG, Meng-Ting LIN, Yen-Cheng CHEN, I-Mei HUANG, Yun-Fei WANG, Wei-Jhe SHEN
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Publication number: 20200363606Abstract: A driving mechanism for driving an optical element to move is provided, including a movable part, a fixed part, a housing connected to the fixed part, and a buffer member. The movable part is configured to hold the optical element. The fixed part is connected to the movable part, wherein the movable part is movable relative to the fixed part. The housing has a top cover and at least a sidewall connected to the top cover. The buffer member is disposed on the housing and extends from the top cover to the sidewall.Type: ApplicationFiled: May 15, 2020Publication date: November 19, 2020Inventors: Chen-Hsin HUANG, Shao-Chung CHANG, Shou-Jen LIU, Chen-Chi KUO
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Publication number: 20200333555Abstract: An optical system is provided and includes a fixed assembly, an optical module, a first movable assembly and a first driving assembly. The optical module has an optical axis. The first movable assembly is configured to be connected to the optical module. The first driving assembly is configured to drive the first movable assembly to move relative to the fixed assembly, and a gap is formed between the first movable assembly and the fixed assembly.Type: ApplicationFiled: April 17, 2020Publication date: October 22, 2020Inventors: Fu-Yuan WU, Yu-Shan CHOU, Chen-Hsin HUANG
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Publication number: 20180086952Abstract: An adhesive composition is provided. The adhesive composition includes a mixture (A), wherein the mixture (A) includes a first component (a), a cross-linking agent (b), and a second component (c), wherein the second component (c) includes a calcium-containing complex compound or a calcium-containing compound. Based on the total weight of the mixture (A), a content of the first component (a) is from 40 to 80 wt %, a content of the cross-linking agent (b) is from 20 to 60 wt %, and a content of the second component (c) is from 1 to 20 wt %. Specifically, the calcium-containing complex compound is selected from the group consisting of a compound represented by formula (1), a compound represented by formula (2), a compound represented by formula (3), and a compound represent by formula (4), and the calcium-containing compound is selected from the group consisting of a compound represented by formula (5) and a compound represent by formula (6).Type: ApplicationFiled: November 22, 2016Publication date: March 29, 2018Applicant: TAIFLEX Scientific Co., Ltd.Inventors: I-Ling Teng, Tzu-Ching Hung, Chiao-Pei Chen, Yu-Hsien Lee, Tsung-Tai Hung, Bo-Sheng Wang, Cheng-Yen Hsiao, Chen-Hsin Huang
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Publication number: 20150194553Abstract: A thermally conductive encapsulate comprising a thermally conductive composite layer having a thermal conductivity of 0.5 W/m*K to 8 W/m*K and an adhesive resin layer having a thermal conductivity of 0.05 W/m*K to 0.4 W/m*K is provided. A percentage of a thickness of the adhesive resin layer relative to a total thickness of the thermally conductive encapsulate ranges from 0.1% to 10%, and the thermally conductive encapsulate has an overall thermal impedance less than 0.72° C.-in2/W. Accordingly, the thermally conductive encapsulate not only provides sealing, insulating and adhesive properties, but also effectively dissipates the heat to the environment without increasing the thickness or volume of the solar cell module and without modifying the original encapsulation process, and thereby enhancing the solar cell module's conversion efficiency and increasing its power output.Type: ApplicationFiled: January 8, 2014Publication date: July 9, 2015Applicant: TAIFLEX SCIENTIFIC CO., LTD.Inventors: FU-MIN WANG, I-LING TENG, TSUNG-TAI HUNG, YU-HSIEN LEE, TZU-CHING HUNG, CHEN-HSIN HUANG
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Patent number: 8415004Abstract: A method for manufacturing a low thermal-impedance insulated metal substrate has steps of providing an electrical-conductive metal layer; forming a first thermal-conductive polymeric composite layer on the electrical-conductive metal layer; forming a second thermal-conductive polymeric composite layer on the first thermal-conductive polymeric composite layer; and adhere a thermal-conductive metal layer on the second thermal-conductive polymeric composite layer by hot-pressing process. Therefore, the low thermal-impedance insulated metal substrate of the present invention has lower thermal-impedance, lower coefficient of thermal expansion and higher electrical reliability.Type: GrantFiled: November 12, 2009Date of Patent: April 9, 2013Assignee: Taiflex Scientific Co., Ltd.Inventors: Yu-Hsien Lee, Chen-Hsin Huang, Feng-Jung Tien, Tzu-Ching Hung
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Publication number: 20110111191Abstract: A method for manufacturing a low thermal-impedance insulated metal substrate has steps of providing an electrical-conductive metal layer; forming a first thermal-conductive polymeric composite layer on the electrical-conductive metal layer; forming a second thermal-conductive polymeric composite layer on the first thermal-conductive polymeric composite layer; and adhere a thermal-conductive metal layer on the second thermal-conductive polymeric composite layer by hot-pressing process. Therefore, the low thermal-impedance insulated metal substrate of the present invention has lower thermal-impedance, lower coefficient of thermal expansion and higher electrical reliability.Type: ApplicationFiled: November 12, 2009Publication date: May 12, 2011Inventors: Yu-Hsien Lee, Chen-Hsin Huang, Feng-Jung Tien, Tzu-Ching Hung