Abstract: A light emitting diode package structure includes one or more lead frame units, a light emitting element, and an encapsulation unit that completely covers the light emitting element and partially covers the lead frame units. Each lead frame unit includes a chip-mounted portion, a first electrode portion, and a second electrode portion. The first and the second electrode portion extend along a first direction, and are disposed on two sides of the chip-mounted portion. Each lead frame unit further includes multiple first connecting portions extending from the chip-mounted portion along the first direction, and multiple second connecting portions formed by extension of the first and the second electrode portion along a second direction. The light emitting element is fixed to the chip-mounted portion and electrically connected to the electrode portions. A lead frame that includes the at least one lead frame unit is also provided.

Abstract: A multiple pixel package structure with a buried chip and an electronic device using the same are provided. The multiple pixel package structure includes a multi-layered circuit board, a plurality of pixels, a protective layer, and a control chip. The pixels are arranged on the multi-layered circuit board and into an array. Each of the pixels includes a plurality of light emitting elements of different colors. The protective layer is formed on the multi-layered circuit board and covers the pixels. The control chip is buried in the multi-layered circuit board and electrically connected to the light emitting elements of each of the pixels, so as to allow each of the pixels to produce a target luminous characteristic.

Abstract: An optical sensing module includes a substrate, an optical sensing device, and a plurality of solders. The substrate has an upper surface, and the upper surface has a plurality of first soldering pads. The optical sensing device is disposed upright on the substrate. The optical sensing device includes a transposition plate and an optical sensing package. The transposition plate includes a first surface, a second surface, and a third surface. The first surface has a plurality of second soldering pads, the second surface has a plurality of conductive through holes, and the third surface has a plurality of metal ribs. The conductive through holes are electrically connected to the second soldering pads and the metal ribs. The optical sensing package is disposed on the first surface and electrically connected to the second soldering pads. The plurality of solders climb onto the plurality of metal ribs, respectively.

Abstract: The photoelectric sensor includes a housing, a light-emitting module, a light-receiving module, and two adhesive members. The housing includes a first upright portion, a second upright portion, and a base. The first upright portion and the second upright portion are connected to the base, the first upright portion has a first concave structure and a first opening, and the second upright portion has a second concave structure and a second opening. The light-emitting module includes a first circuit board and a light-emitting element and is embedded in the first concave structure. The light-emitting element corresponds to the first opening. The light-receiving module includes a second circuit board and a light-receiving element and is embedded in the second concave structure. The light-receiving element corresponds to the second opening. The two adhesive members are respectively provided on side walls of the first concave structure and the second concave structure.

Abstract: An integrated circuit (IC) flip-chip and a light-emitting device are provided. The IC flip-chip includes a chip body, a plurality of metal pads, and a plurality of flip-chip pads. The chip body has a surface. The metal pads are disposed on the surface of the chip body. The flip-chip pads are disposed on the metal pads, and the flip-chip pads are electrically coupled to the metal pads through a redistribution layer therebetween. A distribution of the flip-chip pads is more even than a distribution of the metal pads.

Abstract: An optoelectronic device includes a substrate, a sensing element, a light emitting element, a first dam, and a second dam. The sensing element and the light emitting element are disposed on the substrate. The first dam is disposed on the substrate and covers a side of the sensing element. The second dam is disposed on the first dam. The first dam and the second dam are located between the sensing element and the light emitting element.

Abstract: A package structure includes a carrier, a frame, and at least one photonic device. The carrier includes a substrate and a plurality of first metal pads and second metal pads. The substrate includes a first surface and a second surface that are opposite to each other. The first metal pads are disposed on the first surface. The second metal pads are disposed on the second surface. A thickness of each of the second metal pads is greater than that of each of the first metal pads. The frame is disposed on the carrier, and an accommodating space is formed between the frame and the carrier. The at least one photonic device is disposed in the accommodating space.

Abstract: A light-emitting device, a light-emitting assembly and an integrated circuit (IC) flip-chip are provided. The light-emitting device includes the IC flip-chip, a plurality of light-emitting diode (LED) flip-chips and a substrate. The IC flip-chip includes a plurality of flip-chip pads. The LED flip-chips are spaced apart from the IC flip-chip. The substrate carries the IC flip-chip and the LED flip-chips. The LED flip-chips have a plurality of electrodes, and the flip-chip pads of the IC flip-chip and the electrodes of the LED flip-chips are disposed on the substrate by way of soldering. The LED flip-chips are electrically coupled to the IC flip-chip through the substrate.

Abstract: A package structure including a carrier, a photonic device, a supporting frame, and an encapsulant is provided. The photonic device is disposed on the carrier. The supporting frame is disposed on the carrier and surrounds the photonic device. The encapsulant covers the supporting frame and surrounds the photonic device.

Abstract: A light-emitting device and a light emitting module are provided. The light emitting module includes a housing, at least one light guide element, and at least one light emitting element. The housing includes at least one passage passing through its a first surface and a second surface, and a coupling portion formed on an inner surface adjacent to the second surface. The light guide element arranged in the at least one passage has a light emergent surface exposed at one end of the at least one passage and a light incident surface exposed at the other end of the at least one passage. The light emitting element is coupled to the housing by the coupling portion. The light emitting element includes a light emitting surface facing to the light incident surface of the light guide element and a soldering portion exposed from the housing.

Abstract: A light emitting diode (LED) package structure including a first light emitting portion, a second light emitting portion, a partition, and a surrounding wall is provided. The first light emitting portion includes a first LED chip emitting a first initial light, and the first initial light passes through the first light emitting portion to form a first white light. The second light emitting portion includes a second LED chip, a third LED chip, and a fourth LED chip. The partition is disposed between the first light emitting portion and the second light emitting portion. The surrounding wall is disposed around the partition, the first light emitting portion, and the second light emitting portion. The first white light has a view angle offset less than 1 degree.

Abstract: A light emitting device is provided. The light emitting device includes a package structure, a first light emitting chip, a second light emitting chip, a third light emitting chip, a first encapsulant, a second encapsulant, and a third encapsulant. The first light emitting chip, the second light emitting chip, and the third light emitting chip are disposed in a first cavity, a second cavity, and a third cavity of a body of the package structure, and electrically connected with a first electrode pair, a second electrode pair, and a third electrode pair that are covered by the body. The first encapsulant, the second encapsulant, and the third encapsulant are filled in the first cavity, the second cavity, and the third cavity. A first opening of the first cavity is larger in size than a second opening of the second cavity and a third opening of the third cavity.

Abstract: An optoelectronic package structure is provided. The optoelectronic package structure includes a carrier, a metal member, an insulating layer, an optoelectronic element, and an adhesive. The metal member is disposed on the carrier. The insulating layer is disposed on the metal member. The insulating layer has a plurality of grooves, and a carrying region is defined by the grooves. The optoelectronic element is disposed on the insulating layer. The adhesive is filled into the grooves and bonds the optoelectronic element onto the carrying region of the insulating layer.

Abstract: An optoelectronic package structure and a photo-interrupting device are provided. The photo-interrupting device includes a casing and two optoelectronic package structures oppositely arranged. The optoelectronic package structure includes a housing, a first lead frame, a second lead frame, an optoelectronic element, and a sealing element. The optoelectronic element is disposed on the first lead frame and is electrically connected to the second lead frame through a conducting wire. The housing encapsulates one part of each of the first lead frame and the second lead frame. Another part of each of the first lead frame and the second lead frame correspondingly protrudes from one end of the housing having an opening arranged on a first surface, and the optoelectronic element is exposed through the opening. The sealing element covers the optoelectronic element, and a surface of the sealing element is not higher than the first surface of the housing.

Abstract: A light emitting package is provided, the light emitting package includes a carrier having a main part that has multiple chip bonding regions, and each the chip bonding regions has two neighboring conductive parts. An insulating part is disposed on the main part and portion of the two neighboring conductive parts, and multiple hollow-out structures are formed by the insulating part and corresponded in position to the chip bonding regions. Each of the hollow-out structures has a side wall that surrounds the chip bonding regions, and the portion of the tops of the two neighboring conductive parts are exposed from a bottom portion of the hollow-out structure, and multiple light emitting chips are disposed onto the chip bonding surfaces.

Abstract: A light-emitting package structure and a manufacturing method thereof are provided. The light-emitting package structure includes a driving device and at least one light-emitting chip. The driving device includes a driving chip and a redistribution layer structure formed over the driving chip. The driving chip has a first surface and a second surface opposite to the first surface. The redistribution layer structure includes a plurality of first conductive pads disposed on the first surface and a plurality of second conductive pads disposed on the second surface, and one of the first conductive pads is electrically connected to one of the second conductive pads. The at least one light-emitting chip is disposed on the first surface of the driving chip and electrically connected to the driving chip through the first conductive pads.

Abstract: A light detecting device, a lighting module, and a manufacturing method for the same are provided. The lighting module includes a carrier, a light assembly having a first lighting unit and a second lighting unit, a lens assembly having a first lens and a second lens, and a casing surrounding the lens assembly. The first lighting unit emits a first beam having a first wavelength through the first lens to define a first view angle and the second lighting unit emits a second beam having a second wavelength through the second lens to define a second view angle. The first wavelength is smaller than the second wavelength, and the first view angle is greater than the second view angle.

Abstract: A substrate structure with a buried chip and a light emitting device using the same are provided. The substrate structure includes a base layer, a control chip, a filling layer, a first upper resin layer and a first lower resin layer. The substrate layer has a first surface, a second surface opposite to the first surface, and an opening passing through the first surface and the second surface. The control chip is disposed in the opening, and an annular space having a specific width is defined by an outer wall surface of the control chip and an inner wall surface of the opening. The filling layer is filled in the annular space. The first upper resin layer and the first lower resin layer are respectively disposed on the first surface and the second surface of the base layer.

Abstract: A light-emitting device, a light-emitting assembly and an integrated circuit (IC) flip-chip are provided. The light-emitting device includes the IC flip-chip, a plurality of light-emitting diode (LED) flip-chips and a substrate. The IC flip-chip includes a plurality of flip-chip pads. The LED flip-chips are spaced apart from the IC flip-chip. The substrate carries the IC flip-chip and the LED flip-chips. The LED flip-chips have a plurality of electrodes, and the flip-chip pads of the IC flip-chip and the electrodes of the LED flip-chips are disposed on the substrate by way of soldering. The LED flip-chips are electrically coupled to the IC flip-chip through the substrate.

Abstract: A lead frame array for carrying chips includes a plurality of lead frames. Any four lead frames adjacent to each other and have two pairs of linking bridge groups which are connected any two lead frames adjacent to each other by one of the linking bridge groups. Each linking bridge group has an inner linking bridge, a slanted linking bridge and an outer linking bridge. An LED package structure with multiple chips is further provided, which includes a lead frame formed by cutting the lead frame array.