Abstract: A light emitting diode (LED) package structure including a first light emitting portion, a second light emitting portion, a partition, and a surrounding wall is provided. The first light emitting portion includes a first LED chip emitting a first initial light, and the first initial light passes through the first light emitting portion to form a first white light. The second light emitting portion includes a second LED chip, a third LED chip, and a fourth LED chip. The partition is disposed between the first light emitting portion and the second light emitting portion. The surrounding wall is disposed around the partition, the first light emitting portion, and the second light emitting portion. The first white light has a view angle offset less than 1 degree.

Abstract: A light detecting device, a lighting module, and a manufacturing method for the same are provided. The lighting module includes a carrier, a light assembly having a first lighting unit and a second lighting unit, a lens assembly having a first lens and a second lens, and a casing surrounding the lens assembly. The first lighting unit emits a first beam having a first wavelength through the first lens to define a first view angle and the second lighting unit emits a second beam having a second wavelength through the second lens to define a second view angle. The first wavelength is smaller than the second wavelength, and the first view angle is greater than the second view angle.

Abstract: A light-emitting package structure and a manufacturing method thereof are provided. The light-emitting package structure includes a driving device and at least one light-emitting chip. The driving device includes a driving chip and a redistribution layer structure formed over the driving chip. The driving chip has a first surface and a second surface opposite to the first surface. The redistribution layer structure includes a plurality of first conductive pads disposed on the first surface and a plurality of second conductive pads disposed on the second surface, and one of the first conductive pads is electrically connected to one of the second conductive pads. The at least one light-emitting chip is disposed on the first surface of the driving chip and electrically connected to the driving chip through the first conductive pads.

Abstract: A light emitting package is provided, the light emitting package includes a carrier having a main part that has multiple chip bonding regions, and each the chip bonding regions has two neighboring conductive parts. An insulating part is disposed on the main part and portion of the two neighboring conductive parts, and multiple hollow-out structures are formed by the insulating part and corresponded in position to the chip bonding regions. Each of the hollow-out structures has a side wall that surrounds the chip bonding regions, and the portion of the tops of the two neighboring conductive parts are exposed from a bottom portion of the hollow-out structure, and multiple light emitting chips are disposed onto the chip bonding surfaces.

Abstract: A light emitting device is provided. The light emitting device includes a package structure, a first light emitting chip, a second light emitting chip, a third light emitting chip, a first encapsulant, a second encapsulant, and a third encapsulant. The first light emitting chip, the second light emitting chip, and the third light emitting chip are disposed in a first cavity, a second cavity, and a third cavity of a body of the package structure, and electrically connected with a first electrode pair, a second electrode pair, and a third electrode pair that are covered by the body. The first encapsulant, the second encapsulant, and the third encapsulant are filled in the first cavity, the second cavity, and the third cavity. A first opening of the first cavity is larger in size than a second opening of the second cavity and a third opening of the third cavity.

Abstract: The present disclosure provides an LED package structure, a carrier, and a method for manufacturing a carrier. The carrier includes a substrate and an electrode layer disposed on the substrate. The electrode layer includes at least one bonding portion that has a plurality of elongated microstructures recessed in a surface thereof.

Abstract: A substrate structure with a buried chip and a light emitting device using the same are provided. The substrate structure includes a base layer, a control chip, a filling layer, a first upper resin layer and a first lower resin layer. The substrate layer has a first surface, a second surface opposite to the first surface, and an opening passing through the first surface and the second surface. The control chip is disposed in the opening, and an annular space having a specific width is defined by an outer wall surface of the control chip and an inner wall surface of the opening. The filling layer is filled in the annular space. The first upper resin layer and the first lower resin layer are respectively disposed on the first surface and the second surface of the base layer.

Abstract: An LED package structure includes a multilayered circuit board, a plurality of lighting elements, a control unit, a reflecting unit, a package unit, a plurality of test paths and a plurality of operation paths. The multilayered circuit board includes a plurality of testing pads, a first electrical connecting pad and a plurality of second electrical connecting pads. The lighting elements are disposed on the multilayered circuit board. The control unit is electrically connected to the lighting elements. The reflecting unit is disposed on the multilayered circuit board and surrounds the lighting elements. The package unit covers the lighting elements. The test paths are in electrical connection with the first electrical connecting pad, the lighting elements and one of the testing pads. The operation paths are in electrical connection with the first electrical connecting pad, the control unit, the lighting elements and one of the second electrical connecting pads.

Abstract: The present disclosure discloses a light emitting diode (LED) package structure, a heat-dissipating substrate, a method for manufacturing an LED package structure, and a method for manufacturing a heat-dissipating substrate. The method for manufacturing the heat-dissipating substrate includes: providing a metal plate having a top surface and a bottom surface; implementing an etching process on the metal plate so as to form a first heat-dissipating block, a second heat-dissipating block, and a heat-dissipating plate spaced apart from each other; and filling an insulating material between the heat-dissipating plate and the first heat-dissipating block and between the heat-dissipating plate and the second heat-dissipating block so as to electrically isolate the heat-dissipating plate, the first heat-dissipating block, and the second heat-dissipating block from each other.

Abstract: An LED package structure includes a substrate, an electrode layer and an insulating layer in a coplanar arrangement and disposed on the substrate, an LED chip mounted on the electrode layer and the insulating layer, a phosphor sheet covering entirely a top surface of the LED chip, a first translucent layer disposed on a light emitting surface of the phosphor sheet, and a reflective housing covering the side surfaces of the LED chip and the side surfaces of the phosphor sheet. The light emitting surface has a central region and a ring-shaped region surrounding the central region. The first translucent layer covers at least 60% of an area of the ring-shaped region. A refractive index of the first translucent layer is larger than one and is smaller than that of the phosphor sheet. A top surface of the reflective housing is substantially flush with the light emitting surface.

Abstract: An optical sensor module includes a first frame set, a second frame set and a housing which partially covers the first frame set and the second frame set. The first frame set has a first chip-mounting frame and a first wiring frame. The first chip-mounting frame has a first chip-mounting section, and a first conductive lead. At least one first indentation is formed on the first chip-mounting section. The second frame set has a second chip-mounting frame and a second wiring frame. The second chip-mounting frame has a second chip-mounting section and a second conductive lead. At least one second indentation is formed on the second chip-mounting section.

Abstract: An optical sensor module includes a support unit, a light-receiving unit and a light-emitting unit. The support unit includes a main plate, and a side plate inclined relative to the main plate. The light-receiving unit includes a photodetector disposed on the main plate and having a light-receiving surface located away from the main plate, and a light-blocking member covering part of the photodetector. The light-emitting unit emits light toward an imaginary line perpendicular to the light-receiving surface, and is disposed on the side plate. A wearable device including the optical sensor is also disclosed.

Abstract: A lead frame includes a main plate and a side plate. The main plate has a support portion and a projecting portion. The support portion has two opposite first sides and a support face located between the first sides. The projecting portion projects upward from one of the first sides in a direction opposite to the support face. The side plate is disposed separately from the one of the first sides of the support portion and is spaced apart from the projecting portion.

Abstract: An LED package structure includes an LED frame, a driver frame unit, a housing, LED chips, a driver chip, and a light-permeable package body. The LED frame includes a carrying segment and two bent leads connected to the carrying segment. The driver frame unit includes two side frames each having a functional segment and a bent lead. The housing has a cavity exposing the carrying segment and the two functional segments. The bent leads protrude from a lateral surface of the housing, and curvedly extend to a bottom surface of the housing. The LED chips are mounted on the carrying segment. The driver chip is fixed to one of the two functional segments, and is electrically connected to the other functional segment and the LED chips. The light-permeable package body is filled in the cavity so as to embed the LED chips and the driver chip.

Abstract: An LED package structure includes a multilayer circuit board, an LED chip, and a cover. The multilayer circuit board has a conductive layer, a first resin layer disposed on the conductive layer, and a first circuit layer disposed on the first resin layer. The first resin layer has a first opening, and a portion of the conductive layer is partially exposed from the first resin layer via the first opening such that a mounting region is exposed. The first circuit layer has a second opening, and the second opening exposes the mounting region. The LED chip is fixed on the mounting region by passing it through the first and second openings, and the LED chip is connected to the first circuit layer by wires. The cover is disposed on the first resin layer and covers the LED chip and the first circuit layer.

Abstract: The present disclosure discloses a light emitting diode (LED) package structure, a heat-dissipating substrate, a method for manufacturing an LED package structure, and a method for manufacturing a heat-dissipating substrate. The method for manufacturing the heat-dissipating substrate includes: providing a metal plate having a top surface and a bottom surface; implementing an etching process on the metal plate so as to form a first heat-dissipating block, a second heat-dissipating block, and a heat-dissipating plate spaced apart from each other; and filling an insulating material between the heat-dissipating plate and the first heat-dissipating block and between the heat-dissipating plate and the second heat-dissipating block so as to electrically isolate the heat-dissipating plate, the first heat-dissipating block, and the second heat-dissipating block from each other.

Abstract: A lead frame array for carrying chips includes a plurality of lead frames. Any four lead frames adjacent to each other and have two pairs of linking bridge groups which are connected any two lead frames adjacent to each other by one of the linking bridge groups. Each linking bridge group has an inner linking bridge, a slanted linking bridge and an outer linking bridge. An LED package structure with multiple chips is further provided, which includes a lead frame formed by cutting the lead frame array.

Abstract: The present disclosure provides an LED package structure, a carrier, and a method for manufacturing a carrier. The carrier includes a substrate and an electrode layer disposed on the substrate. The electrode layer includes at least one bonding portion that has a plurality of elongated microstructures recessed in a surface thereof.

Abstract: The present disclosure discloses a light emitting diode (LED) package structure, a heat-dissipating substrate, and a method for manufacturing a heat-dissipating substrate. The heat-dissipating substrate includes a first heat-dissipating block, a heat-dissipating plate and a second heat-dissipating block, spaced apart each other, and a lateral insulating member connected to thereof so as to electrically isolate the first heat-dissipating block, the second heat-dissipating block, and the heat-dissipating plate from each other. The first heat-dissipating block, the second heat-dissipating block, and the heat-dissipating plate each has two protrusions respectively formed on two opposite surfaces thereof. A height of each of the protrusions is at a micro level.

Abstract: An LED package structure includes an LED frame, a driver frame unit, a housing, LED chips, a driver chip, and a light-permeable package body. The LED frame includes a carrying segment and two bent leads connected to the carrying segment. The driver frame unit includes two side frames each having a functional segment and a bent lead. The housing has a cavity exposing the carrying segment and the two functional segments. The bent leads protrude from a lateral surface of the housing, and curvedly extend to a bottom surface of the housing. The LED chips are mounted on the carrying segment. The driver chip is fixed to one of the two functional segments, and is electrically connected to the other functional segment and the LED chips. The light-permeable package body is filled in the cavity so as to embed the LED chips and the driver chip.