Patents by Inventor Chen-Hsiung Cheng
Chen-Hsiung Cheng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20060027543Abstract: A method for manufacturing a microstructure device using a near field scanning optical microscope (NSOM) laser micromachining system. A microstructure device preform, including an existing feature, is provided. The NSOM probe tip is scanned over a portion of the preform selected such that a plurality of scan lines cross the existing feature. Scanned locations of the existing feature in at least two scan lines are determined. The orientation of the existing feature is determined based on the scanned locations and the shape of the existing feature. At least one expected machining location in a subsequent scan line is determined based on the shape and orientation of the existing feature. The micro-machining laser is pulsed as the NSOM probe is scanned through the expected machining location(s) during the subsequent scan lines to form at least one fine feature on the microstructure device preform, thus, completing the microstructure device.Type: ApplicationFiled: August 3, 2004Publication date: February 9, 2006Inventor: Chen-Hsiung Cheng
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Publication number: 20050255715Abstract: A patterned, multi-layered thin film structure is patterned using ultra-fast lasers and absorption spectroscopy without damaging underlying layers of the layered structure. The structure is made by selecting ablatable layers based on their thermal, strength and absorption spectra and by using an ultra-fast laser programmed with the appropriate wavelength (?), pulse width (?), spectral width (??), spot size, bite size and fluence. The end structure may have features (such as vias, insulating areas, or inkjet printed areas) patterned in the last (top) layer applied or at deeper layers within the layered structure, and can be used as components of organic light emitting didoes (OLEDs) and organic thin film transistors (OTFTs). The method of the present invention includes determining the product's specifications, providing a substrate, selecting a layer, applying the layer, patterning the layer and determining if more layers need to be added to the multi-layered thin film structure.Type: ApplicationFiled: May 12, 2004Publication date: November 17, 2005Inventors: Chen-Hsiung Cheng, Xinbing Liu, Atsushi Sogami, Kazuo Nishimura
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Publication number: 20050230367Abstract: A method of operating a laser drilling system to manufacture gravure printing plates without etching or the use of hazardous chemicals includes activating a laser drilling system, including a picosecond laser, light valves, and a mechanism adapted to rotate a gravure cylinder blank. Operation of the light valves, includes setting the light valves to block and/or allow pulses of laser energy propagating from the laser drilling system that can ablate a linear pattern of cells along a substantially entire length of the gravure cylinder blank. Drilling of cells includes targeting the laser drilling system on the gravure cylinder blank, such that ablation of materials occurs as sub-beams propagate along an optical path to the target area and impinge upon the gravure cylinder blank, wherein specific cells within the target area of the gravure cylinder blank are drilled or not drilled according to settings of the light valves.Type: ApplicationFiled: February 18, 2005Publication date: October 20, 2005Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.Inventors: Chen-Hsiung Cheng, Xinbing Liu
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Publication number: 20050230368Abstract: A method of operating a laser drilling system to manufacture gravure printing plates without etching or the use of hazardous chemicals includes activating a laser drilling system, including a picosecond laser, light valves, and a mechanism adapted to rotate a gravure cylinder blank. Operation of the light valves, includes setting the light valves to block and/or allow pulses of laser energy propagating from the laser drilling system that can ablate a linear pattern of cells along a substantially entire length of the gravure cylinder blank. Drilling of cells includes targeting the laser drilling system on the gravure cylinder blank, such that ablation of materials occurs as sub-beams propagate along an optical path to the target area and impinge upon the gravure cylinder blank, wherein specific cells within the target area of the gravure cylinder blank are drilled or not drilled according to settings of the light valves.Type: ApplicationFiled: February 18, 2005Publication date: October 20, 2005Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.Inventors: Chen-Hsiung Cheng, Xinbing Liu
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Publication number: 20050230366Abstract: A method of operating a laser drilling system to manufacture gravure printing plates without etching or the use of hazardous chemicals includes activating a laser drilling system, including a picosecond laser, light valves, and a mechanism adapted to rotate a gravure cylinder blank. Operation of the light valves, includes setting the light valves to block and/or allow pulses of laser energy propagating from the laser drilling system that can ablate a linear pattern of cells along a substantially entire length of the gravure cylinder blank. Drilling of cells includes targeting the laser drilling system on the gravure cylinder blank, such that ablation of materials occurs as sub-beams propagate along an optical path to the target area and impinge upon the gravure cylinder blank, wherein specific cells within the target area of the gravure cylinder blank are drilled or not drilled according to settings of the light valves.Type: ApplicationFiled: February 18, 2005Publication date: October 20, 2005Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.Inventors: Chen-Hsiung Cheng, Xinbing Liu
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Publication number: 20050230369Abstract: A method of operating a laser drilling system to manufacture gravure printing plates without etching or the use of hazardous chemicals includes activating a laser drilling system, including a picosecond laser, light valves, and a mechanism adapted to rotate a gravure cylinder blank. Operation of the light valves, includes setting the light valves to block and/or allow pulses of laser energy propagating from the laser drilling system that can ablate a linear pattern of cells along a substantially entire length of the gravure cylinder blank. Drilling of cells includes targeting the laser drilling system on the gravure cylinder blank, such that ablation of materials occurs as sub-beams propagate along an optical path to the target area and impinge upon the gravure cylinder blank, wherein specific cells within the target area of the gravure cylinder blank are drilled or not drilled according to settings of the light valves.Type: ApplicationFiled: March 3, 2005Publication date: October 20, 2005Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.Inventors: Chen-Hsiung Cheng, Xinbing Liu
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Publication number: 20050221577Abstract: A method for manufacturing a microstructure, which includes at least one fine feature on an existing feature, using an NSOM laser micromachining system. A microstructure device preform is provided. A portion of its top surface is profiled with the NSOM to produce a topographical image. This profiled portion is selected to include the existing feature. An image coordinate system is defined for the profiled portion of top surface based on the topographical image. Coordinates of a reference point and the orientation of the existing feature in the image coordinate system are determined using the topographical image. The probe tip of the NSOM is aligned over a portion of the existing feature using the determined coordinates of the reference point and the orientation of the existing feature. The top surface of the microstructure device preform is machined with the micro-machining laser to form the fine feature(s) on the existing feature.Type: ApplicationFiled: March 30, 2004Publication date: October 6, 2005Inventors: Ming Li, Makoto Ishizuka, Chen-Hsiung Cheng
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Publication number: 20050218315Abstract: A near-field scanning optical microscope (NSOM) laser micromachining system for laser machining features on surfaces using an ultrafast laser source and a method of laser machining such features. The system includes: the ultrafast laser source to generate pulses of laser light having pulse durations less than 1 ns and a peak wavelength; an NSOM probe having a substantially cylindrical shape; an NSOM mount to controllably hold the NSOM probe and the microstructure workpiece to be machined; an NSOM probe monitor coupled to the NSOM mount for determining the distance between the probe tip of the NSOM probe and the surface; and an NSOM controller coupled to the NSOM probe monitor, and motion stages in the NSOM mount. The NSOM mount includes an XY motion stage and a Z motion stage. These motion stages are couple to either the NSOM probe or the microstructure workpiece, or one motion stage to each.Type: ApplicationFiled: March 30, 2004Publication date: October 6, 2005Inventors: Ming Li, Chen-Hsiung Cheng
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Publication number: 20050217521Abstract: A method of operating a laser drilling system to manufacture gravure printing plates without etching or the use of hazardous chemicals includes activating a laser drilling system, including a picosecond laser, light valves, and a mechanism adapted to rotate a gravure cylinder blank. Operation of the light valves, includes setting the light valves to block and/or allow pulses of laser energy propagating from the laser drilling system that can ablate a linear pattern of cells along a substantially entire length of the gravure cylinder blank. Drilling of cells includes targeting the laser drilling system on the gravure cylinder blank, such that ablation of materials occurs as sub-beams propagate along an optical path to the target area and impinge upon the gravure cylinder blank, wherein specific cells within the target area of the gravure cylinder blank are drilled or not drilled according to settings of the light valves.Type: ApplicationFiled: February 18, 2005Publication date: October 6, 2005Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.Inventors: Chen-Hsiung Cheng, Xinbing Liu
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Publication number: 20050211748Abstract: A laser processing apparatus includes a laser generation apparatus for outputting an ultra-short pulse laser beam, a laser control apparatus for controlling the laser generation apparatus, an optical system, an optical system control apparatus for measuring the optical system, and a measurement apparatus for measuring the ultra-short pulse laser beam. The intensity of the largest noise component pulse in the ultra-short pulse laser beam is controlled to be 2.5% or less of the intensity of the primary pulse in the ultra-short pulse laser beam.Type: ApplicationFiled: May 2, 2005Publication date: September 29, 2005Applicant: Matsushita Electric Industial Co., LtdInventors: Yosuke Mizuyama, Yosuke Toyofuku, Xinbing Liu, Chen-Hsiung Cheng
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Patent number: 6931991Abstract: A method of operating a laser drilling system to manufacture gravure printing plates without etching or the use of hazardous chemicals includes activating a laser drilling system, including a picosecond laser, light valves, and a mechanism adapted to rotate a gravure cylinder blank. Operation of the light valves, includes setting the light valves to block and/or allow pulses of laser energy propagating from the laser drilling system that can ablate a linear pattern of cells along a substantially entire length of the gravure cylinder blank. Drilling of cells includes targeting the laser drilling system on the gravure cylinder blank, such that ablation of materials occurs as sub-beams propagate along an optical path to the target area and impinge upon the gravure cylinder blank, wherein specific cells within the target area of the gravure cylinder blank are drilled or not drilled according to settings of the light valves.Type: GrantFiled: March 31, 2004Date of Patent: August 23, 2005Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Chen-Hsiung Cheng, Xinbing Liu
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Patent number: 6897405Abstract: A method of creating a milled structure in a fixed material using a moving laser beam is disclosed, where a picosecond laser provides short pulses of light energy to produce required exposure steps, where a variable rate of laser beam movement conducts the milling upon the material, where the laser beam tool path directs the milling process to produce a milled hole of high quality and repeatability, and where the knowledge of how to measure these 3 quantities is returned as feedback into the laser system. The present invention is further embodied as a spiral milled tool path structured to achieve the customer specified tapered hole shape. The constant arc speed tool path is required to produce tapered holes to customer specification.Type: GrantFiled: October 8, 2002Date of Patent: May 24, 2005Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Chen-Hsiung Cheng, Xinbing Liu
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Patent number: 6829517Abstract: A computer interface system for automated control of a laser drilling system has workpiece geometry template data defining a shape formed in a laser-milled workpiece. A user interface is receptive of a user selection characterizing a desired laser drilling operation. An expert system is adapted to receive the template data and the user selection, and is operable to adapt the template data to the user selection.Type: GrantFiled: October 8, 2002Date of Patent: December 7, 2004Assignee: Matsushita Electronic Industrial Co., Ltd.Inventors: Chen-Hsiung Cheng, Xinbing Liu
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Patent number: 6803539Abstract: A system and method for aligning a microfilter in an optical circuit and thereby providing sub-beam impingement intensity control from a set of highly proximate sub-beams generated from a parallel process laser system removing a portion from a workpiece (exit holes in inkjet nozzle plates). The energy of laser-generated sub-beams to the target (cutting) point is attenuated to a level sufficient for maintaining operation of a charge-coupled-device camera below saturation when the sub-beams are incident on the camera, the CCD camera monitors the sub-beams and directs output to either a monitor or control computer. The microfilter is then adjusted to provide an optimal sub-beam pattern.Type: GrantFiled: October 8, 2002Date of Patent: October 12, 2004Assignee: Matsushita Electrical Industrial Co., Ltd.Inventors: Xinbing Liu, Chen-Hsiung Cheng
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Patent number: 6804574Abstract: A method of determining compatibility of user input parameters for use with a laser drilling system includes providing compatibility data characteristic of a plurality of laser drilling operations, receiving input parameters characteristic of a desired laser drilling operation, and comparing the input parameters to the compatibility data, thereby determining whether the input parameters are incompatible.Type: GrantFiled: October 8, 2002Date of Patent: October 12, 2004Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Xinbing Liu, Chen-Hsiung Cheng, John Cronin, Nancy Edwards, Christopher Rose
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Publication number: 20040183855Abstract: A method of creating a milled structure in a fixed material using a moving laser beam is disclosed, where a picosecond laser provides short pulses of light energy to produce required exposure steps, where a variable rate of laser beam movement conducts the milling upon the material, where the laser beam tool path directs the milling process to produce a milled hole of high quality and repeatability, and where the knowledge of how to measure these 3 quantities is returned as feedback into the laser system. The present invention is further embodied as a spiral milled tool path structured to achieve the customer specified tapered hole shape. The constant arc speed tool path is required to produce tapered holes to customer specification.Type: ApplicationFiled: January 29, 2004Publication date: September 23, 2004Inventors: Chen-Hsiung Cheng, Xinbing Liu
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Publication number: 20040182831Abstract: A method of creating a milled structure in a fixed material using a moving laser beam is disclosed, where a picosecond laser provides short pulses of light energy to produce required exposure steps, where a variable rate of laser beam movement conducts the milling upon the material, where the laser beam tool path directs the milling process to produce a milled hole of high quality and repeatability, and where the knowledge of how to measure these 3 quantities is returned as feedback into the laser system. The present invention is further embodied as a spiral milled tool path structured to achieve the customer specified tapered hole shape. The constant arc speed tool path is required to produce tapered holes to customer specification.Type: ApplicationFiled: January 29, 2004Publication date: September 23, 2004Inventors: Chen-Hsiung Cheng, Xinbing Liu
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Patent number: 6749285Abstract: A method of laser milling an aperture in a workpiece for use with manufacturing ink-jet nozzles includes initially illuminating a surface of the workpiece with a laser beam at a point within an outer perimeter of a desired aperture and a distance away from the outer perimeter sufficient to substantially avoid initial ablation of the outer perimeter. The laser beam is driven substantially in the direction of the outer perimeter at a variable rate controlled to avoid deformation of the outer perimeter. Material of the workpiece is ablated in a pattern designed to substantially remove material within the outer perimeter, thereby forming the aperture.Type: GrantFiled: October 8, 2002Date of Patent: June 15, 2004Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Xinbing Liu, Chen-Hsiung Cheng, Dan Hogan, Nancy Edwards
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Patent number: 6720519Abstract: The present invention is a system for laser micromachining where a scan mirror and milling algorithm are used to produce high precision, controlled hole shapes in a workpiece. A picosecond laser that produces short pulses is used to reduce thermal effects to improve the quality and repeatability of the milled holes, and a Diffractive Optical Element (DOE) is used to split a single beam into a plurality of beams to allow parallel drilling of the workpiece. A method for operating a laser drilling system where high precision, controlled hole shapes in a workpiece are drilled includes using a scan mirror and milling algorithm, and using a picosecond laser in conjunction with a DOE, thus ensuring that spectral bandwidth issues and thermal issues are addressed to improve the quality and repeatability of the holes.Type: GrantFiled: September 23, 2002Date of Patent: April 13, 2004Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Xinbing Liu, Chen-Hsiung Cheng
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Patent number: 6710293Abstract: A microfilter design system for use with a laser drilling system producing multiple sub-beams for parallel drilling operations includes an optical intensity detector illuminated by the multiple sub-beams of the laser drilling system. An analysis module operates the optical intensity detector to produce intensity measurement data for each of the multiple sub-beams. A memory operable with a data processing system stores the intensity measurement data for analysis.Type: GrantFiled: October 8, 2002Date of Patent: March 23, 2004Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Xinbing Liu, Chen-Hsiung Cheng