Abstract: In an embodiment, a package includes an encapsulant laterally surrounding a first integrated circuit device and a second integrated circuit device, wherein the first integrated circuit device includes a die and a heat dissipation structure over the die; a sealant disposed over the heat dissipation structure; an adhesive disposed over the second integrated circuit device; and a lid disposed over the sealant and the adhesive, wherein the lid includes a first cooling passage and a second cooling passage, the first cooling passage including an opening at a bottom of the lid and aligned to the heat dissipation structure, the second cooling passage including channels aligned to the second integrated circuit device and being distant from the bottom of the lid.

Abstract: A semiconductor structure includes a first interposer; a second interposer laterally adjacent to the first interposer, where the second interposer is spaced apart from the first interposer; and a first die attached to a first side of the first interposer and attached to a first side of the second interposer, where the first side of the first interposer and the first side of the second interposer face the first die.

Abstract: A device includes an integrated circuit die attached to a substrate; a lid attached to the integrated circuit die; a sealant on the lid; a spacer structure attached to the substrate adjacent the integrated circuit die; and a cooling cover attached to the spacer structure, wherein the cooling cover extends over the lid, wherein the cooling cover attached to the lid by the sealant. In an embodiment, the device includes a ring structure on the substrate, wherein the ring structure is between the spacer structure and the integrated circuit die.

Abstract: A device includes a first package connected to an interconnect substrate, wherein the interconnect substrate includes conductive routing; and a second package connected to the interconnect substrate, wherein the second package includes a photonic layer on a substrate, the photonic layer including a silicon waveguide coupled to a grating coupler and to a photodetector; a via extending through the substrate; an interconnect structure over the photonic layer, wherein the interconnect structure is connected to the photodetector and to the via; and an electronic die bonded to the interconnect structure, wherein the electronic die is connected to the interconnect structure.

Abstract: In an embodiment, a structure includes: a first integrated circuit die including first die connectors; a first dielectric layer on the first die connectors; first conductive vias extending through the first dielectric layer, the first conductive vias connected to a first subset of the first die connectors; a second integrated circuit die bonded to a second subset of the first die connectors with first reflowable connectors; a first encapsulant surrounding the second integrated circuit die and the first conductive vias, the first encapsulant and the first integrated circuit die being laterally coterminous; second conductive vias adjacent the first integrated circuit die; a second encapsulant surrounding the second conductive vias, the first encapsulant, and the first integrated circuit die; and a first redistribution structure including first redistribution lines, the first redistribution lines connected to the first conductive vias and the second conductive vias.

Abstract: Semiconductor package includes a pair of dies, a redistribution structure, and a conductive plate. Dies of the pair of dies are disposed side by side. Each die includes a contact pad. Redistribution structure is disposed on the pair of dies, and electrically connects the pair of dies. Redistribution structure includes an innermost dielectric layer, an outermost dielectric layer, and a redistribution conductive layer. Innermost dielectric layer is closer to the pair of dies. Redistribution conductive layer extends between the innermost dielectric layer and the outermost dielectric layer. Outermost dielectric layer is furthest from the pair of dies. Conductive plate is electrically connected to the contact pads of the pair of dies. Conductive plate extends over the outermost dielectric layer of the redistribution structure and over the pair of dies. Vertical projection of the conductive plate falls on spans of the dies of the pair of dies.

Abstract: A package includes a first package component including a semiconductor die, wherein the semiconductor die includes conductive pads, wherein the semiconductor die is surrounded by an encapsulant; an adaptive interconnect structure on the semiconductor die, wherein the adaptive interconnect structure includes conductive lines, wherein each conductive line physically and electrically contacts a respective conductive pad; and first bond pads, wherein each first bond pad physically and electrically contacts a respective conductive line; and a second package component including an interconnect structure, wherein the interconnect structure includes second bond pads, wherein each second bond pad is directly bonded to a respective first bond pad, wherein each second bond pad is laterally offset from a corresponding conductive pad which is electrically coupled to that second bond pad.

Abstract: A magnetoresistive random access memory (MRAM) structure, including a substrate and multiple MRAM cells on the substrate, wherein the MRAM cells are arranged in a memory region adjacent to a logic region. An ultra low-k (ULK) layer covers the MRAM cells, wherein the surface portion of ultra low-k layer is doped with fluorine, and dents are formed on the surface of ultra low-k layer at the boundaries between the memory region and the logic region.

Abstract: A guiding apparatus for sharpening woodworking cutters contains: a holder and an accommodation assembly. The holder clamps a cutter and tilts relative to a grinding plane to form a grinding angle between the holder and the grinding plane. The holder includes a rolling sleeve and an outlet defined between two front ends of two sides thereof to extend a cutting tip of the cutter out of the outlet at an extending distance. The accommodation assembly is joined with the holder and includes a positioning plate. The positioning plate has a stopping extension formed on a rear end thereof to stop the cutting tip of the cutter and has a distance indicator arranged on a top surface thereof adjacent to the stopping extension and with respect to the grinding angle, such that the distance indicator indicates the extending distance at which the cutting tip extends out of the outlet.

Abstract: A drift skate includes a board and at least one frame which has a connection portion and a cushion installation portion which is connected to the top of the connection portion. Two rollers are respectively connected to the connection portion by two axles. At least two independent cushions are respectively connected between the cushion installation portion and the board by two bolt units. The cushions are functions independently and respond to the action of the board so as to absorb vibration and reaction force from the ground.

Abstract: A method for patterning a light guide plate includes: (a) using laser beams to carve out a plurality of notches on a mold; and (b) manufacturing the light guide plate with the mold for forming a plurality of laser process patterns on an incident plane of the light guide plate.

Abstract: A light-emitting keyboard includes a plurality of keys, a circuit switch module, and at least one light-emitting element. The circuit switch module is disposed below the keys and is depressible by the keys so as to transmit corresponding electrical signals. The circuit switch module includes at least one light-transmissive flexible circuit board. The flexible circuit board has a lower surface that is formed with at least one light reflecting point corresponding to a respective one of the keys. The light-emitting element is either disposed adjacent to a lateral edge of the flexible circuit board or embedded in the flexible circuit board to provide light into the flexible circuit board such that the light is propagated in the flexible circuit board and is scattered upward by the light-reflecting point.

Abstract: A keypad device includes a keypad with a plurality of keys in a defined order, and a light guide plate disposed under the keypad. The light guide plate includes a plurality of patterns formed by a method of printing on a surface thereof, and each pattern includes adhesive material and reflective material. The keypad device further includes at least one LED lamp disposed beside the light guide plate.

Abstract: A bicycle saddle mount includes a cushioning device disposed between a saddle member and a seat post and having a pair of frames each of which include a bent portion formed between the upper leg and the lower leg for forming an opening in each of the frames and for cushioning the saddle member, and two gaskets engaged in the openings of the frames for further cushioning the saddle member, a casing disposed between the gaskets, and a light device attached to the casing for generating an indicating or safety light and for allowing the bicycle saddle mount to be seen in a dark environment.

Abstract: A light guide device is provided. The light guide device of the present invention includes a substrate and a plurality of patterns disposed on a surface of the substrate, wherein a material of the pattern includes an adhesive and a reflective material.

Abstract: Disclosed is a mobile handheld electronic apparatus with a light guide device, which includes: at least one user interface; at least one light-emitting device; and a light conducting device, for conducting the light from the light-emitting device to provide desired light to the user interface, wherein the light-emitting device is located between the user interface and the light conducting device, or the light-emitting device is located between the user interface and the light-emitting device. The light conducting device can further comprise: a first light conducting part, for providing desired light for the first user interface; and a second light conducting part, for providing desired light for the second user interface, wherein the first light conducting part and the second light conducting part are integral; and the light-emitting device is located at the border of the first light conducting part and the second light conducting part.

Abstract: A light source unit for use in a backlight module includes a circuit substrate board and a plurality of chip assemblies arranged along a first direction of the circuit substrate board. Each of the chip assemblies includes a red LED chip, a blue LED chip, and a green LED chip. By employing a chip on board (COB) concept, and by providing LED chips of three primary colors directly on the circuit substrate board, chip spacing can be considerably reduced to effectively shorten the light mixing distance so as to permit miniaturization of the backlight module incorporating the light source unit.

Abstract: A saddle device includes a saddle member, and a cushioning device disposed between a seat post and the saddle member for cushioning the saddle member and having two frames. The frames each includes an upper leg secured to the saddle member, a lower leg secured to the seat post, and a bent portion formed between the upper leg and the lower leg. Two gaskets are engaged in the bent portions of the frames for changing the cushioning effects of the frames. The lower legs of the frames may be easily secured onto the typical seat posts without changing the structure of the seat posts.

Abstract: A saddle device includes a saddle member, and a cushioning device disposed between a seat post and the saddle member for cushioning the saddle member and having two frames. The frames each includes an upper leg secured to the saddle member, a lower leg secured to the seat post, and a bent portion formed between the upper leg and the lower leg. Two gaskets are engaged in the bent portions of the frames for changing the cushioning effects of the frames. The lower legs of the frames may be easily secured onto the typical seat posts without changing the structure of the seat posts.

Abstract: A power sucker includes a sucker member having a bore formed in the upper portion and having a valve seat. A handle is secured to the upper portion of the sucker member. A tube has a lower piston slidably received in the bore of the sucker member, and biased to engage with the valve seat. A hand grip is secured to the upper portion of the tube for pulling and disengaging the piston away from the valve seat. The tube includes an orifice and one or more openings and one or more air passages for releasing air when the piston is disengaged from the valve seat.