Abstract: An integrated circuit package structure includes a device die having a plurality of metal pillars, a molding material directly in contact with at least one side surface of the device die, a first dielectric layer disposed on the device die and on the molding material, and a testing pad disposed in the first dielectric layer and directly in contact with an interface between the device die and the molding material. The testing pad is electrical isolated from the metal pillars.

Abstract: A semiconductor device includes a first die having a first active surface and a first backside surface opposite the first active surface, a second die having a second active surface and a second backside surface opposite the second active surface, and an interposer, the first active surface of the first die being electrically coupled to a first side of the interposer, the second active surface of the second die being electrically coupled to a second side of the interposer. The semiconductor device also includes a first connector over the interposer, a first encapsulating material surrounding the second die, the first encapsulating material having a first surface over the interposer, and a via electrically coupling the first connector and the interposer. A first end of the via is substantially coplanar with the first surface of the first encapsulating material.

Abstract: A method of manufacturing a semiconductor structure includes forming a redistribution layer (RDL); forming a conductive member over the RDL; performing a first electrical test through the conductive member; disposing a first die over the RDL; performing a second electrical test through the conductive member; and disposing a second die over the first die and the conductive member.

Abstract: An integrated circuit package structure includes a device die having a plurality of metal pillars, a molding material directly in contact with at least one side surface of the device die, a first dielectric layer disposed on the device die and on the molding material, and a testing pad disposed in the first dielectric layer and directly in contact with an interface between the device die and the molding material. The testing pad is electrical isolated from the metal pillars.

Abstract: A mobile device and a method for managing background data transmission of the mobile device are provided. The method includes the following steps: recording a plurality of entries, obtaining a time limit for a background data transmission of the mobile device, and scheduling the background data transmission according to the time limit and the entries. Each of the entries includes a location of the mobile device when the entry is recorded, a time of the mobile device when the entry is recorded, and a network information of the mobile device when the entry is recorded. The time limit indicates a time point before which the background data transmission should be finished.

Abstract: An embodiment method includes providing a standardized testing structure design for a chip-on-wafer (CoW) structure, wherein the standardized testing structure design comprises placing a testing structure in a pre-selected area a top die in the CoW structure, and electrically testing a plurality of microbumps in the CoW structure by applying a universal testing probe card to the testing structure.

Abstract: An embodiment method includes providing a standardized testing structure design for a chip-on-wafer (CoW) structure, wherein the standardized testing structure design comprises placing a testing structure in a pre-selected area a top die in the CoW structure, and electrically testing a plurality of microbumps in the CoW structure by applying a universal testing probe card to the testing structure.

Abstract: An embodiment method includes providing a standardized testing structure design for a chip-on-wafer (CoW) structure, wherein the standardized testing structure design comprises placing a testing structure in a pre-selected area a top die in the CoW structure, and electrically testing a plurality of microbumps in the CoW structure by applying a universal testing probe card to the testing structure.

Abstract: Apparatus and method of making an improved moisture-resistant package for a MEMS device having movable parts, the package including a substrate, a translucent cover over the substrate, a seal and moisture barrier and a plurality of parallel sidewalls around the periphery of the substrate and cover. The sidewalls have ends and an area between the sidewalls, and the sidewalls separate the substrate and cover by a sufficient distance to provide clearance for the movement of the movable parts. The package is sealed using a glue layer that at least partially fills the area between the sidewalls, and lies between the ends of the sidewalls and one of the substrate or cover. The glue layer causes the substrate or cover, respectively, to adhere to the ends of the sidewalls. The glue layer and the sidewalls together prevent moisture from entering the package.

Abstract: A semiconductor device includes a first die having a first active surface and a first backside surface opposite the first active surface, a second die having a second active surface and a second backside surface opposite the second active surface, and an interposer, the first active surface of the first die being electrically coupled to a first side of the interposer, the second active surface of the second die being electrically coupled to a second side of the interposer. The semiconductor device also includes a first connector over the interposer, a first encapsulating material surrounding the second die, the first encapsulating material having a first surface over the interposer, and a via electrically coupling the first connector and the interposer. A first end of the via is substantially coplanar with the first surface of the first encapsulating material.

Abstract: A semiconductor device includes a first die having a first active surface and a first backside surface opposite the first active surface, a second die having a second active surface and a second backside surface opposite the second active surface, and an interposer, the first active surface of the first die being electrically coupled to a first side of the interposer, the second active surface of the second die being electrically coupled to a second side of the interposer. The semiconductor device also includes a first connector over the interposer, a first encapsulating material surrounding the second die, the first encapsulating material having a first surface over the interposer, and a via electrically coupling the first connector and the interposer. A first end of the via is substantially coplanar with the first surface of the first encapsulating material.

Abstract: A mobile device and a method for managing background data transmission of the mobile device are provided. The method includes the following steps: recording a plurality of entries, obtaining a time limit for a background data transmission of the mobile device, and scheduling the background data transmission according to the time limit and the entries. Each of the entries includes a location of the mobile device when the entry is recorded, a time of the mobile device when the entry is recorded, and a network information of the mobile device when the entry is recorded. The time limit indicates a time point before which the background data transmission should be finished.

Abstract: An embodiment method includes providing a standardized testing structure design for a chip-on-wafer (CoW) structure, wherein the standardized testing structure design comprises placing a testing structure in a pre-selected area a top die in the CoW structure, and electrically testing a plurality of microbumps in the CoW structure by applying a universal testing probe card to the testing structure.

Abstract: Apparatus and method of making an improved moisture-resistant package for a MEMS device having movable parts, the package including a substrate, a translucent cover over the substrate, a seal and moisture barrier and a plurality of parallel sidewalls around the periphery of the substrate and cover. The sidewalls have ends and an area between the sidewalls, and the sidewalls separate the substrate and cover by a sufficient distance to provide clearance for the movement of the movable parts. The package is sealed using a glue layer that at least partially fills the area between the sidewalls, and lies between the ends of the sidewalls and one of the substrate or cover. The glue layer causes the substrate or cover, respectively, to adhere to the ends of the sidewalls. The glue layer and the sidewalls together prevent moisture from entering the package.

Abstract: The present invention discloses a method of using ground penetrating radar to detect corrosion of steel bars in ferroconcrete components. The method comprises the following steps. Firstly, a ground penetrating radar is used to emit an electromagnetic wave toward a ferroconcrete component. Then, a reflected electromagnetic wave is received. The reflected electromagnetic wave is calculated to obtain characteristic parameters from the interface of the steel bar and the concrete, wherein the characteristic parameters includes reflection electric potential, specific resistance and corresponding specific electric current from the interface. Reference characteristic data which include reference thicknesses of the concrete versus reference reflected electric potential, specific resistance and corresponding specific electric current from the interface are provided.

Abstract: A printhead includes a silicon substrate, a first barrier layer, a second barrier layer, and a nozzle plate. The silicon substrate has a plurality of thermal elements and a main ink supply channel, each of the thermal elements being in a firing chamber of the first barrier layer and in fluid communications with the main ink supply channel through ink channels. The top of each ink firing elements is aligned with a nozzle on the nozzle plate. To satisfy the need for high-frequency ink ejection, the second barrier layer is utilized to provide an auxiliary ink supply channel for increasing the ink supply speed. The ink channel between the main ink supply and the ink channel inlet is enlarged in the vertical direction so as to lower the pressure and thus increase the ink supply speed.

Abstract: A method of manufacturing a piezoelectric ink-jet print-head uses a metallic layer and a thick film layer with a slot hole therein instead of a ceramic vibration plate and an ink layer. The piezoelectric layer and the upper electrode layer are formed inside the ink cavity so that overall thickness of the print head is reduced. To form the ink-jet print head, a metallic layer and a lower electrode layer are sequentially formed over a substrate. A patterned piezoelectric layer and an upper electrode layer are sequentially formed over the lower electrode layer. A patterned thick film layer with a slot hole therein is formed over the metallic layer. The thick film layer and the metallic layer together form a cavity that encloses the piezoelectric layer and the upper electrode layer. A nozzle plate having a nozzle thereon is attached to the thick film layer. The nozzle plate, the thick film layer and the metallic layer together form an ink cavity. The hole in the nozzle is continuous with the ink cavity.

Abstract: A printhead includes a silicon substrate, a first barrier layer, a second barrier layer, and a nozzle plate. The silicon substrate has a plurality of thermal elements and a main ink supply channel, each of the thermal elements being in an firing chamber of the first barrier layer and in fluid communications with the main ink supply channel through ink channels. The top of each ink firing elements is aligned with a nozzle on the nozzle plate. To satisfy the need for high-frequency ink ejection, the invention utilizes the second barrier layer to provide an auxiliary ink supply channel for increasing the ink supply speed. The ink channel between the main ink supply channel and the ink channel inlet is enlarged in the vertical direction so as to lower the pressure and thus increase the ink supply speed.

Abstract: A pressure chamber of a piezoelectric ink jet print head and a fabrication method thereof. The pressure chamber comprises a substrate, a concave chamber formed on the substrate, having an opening of a relatively large sectional area and a bottom of a relatively small sectional area, a vibrating plate formed above the concave chamber, and a piezoelectric unit on the vibrating plate.

Abstract: A piezoelectric ink jet print head and a fabrication method for a vibrating layer thereof. An adhesion layer is formed between the bottom of a first silicon wafer and the top of a second silicon wafer for bonding thereof. The first silicon wafer serves as a vibrating layer, the second silicon wafer has a plurality of ink chambers spaced apart from each other, and the adhesion layer serves as an etching stop layer for the ink chambers. A piezoelectric material layer is formed on the top of the first silicon wafer, and a hard mask layer is formed on the bottom of the second silicon wafer for defining the pattern of the ink chambers.