Patents by Inventor Chen-Jung Tsai

Chen-Jung Tsai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Multiple-step inner lead of leadframe
    Publication number: 20020158316
    Abstract: The present invention provides a structure of a stacked-type multi-chip stack package of the leadframe. The shape of the stair-like inner leads can be regulated for the high and the amount of stacked chips and to match different bonding technology. The process for forming the present structure can be easily performed by visible equipment and materials, and the present structure can raise the reliability of bonding process. The present invention can stack multi-chip (more than two).
    Type: Application
    Filed: April 26, 2001
    Publication date: October 31, 2002
    Applicant: MACRONIX INTERNATIONAL CO., LTD.
    Inventors: Jui-Chung Lee, Chen-Jung Tsai, Chih-Wen Lin