Abstract: An automatic test method and apparatus, an electronic device, and a storage medium are provided, which relate to the fields of the automatic test, the voice testing, the voice effect acceptance check, etc. The method includes: receiving a test task initiated by a visualization front-end; issuing the test task to a plurality of clients deployed; and scheduling execution of the test task for the plurality of clients, and feeding back obtained task execution results to the visualization front-end.

Abstract: A cabinet for goods storage and access is provided, including: at least one fixed shelf configured to store goods; a moving member located on a side of the fixed shelf; a controller configured to control the moving member to move along the side of the fixed shelf to place goods in the fixed shelf or extract goods from the fixed shelf; a cabinet body surrounding the fixed shelf and the moving member, wherein a first slot is disposed on the cabinet body and adjacent to a moving track of the moving member, wherein the controller is configured to control the first slot to be opened or closed; and a volume recognizer disposed adjacent to the first slot to recognize a volume of goods entering the first slot.

Abstract: A layout structure of flexible circuit board includes a flexible substrate, a chip and a circuit layer. A chip mounting area and a circuit area are defined on a top surface of the flexible substrate. The chip is mounted on the chip mounting area, a space exists between a first bump and a second bump of the chip, and there are no additional bumps between the first and second bumps. A first inner lead, a second inner lead, a first dummy lead and a second dummy lead of the circuit layer are located on the chip mounting area. The first and second inner leads are electrically connected to the first and second bumps respectively. The first dummy lead is connected to the first inner lead and adjacent to the first bump, and the second dummy lead is connected to the second inner lead and adjacent to the second bump.

Abstract: A flexible circuit board includes a flexible substrate, a chip and a patterned circuit layer. A surface of the flexible substrate is separated into a working area and a nonworking area according to a cutting line. The chip is disposed on the working area. The patterned circuit layer is disposed on the surface and includes signal transmission wires and bypass wires, the bypass wires are not electrically connected to the chip. Each of the bypass wires includes a bypass transmission portion located on the working area and an anti-peeling portion located on the nonworking area. A blank area exists between the anti-peeling area and the bypass transmission portion, and the cutting line passes through the blank area. A distance between 100 um and 400 um exists from the anti-peeling portion to the cutting line.

Abstract: A flip chip package includes a circuit board, a chip and a solder layer. The chip is mounted on an inner bonding area of the circuit board. The solder layer is located between the circuit board and the chip for bonding bumps to inner leads and a T-shaped circuit unit is on the inner bonding area. The T-shaped circuit unit has a main part, a connection part, and a branch part. The connection part is connected to the main and branch parts, respectively. The main part extends along a lateral direction and the branch part extends outwardly along a longitudinal direction. The connection part is narrower than the main part in width so as to inhibit solder shorts caused by solder overflow on the branch part.

Abstract: A layout structure of flexible circuit board includes a flexible substrate, a circuit layer, a flip-chip element and an anti-stress circuit layer. A chip mounting area and a circuit area are defined on a top surface of the flexible substrate. Bonding circuits and transmission circuits of the circuit layer are disposed on the chip mounting area and the circuit area respectively. The flip-chip element is disposed on the chip mounting area and includes bumps and a chip having a long side margin and conductive pads, the bumps are provided to connect the conductive pads and the bonding circuits. Anti-stress circuits of the anti-stress circuit layer are disposed on the chip mounting area and parallel to the long side margin of the chip, and the bumps are located between the anti-stress circuits and the long side margin of the chip.

Abstract: Disclosed herein are membranes comprising: porous substrate; and two or more graphene oxide (GO) sheets disposed on the porous substrate, each GO layer comprising a plurality of GO flakes, each GO flake comprising a planar graphene structure with oxygen moieties extending therefrom, wherein the membrane, when a pressure from 10 bar to 50 bar of transmembrane pressure is applied from 1 hour to 48 hours, has an aqueous flux wherein the aqueous flux changes by 5% or less while the pressure is applied. The membranes can also include an intercalating agent disposed between the two or more GO sheets, the intercalating agent interacting with each GO sheet, wherein the intercalating agent provides a non-covalent stabilization of the two or more GO sheets. Also disclosed herein are methods of making and using the same and systems for implementing the same.

Abstract: The disclosure provides a display image adjustment method and an augmented reality display device. The display image adjustment method includes the following steps. Received image data is converted to a coordinate system of the augmented reality display device to obtain initial coordinate information. An initial image is provided to an active display region of the augmented reality display device based on the initial coordinate information. The initial coordinate information is adjusted in a virtual adjustment coordinate region to obtain adjusted coordinate information when an adjustment command is received. An adjusted image is provided to the active display region of the augmented reality display device based on the adjusted coordinate information. The display image adjustment method and the augmented reality display device proposed by the disclosure may adjust display content of the AR display device according to user's needs.

Abstract: A wearable device and a method for adjusting a display state based on an environment are provided. The method is adapted for the wearable device. The method includes: capturing an environmental image; when determining that there is a specific object in the environmental image, determining a display mode of a display circuit based on the specific object; and controlling the display circuit to be adjusted to a display state corresponding to the display mode.

Abstract: Recommendation system for processing an input dataset that identifies a set of users, a set of items, and user-item interaction data. A plurality of unique triplets are identified based on the input dataset, wherein each triplet includes: a positive user-item pair; and a negative user-item pair. Over a plurality of training iterations system parameters are learned, including (i) a set of model embeddings for generating respective user-item relevance scores for the positive user-item pairs and the negative user-item pairs; and (ii) weight parameters for each of the triplets. The learning is configured to jointly optimize the model embeddings and the weight parameters to reach a learning objective that is based on weighted difference values determined for the triplets.

Abstract: A recommendation system (RS) for processing an input dataset that identifies a set of users, a set of items, and user-item interaction data about historic interactions between users in the set of users and items in the set of items. The RS is configured to: generate, based on a user-item interaction dataset, a user-user similarity dataset and an item-item similarity dataset, filter the user-user similarity dataset based on a user similarity threshold vector that includes a respective user similarity threshold value for each user, filter the item-item similarity dataset based on an item similarity threshold vector including a respective item similarity threshold value for each item generate a set of user neighbour embeddings based on the filtered user-user similarity dataset, and generating a set of item neighbour embeddings based on the filtered item-item similarity dataset.

Abstract: A flexible circuit board includes a flexible substrate, a chip and a patterned circuit layer. A surface of the flexible substrate is separated into a working area and a nonworking area according to a cutting line. The chip is disposed on the working area. The patterned circuit layer is disposed on the surface and includes signal transmission wires and bypass wires, the bypass wires are not electrically connected to the chip. Each of the bypass wires includes a bypass transmission portion located on the working area and an anti-peeling portion located on the nonworking area. A blank area exists between the anti-peeling area and the bypass transmission portion, and the cutting line passes through the blank area. A distance between 100 um and 400 um exists from the anti-peeling portion to the cutting line.

Abstract: A flip chip interconnection including a circuit board is disclosed. The circuit board includes a substrate, inner leads, a T-shaped circuit line and a dummy pattern. The inner leads, the T-shaped circuit line and the dummy pattern are located on an inner bonding area of the substrate. The T-shaped circuit line includes a main segment, a branch segment and a connection segment that is connected to the main segment and the branch segment. The main segment and the branch segment are extended along a lateral direction and a longitudinal direction, respectively. The dummy pattern is located between the connection segment and the inner leads.

Abstract: A layout structure of flexible circuit board includes a flexible substrate, a chip and a circuit layer. A chip mounting area and a circuit area are defined on a top surface of the flexible substrate, the circuit area surrounds the chip mounting area. The chip is mounted on the chip mounting area of the top surface and includes a bump. The circuit layer is disposed on the top surface. A connection portion of the circuit layer extends across a first side of the chip mounting area and into the chip mounting area. A transmission portion of the circuit layer is located on the circuit area and electrically connected to the connection portion. A stress release portion of the circuit layer is located between the transmission portion and a second side of the chip mounting area and is a comb-shaped structure.

Abstract: Provided is use of IL-15 protein complex joint PD-L1 antibody for treating tumor diseases.

Abstract: A layout structure of flexible circuit board includes a flexible substrate, a chip and a circuit layer. A chip mounting area and a circuit area are defined on a top surface of the flexible substrate. The chip is mounted on the chip mounting area, a space exists between a first bump and a second bump of the chip, and there are no additional bumps between the first and second bumps. A first inner lead, a second inner lead, a first dummy lead and a second dummy lead of the circuit layer are located on the chip mounting area. The first and second inner leads are electrically connected to the first and second bumps respectively. The first dummy lead is connected to the first inner lead and adjacent to the first bump, and the second dummy lead is connected to the second inner lead and adjacent to the second bump.

Abstract: A layout structure of flexible circuit board includes a flexible substrate, a chip and a circuit layer. A chip mounting area and a circuit area are defined on a top surface of the flexible substrate, the circuit area surrounds the chip mounting area. The chip is mounted on the chip mounting area of the top surface and includes a bump. The circuit layer is disposed on the top surface. A connection portion of the circuit layer extends across a first side of the chip mounting area and into the chip mounting area. A transmission portion of the circuit layer is located on the circuit area and electrically connected to the connection portion. A stress release portion of the circuit layer is located between the transmission portion and a second side of the chip mounting area and is a comb-shaped structure.

Abstract: The disclosure provides a projector and a projector firmware updating method therefor. The projector is connected to a cloud server through a network connection. The first processor of the projector executes a first firmware updating process corresponding to a request firmware, including: identifying the first request unique identification code of the projector and the request firmware serial number of the request firmware, and transmitting the first request unique identification code and the request firmware serial number to the cloud server; if the request firmware is not the latest version, receiving the first target firmware from the cloud server and updates the request firmware by using the first target firmware, and completing the first firmware updating process. The projector and projector firmware updating method of the disclosure can efficiently update the firmware to the latest or specific version according to the unique identification code of the projector.

Abstract: Disclosed is a method for calculating combustion in the bed of a waste incinerator. The method is based on a model of combustion in a waste incinerator bed and comprises a water evaporation model, a volatile matter analysis model, a volatile matter combustion model, and a fixed carbon combustion model. The volatile matter of the volatile matter combustion model comprises CO, H2, CH4, NH3, and H2S. The volatile matter combustion model comprises a combustion reaction equation for said volatile matter and O2, and respective equations for CO and CH4 reacting with water vapor. Equations governing the model of combustion in the bed of a waste incinerator comprise a continuity equation, an energy equation, a momentum equation, and a component equation. Boundary conditions of said governing equations comprise: equations of heat transfer and mass transfer from an upper boundary layer of the bed to the exterior; and equations of heat transfer and mass transfer from lower boundary layer of the bed to the exterior.

Abstract: An underwater camera system for monitoring fish in a fish pen is described. A stereoscopic camera may be used to determine dimensions of fish, and the underwater camera system may use the fish dimensions to estimate a biomass value of fish within the fish pen. The biomass value and rates of change of the biomass value may be used to adjust feeding of the fish in the fish pen. Images captured by the stereoscopic camera may be used to focus a variable focal lens camera on a fish to obtain high-resolution images that can be used for diagnosing fish conditions. Images captured by the stereoscopic camera may be used to predict motion of the fish, and the predicted motion may be used to generate various fish monitoring analytic values. The fish monitoring analytic values may be used to automatically control operation of the fish pen.