Abstract: A light-emitting diode includes a semiconductor layer sequence. The semiconductor layer sequence includes a first semiconductor layer, a second semiconductor layer and an active layer, and further includes a first mesa and a second mesa. The first mesa has a current blocking structure adjacent to the second mesa and a current conduction portion located below the current blocking structure. The first semiconductor has a first surface facing away from the active layer, the first mesa is provided with a second surface facing away from the first surface, a distance between the second surface and the first surface is greater than or equal to a half of a thickness of the first semiconductor layer, and the current conduction portion has a height in a thickness direction of the semiconductor layer sequence being ? to ½ of the thickness of the first semiconductor layer. The light-emitting diode can improve carrier injection efficiency.

Abstract: A material preview method, a medium and an electronic device are provided. The method includes: acquiring a material to be previewed and target preview information, wherein the target preview information comprises a target cloud real machine and an application for showing the material to be previewed, and a target showing style in which the application shows the material to be previewed; and rendering, according to the target cloud real machine and the application in combination with the target showing style, the material to be previewed to obtain a target preview content, wherein the target preview content is to be shown on a terminal device.

Abstract: A bakery premix powder for preparing a donut-type bakery product is provided. The bakery premix powder includes starch, the starch includes hydroxypropyl starch and acetate starch, and a weight ratio of the hydroxypropyl starch to the acetate starch is ranged between 2:1 and 3:1.

Abstract: A display panel has a plurality of pixel areas and a peripheral area surrounding the pixel areas, and includes a substrate, at least two planarization layers, a plurality of pads, a first dummy pattern, and a plurality of light-emitting devices. The substrate has a first substrate edge extending in a first direction. The at least two planarization layers are disposed on the substrate. The pads are disposed on the at least two planarization layers, and are located in the pixel areas. The pads include at least one first edge pad closest to the first substrate edge. The first dummy pattern is disposed on the at least two planarization layers, and extends in the peripheral area between the at least one first edge pad and the first substrate edge. The light-emitting devices are electrically connected to the pads.

Abstract: A developing cartridge includes: a cartridge body for accommodating developers; a driving part at a first end in a first direction; a developing roller rotatable about a rotation axis extending along the first direction and positioned at a third end in a second direction; a storage medium for storing information; an electrical contact surface electrically connected to the storage medium and fixed relative to the cartridge body, and a lifting element configured to lift up the cartridge body in the third direction. The electrical contact surface is positioned at the first end in the first direction and is farther away from the developing roller relative to the driving part. The lifting element is farther away from the developing roller in the second direction away from the driving part.

Abstract: A pump health analysis method and a pump health analysis device using the same are provided. A standard vibration curve of a standard pump is obtained. The standard vibration curve is converted from a time domain to a frequency domain to obtain a first frequency distribution curve. A sample vibration curve of a sample pump is obtained. The sample vibration curve is converted from the time domain to the frequency domain to obtain a second frequency distribution curve. The first frequency distribution curve is compared with the second frequency distribution curve by using a cosine similarity algorithm to obtain a health index of the sample pump.

Abstract: A semiconductor package includes a photonic integrated circuit (PIC) die having a photonic layer, and an electronic integrated circuit (EIC) die bonded to the PIC die. The EIC die includes an optical region that allows the transmission of optical signals through the optical region towards the photonic layer, and a peripheral region outside of the optical region. The optical region includes optical concave/convex structures, a protection film and optically transparent material layers. The optical concave/convex structures are formed in the semiconductor structure. The protection film is conformally disposed over the optical concave/convex structures. The optically transparent material layers are disposed over the protection film and filling up the optical region. The peripheral region includes first bonding pads bonded to the photonic integrated circuit die, and via structures connected to the first bonding pads, wherein the protection film is laterally surrounding sidewalls of the via structures.

Abstract: In a method for counting embryos developing in a uterus of Caenorhabditis elegans, a complete set of experimental procedures are designed to count embryos in the uterus of Caenorhabditis elegans by using Caenorhabditis elegans as a model organism. The method is applicable to Caenorhabditis elegans exposed from an L1 stage to a final stage of pregnancy, and can provide an easy-to-observe, fast, simple, accurate and reliable experimental method to apply Caenorhabditis elegans to research of reproductive ability, detection results of which are highly accurate and reliable, and the experimental method is suitable for promotion.

Abstract: The application discloses a method, apparatus and system for scanning an animal. The method includes obtaining a species of an animal to be scanned, identifying a type of an animal cabin where the animal to be scanned is located, and determining whether the species of the animal to be scanned matches the type of the animal cabin, determining and presenting a corresponding scanning protocol that matches the species of the animal to be scanned if the species of the animal to be scanned matches the type of the animal cabin, and perform a scan according to the corresponding scanning protocol, or according to a user-defined scanning protocol.

Abstract: A vibration-absorbing structure for packaging a crystal resonator includes a package base, a resonant crystal blank, and a top cover. The top of the package base has a recess. The sidewall of the package base surrounds the recess. The resonant crystal blank has a border area, at least one serpentine connection area, and a resonant area. The serpentine connection area is connected between the border area and the edge of the resonant area. The border area is arranged on the sidewall. The top cover, arranged on the border area, covers the recess, the at least one serpentine connection area, and the resonant area.

Abstract: A system for providing medication to a customer includes a movable structure with a robotic arm including one or more joints, actuators, and segments, each of which is structured to move a robotic manipulator coupled to an end of the robotic arm. The robotic manipulator is configured to retrieve and release a container containing the medication. The robotic arm further includes a camera and microphone, as well as a computing system that includes at least one processor coupled to a memory storing instructions. When executed by the at least one processor, the memory causes the computing system to capture identifying data regarding a customer; identify the customer based on the identifying data; associate the customer with a medication order; and retrieve.

Abstract: An image distortion correction method and an apparatus, where the method includes: performing optical distortion correction on a collected source image to obtain a first corrected image, where the first corrected image includes a background region and a portrait in which stretching deformation occurs, and where the portrait in which stretching deformation occurs includes at least a first human body region in which stretching deformation occurs and a second human body region in which stretching deformation occurs; and performing algorithm constraint correction on the first human body region, the second human body region, and the background region to obtain a second corrected image, where constraint terms used for the algorithm constraint correction respectively constrain the first human body region, the second human body region, and the background region.

Abstract: A method for implementing a real-time soft bus oriented to an intelligent rail transit system includes: defining a data type for interaction between a server and a communication front-end processor, where the defined data type is a message structure body which includes a message header and a message body; enabling professional subsystems to construct at least one publisher entity and/or at least one subscriber entity, respectively, where the data type of the communication between the publisher entity and the subscriber entity corresponding thereto is a message structure body. The subsystems choose to subscribe to the data of its interest, or to publish the data that it can provide.

Abstract: A method of forming a semiconductor package is provided. The method includes forming a micro lens recessed from the top surface of a substrate. A concave area is formed between the surface of the micro lens and the top surface of the substrate. The method includes depositing a first dielectric material that fills a portion of the concave area using a spin coating process. The method includes depositing a second dielectric material that fills the remainder of the concave area and covers the top surface of the substrate using a chemical vapor deposition process. The method includes planarizing the second dielectric material. The method includes forming a bonding layer on the planarized second dielectric material and over the top surface of the substrate. The method includes bonding a semiconductor wafer to the substrate via the bonding layer.

Abstract: A sensor package structure includes a substrate, a sensor chip and a ring-shaped solder mask frame those are disposed on the substrate, a ring-shaped support disposed on a top side of the annular solder mask frame, and a light permeable member that is disposed on the ring-shaped support. The sensor chip is electrically coupled to the substrate. A top surface of the sensor chip has a sensing region, and the sensing region is spaced apart from an outer lateral side of the sensor chip by a distance less than 300 ?m. The ring-shaped solder mask frame surrounds and contacts the outer lateral side of the sensor chip. The light permeable member, the ring-shaped support, and the sensor chip jointly define an enclosed space.

Abstract: A monitoring method and a monitoring system for a machine tool to machine a workpiece are provided. The monitoring method includes the following steps. First, a vibration signal of a spindle of the machine tool is detected. Next, a vibration feature value of the vibration signal is obtained. Whether the vibration feature value exceeds a threshold condition is determined, wherein the threshold condition is determined by a training model based on a predetermined surface quality of the workpiece. When the vibration feature value exceeds the threshold condition, a machining parameter of the machine tool is adjusted.

Abstract: A micro light-emitting device includes a semiconductor epitaxial structure having a bottom surface and a top surface opposite to each other, and including a first cladding layer, an active layer, and a second cladding layer disposed sequentially in such order in a direction from the bottom surface to the top surface. At least one of the first and second cladding layers has a super-lattice structure. The super-lattice structure of the first cladding layer includes first sublayers and second sublayers stacked alternately. Each first sublayer includes Alx1Ga1-x1InP, and each second sublayer includes Alx2Ga1-x2InP, where 0<x1<x2?1. The super-lattice structure of the second cladding layer including third sublayers and fourth sublayers stacked alternately. Each third sublayer includes Alz1Ga1-z1InP, and each fourth sublayer includes Alz2Ga1-z2InP, where 0<z1<z2?1.

Abstract: A computing system generates recommendations for users within the context of a network service. To account for objectives of various users associated with the network service, some of which may not reach optimality at the same time, the computing system generates values associated with each of the objectives separately. For example, for each objective, the system may train a computer model to produce a representative value. To generate a recommendation of an entity for a user, the system uses the generated objective values as inputs to an optimization algorithm. The optimization step may use linear programming or quadratic programming to generate a recommendation score, for example. This two-step process allows the system to account for multiple objectives and makes the system easily adaptable to change when the set of objectives is updated.

Abstract: A display substrate is provided, including: pixel units on a base substrate; and a first conductive layer, a buffer layer, a semiconductor layer, a first insulation layer, and a second conductive layer which are arranged on the base substrate in a direction away from the base substrate. The display substrate further includes at least one conductive via hole passing through at least the first insulation layer, and at least one conductive plug through which the second conductive portion is electrically connected to the first conductive portion. The first conductive portion includes first and second conductive sub-portions, an orthographic projection of the first conductive sub-portion on the base substrate at least partially overlaps with that of the at least one conductive via hole on the base substrate, and in a third direction, a thickness of the first conductive sub-portion is greater than that of the second conductive sub-portion.