Abstract: An light device, includes a plurality of first light cells arranged axisymmetrically about an axis; a plurality of second light cells arranged axisymmetrically around the axis; and a controller coupled to a brightness adjust unit, and determines whether to activate the first light cells and second light cells according to a brightness adjust value of the brightness adjust unit, wherein the average distance between the first light cells and the axis is shorter than the average distance between the second light cells and the axis.

Abstract: A method for fabricating a wafer-level light emitting diode structure is provided. The method includes: providing a substrate, wherein a first semiconductor layer, a light emitting layer, and a second semiconductor layer are sequentially disposed on the substrate; subjecting the first semiconductor layer, the light emitting layer, and the second semiconductor layer with a patterning process to form a first depressed portion, a second depressed portion, a stacked structure disposed on the second depressed portion and a remained first semiconductor layer disposed on the depressed portion, wherein the stacked structure comprises a patterned second semiconductor layer, a patterned emitting layer, and a patterned first semiconductor layer; forming a first electrode on the remained first semiconductor layer of the first depressed portion; and forming a second electrode correspondingly disposed on the patterned second semiconductor layer of the second depressed portion.

Abstract: Embodiments of the present application relate to a method, apparatus, and system for presenting information.

Abstract: A non-contact electrocardiogram (ECG) sensor having an ECG electrode and guard electrode coupled to an electronic circuit that actively gain-corrects the electrocardiogram signal based on fringe capacitance signal and filters the gain-corrected signal based on a static charge reference signal. The compensation system first makes a gain correction for the preamplifier to address ECG electrode-to-subject motion and then removes any additive static common mode interference from motion-induced static charge generation.

Abstract: A computer implemented method and an interactive guide management system (IGMS) for creating and managing interactive guides (IGs) for multiple items with feedback collection and customer support are provided. The IGMS creates IGs based on media content specific to the items received from item provider devices and stores the IGs in a guide management database (GMD). The IGMS generates a client application that displays the IGs for each item and interface elements for executing interactive functions based on functional inputs on a customer device. The GMD transmits the IGs to the client application based on item information for display in a stepwise manner. The IGMS receives customer inputs, functional inputs, and feedback information provided by the customer device via multiple communication modes from the client application via a network for providing real time or time shifted support, dynamically updating and managing the IGs, and performing one or more interactive functions.

Abstract: A light emitting diode includes a semiconductor stacked structure, a substrate, a first electrode, a second electrode and a third electrode. The semiconductor stacked structure includes a first semiconductor layer, a second semiconductor layer and a light emitting layer. An undoped semiconductor layer over the first semiconductor layer may be not removed or not completely removed to increase the strength of the semiconductor stacked structure and improve the reliability of the LED and the production yields of manufacturing process. A roughened structure (or a photonic crystal) can be formed on the undoped semiconductor layer when the semiconductor stacked structure to improve the light emitting efficiency of the LED.

Abstract: A light emitting diode includes a semiconductor stacked structure, a substrate, a first electrode, a second electrode and a third electrode. The semiconductor stacked structure includes a first semiconductor layer, a second semiconductor layer and a light emitting layer. A light extraction layer with a roughened structure is formed on the doped semiconductor layer to improve the light emitting efficiency of LED. Furthermore, the strength of the semiconductor stacked structure can be enhanced by the light extraction layer, to improve the reliability of the LED and the production yields of manufacturing process.

Abstract: Provided is a substrate, including a substrate material, two conductive structures, and at least one diode. The two conductive structures extend from a first surface of the substrate material to a second surface of the substrate material via two through holes penetrating through the substrate material. The at least one diode is embedded in the substrate material at a sidewall of one of the through holes.

Abstract: A light emitting device and a fabricating method thereof are described, wherein the light emitting device includes a substrate, a wall, a first LED chip and a light conversion filling. The first LED chip is disposed on a surface of the substrate. The wall is disposed on the surface of the substrate, and surrounds the first LED chip. A first angle between a central axis of the wall and an inner surface of the wall is 0 degree or is acute, a second angle between the central axis of the wall and an outer surface of the wall is 0 degree or is acute, and the outer surface of the wall and the substrate has a space therebetween. The light conversion filling is surrounded by the light conversion wall, and is disposed on the first LED chip.

Abstract: An illumination device including a base, a heat dissipation member, at least one flexible printed circuit board (FPC), and a plurality of light-emitting elements is provided. The heat dissipation member disposed on the base has a central axis, a plurality of holding curvy surfaces and a plurality of heat dissipation channels extending along the central axis, wherein the holding curvy surfaces and the heat dissipation channels are staggered and arranged about the central axis, and each of the holding curvy surfaces radially extends along the central axis. The flexible printed circuit board is disposed on the holding curvy surfaces. The light-emitting elements are disposed on the flexible printed circuit board. An assembling method of the illumination device is also provided.

Abstract: A light-emitting diode package structure including a chip carrier portion, a light-emitting diode chip, and a package material is provided. The light-emitting diode chip is disposed on the chip carrier portion of the package. The package material is filled in the chip carrier portion and covers the light-emitting diode chip. The package material includes a matrix material, a plurality of first powder particles, and a plurality of second powder particles. The first powder particles and the second powder particles are distributed in the matrix material. Each first powder particle is a wavelength conversion material. Each second powder particle has a shell-like structure.

Abstract: A computer implemented method and system provides a mobile application development platform (MADP) for dynamically creating a healthcare provider specific customizable composite mobile application (CCMA) and monitoring healthcare elements of a healthcare recipient using the CCMA. The MADP is accessible by a healthcare provider device and a healthcare recipient device via a network. The MADP stores multiple template objects, for example, sub-applications that perform tasks for monitoring the healthcare elements in an application management database (AMD). The MADP acquires a selection of one or more template objects and one or more dynamic content objects defined by a healthcare provider and dynamically creates the CCMA by integrating the selected template objects and dynamic content objects. The MADP stores the CCMA in the AMD. The CCMA facilitates communication between the healthcare provider device and the healthcare recipient device for monitoring the healthcare elements of the healthcare recipient.

Abstract: A light emitting diode includes a semiconductor stacked structure, a substrate, a first electrode, a second electrode and a third electrode. The semiconductor stacked structure includes a first semiconductor layer, a second semiconductor layer and a light emitting layer. The first semiconductor layer has a first surface and a second surface opposite to each other and has a first region and a second region. The second semiconductor layer is disposed on the second surface. The light emitting layer is disposed between the first semiconductor layer and the second semiconductor layer. The substrate has a first conductive layer and a second conductive layer thereon. The first electrode is disposed between the second semiconductor layer and the first conductive layer. The second electrode is disposed on the first surface. The third electrode is disposed between the second region and the second conductive layer, and electrically connected to the second electrode.

Abstract: Methods for application management in an electronic device are provided. It is first determined whether the application to be installed is listed in a first list, wherein the first list lists a set of applications which are hardware accelerable. The application is then marked as a hardware accelerable application in response to the application being listed in the first list. Thereafter, the application is installed, wherein a hardware acceleration function of the application is enabled to activate a hardware acceleration unit of the electronic device for hardware acceleration during executing the application being marked as the hardware accelerable application.

Abstract: A non-contact electrocardiogram (ECG) sensor having an ECG electrode and guard electrode coupled to an electronic circuit that actively gain-corrects the electrocardiogram signal based on fringe capacitance signal and filters the gain-corrected signal based on a static charge reference signal. The compensation system first makes a gain correction for the preamplifier to address ECG electrode-to-subject motion and then removes any additive static common mode interference from motion-induced static charge generation.

Abstract: A light emitting diode chip, a light emitting diode package structure and a method for forming the same are provided. The light emitting diode chip includes a bonding layer, which has a plurality of voids, or a minimum horizontal distance between a surrounding boundary of the light emitting diode chip and the bonding layer is larger than 0. The light emitting diode chip, the light emitting diode package structure and the method may improve the product yields and enhance the light emitting efficiency.

Abstract: A light-emitting diode (LED) package structure including a carrier substrate, at least one LED chip, an optical element and a thermal-conductive transparent liquid is provided. The LED chip is disposed on the carrier substrate and has an active layer. The optical element is disposed on the substrate and forms a sealed space with the carrier substrate, and the LED chip is disposed in the sealed space. The thermal-conductive transparent liquid fills up the sealed space.

Abstract: Disclosed is a system and method for capturing technical documents and reading and commentating captured documents thereof. The system may comprise a capturing system and a reading with commentating system. The capturing system selects related drawings from a group of technical documents. It then provides important information and the related drawings onto an image for the readers' review. The reading with commentating system allows the readers to process technical classification, management and export/import for the group of technical documents. Readers may make comments on an information sharing platform after reviewing the technical documents. Besides, other materials collected or generated from the technical analysis on the technical documents may be attached to the information sharing platform.

Abstract: A manufacturing method of a bubble-type micro-pump is provided. At least a bubble-generating unit is provided on the bubble-generating section. Because of the varied surface energies on the top of the bubble-generating section, the varied backfilling velocities of the fluid of the front end and the rear end cause fluid moving when a bubble vanishes. The top surface of the bubble-generating section is subjected to a particular surface treatment to form a surface energy gradient. Examples of surface treatment include sputtering a thin film with varied densities or thickness, radiating one or multi-layer thin films by a laser beam, etc.