Patents by Inventor Chen-Peng Hsu
Chen-Peng Hsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20120199862Abstract: A light-emitting diode (LED) package structure including a carrier substrate, at least one LED chip, an optical element and a thermal-conductive transparent liquid is provided. The LED chip is disposed on the carrier substrate and has an active layer. The optical element is disposed on the substrate and forms a sealed space with the carrier substrate, and the LED chip is disposed in the sealed space. The thermal-conductive transparent liquid fills up the sealed space.Type: ApplicationFiled: April 17, 2012Publication date: August 9, 2012Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Chao-Wei Li, Chen-Peng Hsu, Yao-Jun Tsai, Hung-Lieh Hu
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Patent number: 8193541Abstract: A light emitting diode (LED) structure and a LED packaging structure are disclosed. The LED structure includes a sub-mount, a stacked structure, an electrode, an isolation layer and a conductive thin film layer. The sub-mount has a first surface and a second surface opposite the first surface. The stacked structure has a first semiconductor layer, an active layer and a second semiconductor layer that are laminated on the first surface. The electrode is disposed apart from the stacked structure on the first surface. The isolation layer is disposed on the first surface to surround the stacked structure as well as cover the lateral sides of the active layer. The conductive thin film layer connects the electrode to the stacked structure and covers the stacked structure.Type: GrantFiled: December 29, 2010Date of Patent: June 5, 2012Assignee: Industrial Technology Research InstituteInventors: Yao-Jun Tsai, Chen-Peng Hsu, Hung-Lieh Hu, Ji-Feng Chen
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Patent number: 8129726Abstract: A light-emitting diode (LED) package having electrostatic discharge (ESD) protection function and a method of fabricating the same adopt a composite substrate to prepare an embedded diode and an LED, and use an insulating layer in the composite substrate to isolate some individual embedded diodes, such that the LED device has the ESD protection.Type: GrantFiled: July 29, 2008Date of Patent: March 6, 2012Assignee: Industrial Technology Research InstituteInventors: Chih-Tsung Shih, Chen-Peng Hsu, Kuan-Chieh Tu, Hung-Lieh Hu, Bing-Ru Chen, Shih-Tsai Huang, Hsin-Yun Tsai
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Patent number: 8115218Abstract: A light emitting diode (LED) package structure includes a carrier, a first protrusion, a LED chip, and an adhesion layer. The first protrusion is disposed on the carrier and has a first opening to expose the carrier. The LED chip is disposed in the first opening on the carrier, and a ratio between a width of the first opening and a width of the LED chip is 1˜1.5. The adhesion layer is disposed between the LED chip and the carrier to bond the LED chip to the carrier.Type: GrantFiled: July 13, 2009Date of Patent: February 14, 2012Assignee: Industrial Technology Research InstituteInventors: Yao-Jun Tsai, Chen-Peng Hsu, Chao-Wei Li, Hung-Lieh Hu
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Publication number: 20120034714Abstract: A method for fabricating a wafer-level light emitting diode structure is provided. The method includes: providing a substrate, wherein a first semiconductor layer, a light emitting layer, and a second semiconductor layer are sequentially disposed on the substrate; subjecting the first semiconductor layer, the light emitting layer, and the second semiconductor layer with a patterning process to form a first depressed portion, a second depressed portion, a stacked structure disposed on the second depressed portion and a remained first semiconductor layer disposed on the depressed portion, wherein the stacked structure comprises a patterned second semiconductor layer, a patterned emitting layer, and a patterned first semiconductor layer; forming a first electrode on the remained first semiconductor layer of the first depressed portion; and forming a second electrode correspondingly disposed on the patterned second semiconductor layer of the second depressed portion.Type: ApplicationFiled: August 3, 2011Publication date: February 9, 2012Applicant: INDUTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Yao-Jun TSAI, Chen-Peng HSU, Kuo-Feng LIN, Hsun-Chih LIU, Hung-Lieh HU, Chien-Jen SUN
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Publication number: 20110133229Abstract: A light emitting diode (LED) structure and a LED packaging structure are disclosed. The LED structure includes a sub-mount, a stacked structure, an electrode, an isolation layer and a conductive thin film layer. The sub-mount has a first surface and a second surface opposite the first surface. The stacked structure has a first semiconductor layer, an active layer and a second semiconductor layer that are laminated on the first surface. The electrode is disposed apart from the stacked structure on the first surface. The isolation layer is disposed on the first surface to surround the stacked structure as well as cover the lateral sides of the active layer. The conductive thin film layer connects the electrode to the stacked structure and covers the stacked structure.Type: ApplicationFiled: December 29, 2010Publication date: June 9, 2011Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Yao-Jun Tsai, Chen-Peng Hsu, Hung-Lieh Hu, Ji-Feng Chen
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Publication number: 20110092002Abstract: The present invention discloses a method for fabricating a light emitting diode (LED) package structure. The method comprises the following steps: a carrier having a substrate and a first protrusion is provided, wherein the first protrusion is disposed on the substrate and has a recess. An adhesion layer and a LED chip are disposed on a bottom of the recess, wherein the adhesion layer is bonded between the carrier and the LED chip, and a ratio between a width of the recess and a width of the LED chip is larger than 1 and smaller than or equal to 1.5 such that a gap existing between a sidewall of the LED chip and an inner sidewall of the recess.Type: ApplicationFiled: December 22, 2010Publication date: April 21, 2011Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Yao-Jun Tsai, Chen-Peng Hsu, Chao-Wei Li, Hung-Lieh Hu
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Patent number: 7923746Abstract: The present invention discloses a light emitting diode (LED) package structure, which includes a carrier, a first protrusion, a LED chip, and an adhesion layer. The first protrusion is disposed on the carrier and has a first opening to expose the carrier, wherein the first protrusion is formed by a thermal conductive material. The LED chip is disposed in the first opening on the carrier, and a ratio between a width of the first opening and a width of the LED chip is 1˜1.5. The adhesion layer is disposed between the LED chip and the carrier to bond the LED chip to the carrier.Type: GrantFiled: May 26, 2008Date of Patent: April 12, 2011Assignee: Industrial Technology Research InstituteInventors: Yao-Jun Tsai, Chen-Peng Hsu, Chao-Wei Li, Hung-Lieh Hu
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Patent number: 7883910Abstract: A light emitting diode (LED) structure, a LED packaging structure, and a method of forming LED structure are disclosed. The LED structure includes a sub-mount, a stacked structure, an electrode, an isolation layer and a conductive thin film layer. The sub-mount has a first surface and a second surface opposite the first surface. The stacked structure has a first semiconductor layer, an active layer and a second semiconductor layer that are laminated on the first surface. The electrode is disposed apart from the stacked structure on the first surface. The isolation layer is disposed on the first surface to surround the stacked structure as well as cover the lateral sides of the active layer. The conductive thin film layer connects the electrode to the stacked structure and covers the stacked structure.Type: GrantFiled: February 3, 2009Date of Patent: February 8, 2011Assignee: Industrial Technology Research InstituteInventors: Yao-Jun Tsai, Chen-Peng Hsu, Hung-Lieh Hu, Ji-Feng Chen
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Patent number: 7858991Abstract: A light emitting device with magnetic field includes a light emitting device, a thermal conductive material layer and a magnetic layer. The thermal conductive material layer is coupled with the light emitting device to dissipate heat generated by the light emitting device. The magnetic layer is coupled with thermal conductive material layer to produce a magnetic filed on the light emitting device.Type: GrantFiled: January 10, 2009Date of Patent: December 28, 2010Assignee: Industrial Technology Research InstituteInventors: Rong Xuan, Chih-Hao Hsu, Wen-Yung Yeh, Chen-Peng Hsu, Chen-Kun Chen, Kun-Fong Lin
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Publication number: 20100213479Abstract: A light-emitting diode (LED) package structure including a carrier substrate, at least one LED chip, an optical element and a highly thermal-conductive transparent liquid is provided. The LED chip is disposed on the carrier substrate and has an active layer. The optical element is disposed on the substrate and forms a sealed space with the carrier substrate, and the LED chip is disposed in the sealed space. The highly thermal-conductive transparent liquid fills up the sealed space.Type: ApplicationFiled: October 8, 2009Publication date: August 26, 2010Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Chao-Wei Li, Chen-Peng Hsu, Yao-Jun Tsai, Hung-Lieh Hu
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Publication number: 20100193809Abstract: A light emitting diode (LED) structure, a LED packaging structure, and a method of forming LED structure are disclosed. The LED structure includes a sub-mount, a stacked structure, an electrode, an isolation layer and a conductive thin film layer. The sub-mount has a first surface and a second surface opposite the first surface. The stacked structure has a first semiconductor layer, an active layer and a second semiconductor layer that are laminated on the first surface. The electrode is disposed apart from the stacked structure on the first surface. The isolation layer is disposed on the first surface to surround the stacked structure as well as cover the lateral sides of the active layer. The conductive thin film layer connects the electrode to the stacked structure and covers the stacked structure.Type: ApplicationFiled: February 3, 2009Publication date: August 5, 2010Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Yao-Jun Tsai, Chen-Peng Hsu, Hung-Lieh Hu, Ji-Feng Chen
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Publication number: 20100084958Abstract: A light emitting diode (LED) structure, a manufacturing method thereof and a LED module are provided. The LED structure has temperature sensing function. The LED structure comprises a composite substrate and an LED. The composite substrate comprises a diode structure whose P-type semiconductor region or N-type semiconductor region has a predetermined doping concentration. The diode structure is a temperature sensor, and the sensitivity of the temperature sensor is based on the predetermined doping concentration. The LED is disposed on the composite substrate. The diode structure is used for sensing the heat emitted from the LED.Type: ApplicationFiled: September 25, 2009Publication date: April 8, 2010Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Chih-Tsung Shih, Chen-Peng Hsu, Hung-Lieh Hu
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Publication number: 20090290273Abstract: A light-emitting diode (LED) package having electrostatic discharge (ESD) protection function and a method of fabricating the same adopt a composite substrate to prepare an embedded diode and an LED, and use an insulating layer in the composite substrate to isolate some individual embedded diodes, such that the LED device has the ESD protection.Type: ApplicationFiled: July 29, 2008Publication date: November 26, 2009Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Chih-Tsung Shih, Chen-Peng Hsu, Shih-Tsai Huang, Hsin-Yun Tsai, Hung-Lieh Hu
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Publication number: 20090267102Abstract: A light emitting diode (LED) package structure includes a carrier, a first protrusion, a LED chip, and an adhesion layer. The first protrusion is disposed on the carrier and has a first opening to expose the carrier. The LED chip is disposed in the first opening on the carrier, and a ratio between a width of the first opening and a width of the LED chip is 1˜1.5. The adhesion layer is disposed between the LED chip and the carrier to bond the LED chip to the carrier.Type: ApplicationFiled: July 13, 2009Publication date: October 29, 2009Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Yao-Jun Tsai, Chen-Peng Hsu, Chao-Wei Li, Hung-Lieh Hu
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Publication number: 20090244556Abstract: Disclosed is a system and method for capturing technical documents and reading and commentating captured documents thereof. The system may comprise a capturing system and a reading with commentating system. The capturing system selects related drawings from a group of technical documents. It then provides important information and the related drawings onto an image for the readers' review. The reading with commentating system allows the readers to process technical classification, management and export/import for the group of technical documents. Readers may make comments on an information sharing platform after reviewing the technical documents. Besides, other materials collected or generated from the technical analysis on the technical documents may be attached to the information sharing platform.Type: ApplicationFiled: December 30, 2008Publication date: October 1, 2009Inventors: Chen-Kun Chen, Yu-Chen Yu, Mu-Tao Chu, Kuan-Chieh Tu, Chao-Chin Chang, Hsiao-Wen Chang, Chen-Peng Hsu
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Publication number: 20090230417Abstract: The present invention discloses a light emitting diode (LED) package structure, which includes a carrier, a first protrusion, a LED chip, and an adhesion layer. The first protrusion is disposed on the carrier and has a first opening to expose the carrier, wherein the first protrusion is formed by a thermal conductive material. The LED chip is disposed in the first opening on the carrier, and a ratio between a width of the first opening and a width of the LED chip is 1˜1.5. The adhesion layer is disposed between the LED chip and the carrier to bond the LED chip to the carrier.Type: ApplicationFiled: May 26, 2008Publication date: September 17, 2009Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Yao-Jun Tsai, Chen-Peng Hsu, Chao-Wei Li, Hung-Lieh Hu
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Publication number: 20090179216Abstract: A light emitting device with magnetic field includes a light emitting device, a thermal conductive material layer and a magnetic layer. The thermal conductive material layer is coupled with the light emitting device to dissipate heat generated by the light emitting device. The magnetic layer is coupled with thermal conductive material layer to produce a magnetic filed on the light emitting device.Type: ApplicationFiled: January 10, 2009Publication date: July 16, 2009Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Rong Xuan, Chih-Hao Hsu, Wen-Yung Yeh, Chen-Peng Hsu, Chen-Kun Chen, Kun-Fong Lin
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Publication number: 20090115313Abstract: A light emitting device and a fabricating method thereof are described. The light emitting device includes a substrate, a light emitting chip, a tubular structure, and a fluorescent conversion layer. The tubular structure is formed on a surface of the substrate. The light emitting chip is disposed on the surface of the substrate and is surrounded by the tubular structure. The fluorescent conversion layer is disposed in the tubular structure and covers the light emitting chip. A ratio of a maximal vertical thickness and a maximal horizontal thickness of the fluorescent conversion layer at the light emitting chip is between 0.1 and 10. A distance for the light ray to pass through the fluorescent conversion layer is controlled by using the tubular structure, so as to solve a problem of the conventional art that fluorescent powder coating package technique results in non-uniform color temperature of the emitted light.Type: ApplicationFiled: July 30, 2008Publication date: May 7, 2009Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Chien-Chun LU, Chia-Tai Kuo, Chen-Peng Hsu, Hung-Lieh Hu, Chien-Jen Sun