Abstract: A motor driver IC with auto calibration function is provided, the motor driver IC utilizes a Hall sensor of a switched sensor circuit to detect the changes in an external magnetic field. By using the compensation current which is generated by the automatic calibration circuit to correct the unexpected offset existed in the Hall sensor of the sensing unit itself to zero so that the sensing unit can sense the changes in the external magnetic field accurately and can point out the rotor position correctly, and the motor can be further driven to commutate relatively to reduce the motor rotation noise to achieve good output performance of the motor rotation and the better motor driving system stability.

Abstract: A motor driving apparatus is disclosed herein and includes a control unit, a soft-start unit and an output unit. When power-up or lock release situation, an external PWM driving signal is inputted to the soft-start unit, the soft-start unit generates an internal PWM driving signal and a power-up initial signal; after the power-up initial signal is generated, the control unit transmitting a motor rotation signal to the soft-start unit; when the soft-start unit counts a plurality of the motor rotation signal, the soft-start unit selects the external PWM driving signal or the internal PWM driving signal to output to the output unit.

Abstract: A semiconductor device includes a semiconductor substrate, a source and a drain region formed on the semiconductor substrate, and a gate structure disposed on the substrate between the source and drain regions. The gate structure includes an interfacial layer formed over the substrate, a high-k dielectric formed over the interfacial layer, and a metal gate formed over the high-k dielectric that includes a first metal layer and a second metal layer, where the first metal layer is formed on a portion of the sidewalls of the gate structure and where the second metal layer is formed on another portion of the sidewalls of the gate structure.

Abstract: A substrate unit, which can be disposed opposite to a display panel, includes a substrate and a color filter layer. The substrate has a front surface and a rear surface. The rear surface is disposed adjacent to the display panel. The color filter layer is disposed on the rear surface or between the front surface and the rear surface. A display module and a display apparatus including the substrate unit are also disclosed.

Abstract: The present invention discloses a method for reducing the tilt of a transparent window during manufacturing of an image sensor. The method includes the following steps: providing a semimanufacture of the image sensor; carrying out a preheating process; carrying out an adhesive spreading process; carrying out a transparent window closing process; and carrying out a packaging process. By carrying out the preheating process, the environmental conditions can be stabilized during the adhesive spreading process and the transparent window closing process such that the transparent window can be kept highly flat after combining. By the implementation of the present invention, the chance of tilt and crack of the transparent window during manufacturing of the image sensor can be reduced, thereby achieving the goal for a better yield rate.

Abstract: A motor driving apparatus is disclosed herein and includes a control unit, a soft-start unit and an output unit. When power-up or lock release situation, an external PWM driving signal is inputted to the soft-start unit, the soft-start unit generates an internal PWM driving signal and a power-up initial signal; after the power-up initial signal is generated, the control unit transmitting a motor rotation signal to the soft-start unit; when the soft-start unit counts a plurality of the motor rotation signal, the soft-start unit selects the external PWM driving signal or the internal PWM driving signal to output to the output unit.

Abstract: A backlight module includes a reflection sheet and a film structure disposed above the reflection sheet with a gap therebetween. A light source is disposed in the gap between the reflection sheet and the film structure so as to provide light. The film structure includes a first region for reflecting light incident thereupon from the light source and the reflection sheet, and a plurality of second regions for transmitting at least partially light incident thereupon from the light source and the reflection sheet.

Abstract: The present invention discloses a method for reducing the tilt of a transparent window during manufacturing of an image sensor. The method includes the following steps: providing a semimanufacture of the image sensor; carrying out a preheating process; carrying out an adhesive spreading process; carrying out a transparent window closing process; and carrying out a packaging process. By carrying out the preheating process, the environmental conditions can be stabilized during the adhesive spreading process and the transparent window closing process such that the transparent window can be kept highly flat after combining By the implementation of the present invention, the chance of tilt and crack of the transparent window during manufacturing of the image sensor can be reduced, thereby achieving the goal for a better yield rate.

Abstract: The present disclosure provides a method for fabricating a semiconductor device that includes forming a gate stack over a silicon substrate, forming dummy spacers on sidewalls of the gate stack, isotropically etching the silicon substrate to form recess regions on either side of the gate stack, forming a semiconductor material in the recess regions, the semiconductor material being different from the silicon substrate, removing the dummy spacers, forming spacer layers having an oxide-nitride-oxide configuration over the gate stack and the semiconductor material, and etching the spacer layers to form gate spacers on the sidewalls of the gate stack.

Abstract: A computer system displays and controls the hard disk condition. The computer system includes a host bus adapter which detects the status of the hard disk, and the status light gives light to display the hard disk status. The baseboard management controller and the host bus adapters are set on the motherboards, in which the baseboard management controller monitors and records the status of the hard disk. The microcontroller is set on the hard disk backplane for decoding the message from the host bus adapter in order to control the displaying of the status light.

Abstract: A method for forming a flat panel display includes disposing a light guide plate below a display panel, disposing at least one optical film between the display panel and the light guide plate, and disposing at least one illuminating device package in proximity to the light guide plate. The method for forming the illuminating device package includes forming a light emitting diode device over a substrate and forming a lens encapsulating the light emitting diode device. The lens includes two reflective surfaces disposed substantially symmetrically at either side of a central axis. The reflective surfaces is configured to reflect portions of light beams to at least one of the diffractive surfaces. The lens also includes a plurality of diffractive surfaces separating the reflective surfaces. The diffractive surfaces are configured to diffract the reflected light beams into a convergent angle. Each of the diffractive surfaces having a tilt angle respective to the central axis.

Abstract: A semiconductor device and method for fabricating a semiconductor device protecting a resistive structure in gate replacement processing is disclosed. The method comprises providing a semiconductor substrate; forming at least one gate structure including a dummy gate over the semiconductor substrate; forming at least one resistive structure including a gate over the semiconductor substrate; exposing a portion of the gate of the at least one resistive structure; forming an etch stop layer over the semiconductor substrate, including over the exposed portion of the gate; removing the dummy gate from the at least one gate structure to create an opening; and forming a metal gate in the opening of the at least one gate structure.

Abstract: The present disclosure provides a method for fabricating a semiconductor device that includes forming a gate stack over a silicon substrate, forming dummy spacers on sidewalls of the gate stack, isotropically etching the silicon substrate to form recess regions on either side of the gate stack, forming a semiconductor material in the recess regions, the semiconductor material being different from the silicon substrate, removing the dummy spacers, forming spacer layers having an oxide-nitride-oxide configuration over the gate stack and the semiconductor material, and etching the spacer layers to form gate spacers on the sidewalls of the gate stack.

Abstract: A semiconductor device includes a semiconductor substrate, a source and a drain region formed on the semiconductor substrate, and a gate structure disposed on the substrate between the source and drain regions. The gate structure includes an interfacial layer formed over the substrate, a high-k dielectric formed over the interfacial layer, and a metal gate formed over the high-k dielectric that includes a first metal layer and a second metal layer, where the first metal layer is formed on a portion of the sidewalls of the gate structure and where the second metal layer is formed on another portion of the sidewalls of the gate structure.

Abstract: A method is provided for fabricating a semiconductor device. The method includes providing a substrate including a dummy gate structure formed thereon, removing the dummy gate structure to form a trench, forming a first metal layer over the substrate to fill a portion of the trench, forming a protection layer in a remaining portion of the trench, removing a unprotected portion of the first metal layer, removing the protection layer from the trench, and forming a second metal layer over the substrate to fill the trench.

Abstract: A reflective LED lamp includes a metallic shell, a reflecting member, and an LED unit. The metallic shell includes a surrounding wall formed with a mounting hole unit, and an accommodating space defined by the surrounding wall. The reflecting member is disposed within the accommodating space, and includes a reflection region unit configured as at least one concaved curve surface. The LED unit is disposed within the mounting hole unit in the shell for emitting light onto the reflection region unit of the reflecting member, so that the light is reflected by the reflection region unit out of the shell.

Abstract: An image sensor structure and an integrated lens module thereof are provided. In the image sensor structure with the integrated lens module, the image sensor structure comprises a chip and a lens module. The chip has light-sensing elements, first conducting pads, and a conducting channel. The light-sensing elements are electrically connected to the first conducting pads and the first conducting pads are electrically connected to one end of the conducting channel passing through the chip. The lens module comprises a holder and at least one lens. The holder has a through hole and the lens is embedded in the through hole and integrated with the holder. By using the integrated lens and holder, a manufacturing process of the image sensor structure is simplified and a manufacturing cost of the image sensor structure is reduced.

Abstract: A light emitting diode (LED) package includes a base, a body and several LED chips. The body having an end surface is disposed on the base. A peripheral recess is formed in the end surface. The LED chips are disposed on a bottom of the peripheral recess for providing sidelight of the LED package. The LED package is connectable to a light guide pipe including a column having an external circumferential surface and an internal reflection surface, and a plurality of prism structures disposed between or on at least one of the external circumferential surface and the internal reflection surface for scattering light received by the light guide pipe from the LED package.

Abstract: A backlight module includes a reflection sheet and a film structure disposed above the reflection sheet with a gap therebetween. A light source is disposed in the gap between the reflection sheet and the film structure so as to provide light. The film structure includes a first region for reflecting light incident thereupon from the light source and the reflection sheet, and a plurality of second regions for transmitting at least partially light incident thereupon from the light source and the reflection sheet.