Abstract: A first protective layer is formed on a first die and a second die, and openings are formed within the first protective layer. The first die and the second die are encapsulated such that the encapsulant is thicker than the first die and the second die, and vias are formed within the openings. A redistribution layer can also be formed to extend over the encapsulant, and the first die may be separated from the second die.

Abstract: The present invention provides a dual-substrate antenna package structure and a method for manufacturing the same. The package structure includes a main substrate and at least one antenna substrate. The antenna substrate is provided on a pad of the main substrate by an array of solder balls placed on the antenna substrate, at least one chip is electrically connected to the main substrate, and metal wiring provided on the main substrate electrically connects the pad to the chip. The array of solder balls includes support solder balls and conventional solder balls, and the support solder balls have a melting point high than 250° C. A spacing distance between the antenna substrate and the main substrate can be kept stable during the reflow soldering process and subsequent processes because the support solder balls having the high melting point can always maintain the stability of the structure during the reflow soldering process.

Abstract: A light-emitting device includes a lead frame, a light-emitting diode (LED) chip, and an encapsulant. The LED chip is disposed on the lead frame, and includes a substrate, a semiconductor light-emitting unit disposed on a surface of the substrate, and a first electrode and a second electrode, which are disposed on the surface of the substrate, and which are located outwardly of the semiconductor light-emitting unit. The first and second electrodes are electrically connected to a lower surface of the semiconductor light-emitting unit, and are respectively connected to a first wiring bonding region and a second wiring bonding region on the lead frame. The encapsulant encapsulates the LED chip on the lead frame.

Abstract: According to an exemplary embodiment, a substrate having a first area and a second area is provided. The substrate includes a plurality of pads. Each of the pads has a pad size. The pad size in the first area is larger than the pad size in the second area.

Abstract: The present disclosure discloses a method for dual-motor control on an electric vehicle based on adaptive dynamic programming. First, total torque required is calculated based on obtained data information of the electric vehicle under various driving conditions, and offline training is conducted on an execution network and an evaluation network. Then total torque is dynamically distributed for two motors of the electric vehicle under various driving conditions to obtain an efficiency MAP database. Afterwards, iteration and online learning are conducted on the execution network and the evaluation network based on data information of the electric vehicle under different driving conditions that is obtained in real time, so as to find an optimal control law for the electric vehicle under a real-time driving condition. In this way, the dual-motor control on the electric vehicle is optimized.

Abstract: The disclosure is an engine simulation test device capable of realizing an ultrahigh compression temperature and pressure, belonging to the field of a diesel engine high-temperature and high-pressure system, solving the problems that the existing engine simulation test cannot achieve ultra-high compression temperature and pressure, and the temperature and pressure are not adjustable. It includes a compressed air inlet mechanism, a nitrogen gas inlet mechanism, a pressure stabilizing mechanism, a cyclic heating mechanism, an air inlet mechanism and a fast compressor mechanism.

Abstract: Aspects of the subject disclosure may include, for example, training a cell-level machine learning model to predict a likelihood of a cell site in a cellular network having service issues that impact customers of the cellular network, training a user equipment (UE) level machine learning model using output information from the cell-level machine learning model and historical information about UE-level performance metrics, receiving, from a customer associated with a UE device operating on the cellular network, information about a service degradation experienced by the customer on the UE device, providing the information about the service degradation to the UE-level machine learning model; and receiving, from the UE-level machine learning model, information identifying a source of the service degradation. Other embodiments are disclosed.

Abstract: Aspects of the subject disclosure may include, for example, categorizing users of a cellular network according to a plurality of user categories, identifying, by a machine learning model, a service degradation in the cellular network, identifying at least one affected user, the at least one affected user being affected by the service degradation, identifying one or more affected user categories including the at least one affected user, identifying potentially affected users, the potentially affected users being categorized according to the one or more affected user categories, and taking action to isolate the potentially affected users from the service degradation. Other embodiments are disclosed.

Abstract: A package structure including a photonic, an electronic die, an encapsulant and a waveguide is provided. The photonic die includes an optical coupler. The electronic die is electrically coupled to the photonic die. The encapsulant laterally encapsulates the photonic die and the electronic die. The waveguide is disposed over the encapsulant and includes an upper surface facing away from the encapsulant. The waveguide includes a first end portion and a second end portion, the first end portion is optically coupled to the optical coupler, and the second end portion has a groove on the upper surface.

Abstract: The embodiments of the disclosure provide an intelligent glass and an intelligent window system, and relates to the technical field of window display. The intelligent glass of the disclosure includes a touch display assembly and a glass assembly. The touch display assembly is communicatively coupled to the glass assembly, and is configured to send a corresponding dimming instruction to the glass assembly based on a received touch instruction, such that the glass assembly adjusts its light transmittance based on the dimming instruction.

Abstract: In an embodiment, a structure includes a core substrate, a redistribution structure coupled, the redistribution structure including a plurality of redistribution layers, the plurality of redistribution layers comprising a dielectric layer and a metallization layer, a first local interconnect component embedded in a first redistribution layer of the plurality of redistribution layers, the first local interconnect component comprising conductive connectors, the conductive connectors being bonded to a metallization pattern of the first redistribution layer, the dielectric layer of the first redistribution layer encapsulating the first local interconnect component, a first integrated circuit die coupled to the redistribution structure, a second integrated circuit die coupled to the redistribution structure, an interconnect structure of the first local interconnect component electrically coupling the first integrated circuit die to the second integrated circuit die, and a set of conductive connectors coupled to a

Abstract: Aspects of the subject disclosure may include, for example, receiving, from a machine learning model, information about an event causing a service degradation in a cellular network, wherein the event is external to the cellular network, determining one or more event categories associated with the event causing the service degradation, determining, based on the one or more event categories, likely affected customers, the likely affected customers being likely to experience the service degradation, determining, by the machine learning model, proper resources for resolution of the service degradation, wherein the determining proper resources is based on the one or more event categories, and dispatching the proper resources for resolution of the service degradation. Other embodiments are disclosed.

Abstract: A package includes a photonic layer on a substrate, the photonic layer including a silicon waveguide coupled to a grating coupler; an interconnect structure over the photonic layer; an electronic die and a first dielectric layer over the interconnect structure, where the electronic die is connected to the interconnect structure; a first substrate bonded to the electronic die and the first dielectric layer; a socket attached to a top surface of the first substrate; and a fiber holder coupled to the first substrate through the socket, where the fiber holder includes a prism that re-orients an optical path of an optical signal.

Abstract: The disclosure provides a mower. The mower includes a vehicle frame, a walking assembly, a working assembly, a seat and a battery pack. The walking assembly includes a first walking wheel assembly and a second walking wheel assembly connected with the vehicle frame. The first walking wheel assembly and/or the second walking wheel assembly includes a main walking wheel and a hub motor, the main walking wheel is connected with the hub motor, and the hub motor is arranged outside a side of the vehicle frame. The working assembly is connected with the vehicle frame. The seat is arranged on the vehicle frame. The battery pack is lowered and mounted on the vehicle frame and extends below the seat.

Abstract: Provided are a method for generating a project flow, an electronic device, and a storage medium. The method includes determining at least one process node corresponding to a target project to be configured and determining node attribute information of the at least one process node; determining a node dependence of the at least one process node; and determining, based on the node dependence and the node attribute information, execution project flow information corresponding to the target project to be configured.

Abstract: An ultrasound phased array integrated in flexible CMOS technology is provided. The CMOS IC chip is fabricated through various chip-thinning techniques, resulting in mechanical flexibility, robustness, and minimized mechanical loading for the piezoelectric transducers. The ultrasound phased array CMOS patch can allow for the generation of high intensity focal regions for maximum penetration in regions of interest.

Abstract: A method includes acquiring a to-be-used execution project flow, where the to-be-used execution project flow includes multiple to-be-used flow nodes; in response to detecting that an operation on at least one to-be-used flow node is a preset operation, updating the to-be-used execution project flow; and in response to detecting that a target control is triggered, using the updated to-be-used execution project flow as a target execution project flow.

Abstract: A method of forming a semiconductor device includes arranging a semi-finished substrate, which has been tested and is known to be good, on a carrier substrate. Encapsulating the semi-finished substrate in a first encapsulant and arranging at least one semiconductor die over the semi-finished substrate. Electrically coupling at least one semiconductor component of the at least one semiconductor die to the semi-finished substrate and encasing the at least one semiconductor die and portions of the first encapsulant in a second encapsulant. Removing the carrier substrate from the semi-finished substrate and bonding a plurality of external contacts to the semi-finished substrate.