Abstract: The disclosure provides a mower. The mower includes a vehicle frame, a walking assembly, a working assembly, a seat and a battery pack. The walking assembly includes a first walking wheel assembly and a second walking wheel assembly connected with the vehicle frame. The first walking wheel assembly and/or the second walking wheel assembly includes a main walking wheel and a hub motor, the main walking wheel is connected with the hub motor, and the hub motor is arranged outside a side of the vehicle frame. The working assembly is connected with the vehicle frame. The seat is arranged on the vehicle frame. The battery pack is lowered and mounted on the vehicle frame and extends below the seat.

Abstract: An ultrasound phased array integrated in flexible CMOS technology is provided. The CMOS IC chip is fabricated through various chip-thinning techniques, resulting in mechanical flexibility, robustness, and minimized mechanical loading for the piezoelectric transducers. The ultrasound phased array CMOS patch can allow for the generation of high intensity focal regions for maximum penetration in regions of interest.

Abstract: A method includes acquiring a to-be-used execution project flow, where the to-be-used execution project flow includes multiple to-be-used flow nodes; in response to detecting that an operation on at least one to-be-used flow node is a preset operation, updating the to-be-used execution project flow; and in response to detecting that a target control is triggered, using the updated to-be-used execution project flow as a target execution project flow.

Abstract: A method of forming a semiconductor device includes arranging a semi-finished substrate, which has been tested and is known to be good, on a carrier substrate. Encapsulating the semi-finished substrate in a first encapsulant and arranging at least one semiconductor die over the semi-finished substrate. Electrically coupling at least one semiconductor component of the at least one semiconductor die to the semi-finished substrate and encasing the at least one semiconductor die and portions of the first encapsulant in a second encapsulant. Removing the carrier substrate from the semi-finished substrate and bonding a plurality of external contacts to the semi-finished substrate.

Abstract: A semiconductor structure includes a die and a first connector. The first connector is disposed on the die. The first connector includes a first connecting housing, a first connecting element and a first connecting portion. The first connecting element is electrically connected to the die and disposed at a first side of the first connecting housing. The first connecting portion is disposed at a second side different from the first side of the first connecting housing, wherein the first connecting portion is one of a hole and a protrusion with respect to a surface of the second side of the first connecting housing.

Abstract: A surface coating for degradable magnesium and magnesium alloys, including: an inner layer and an outer layer. The inner layer is a magnesium phosphate conversion layer, and the outer layer is a hydroxyapatite layer. A method for fabricating the surface coating is also provided herein, which includes: soaking the magnesium or magnesium alloy in an acidic solution containing magnesium salt and phosphate under heating to form the magnesium phosphate conversion layer on a surface of the magnesium or magnesium alloy; and transferring the magnesium or magnesium alloy to an alkaline solution containing calcium salt and phosphate followed by soaking under heating to form a hydroxyapatite layer on a surface of the magnesium phosphate conversion layer.

Abstract: A coating with strong adhesion for medical magnesium alloys, including a magnesium phosphate or calcium phosphate layer as an inner layer and a hydrophobic polymer layer as an outer layer. The inner layer is attached to the medical magnesium alloy; and the outer layer is attached to the inner layer. A preparation method of the coating is also provided, including: (S1) carrying out surface treatment on a medical magnesium alloy substrate; (S2) preparing a solution including magnesium salt/calcium salt and phosphoric acid/phosphate followed by pH adjustment and heating; (S3) soaking the medical magnesium alloy substrate in the solution followed by washing and drying to obtain a magnesium phosphate/calcium phosphate layer-coated medical magnesium alloy sample; and (S4) depositing a hydrophobic polymer layer on the medical magnesium alloy sample through chemical vapor deposition (CVD).

Abstract: Methods and systems may be configured to verify proper installation of Internet Protocol (IP) connectable building automation devices by installers at remote sites. The installers may be a crowdsourced installers. A service provider may engage an installer to install one or more IP connectable building automation devices. To ensure verification that the one or more IP connectable building automation devices are installed properly, parameters or values based on data from installed IP connectable building automation devices may be provided to or determined by a blockchain network. The blockchain network may compare the parameters or values to thresholds and automatically provide an indication as to whether the parameters or values meet or exceed the thresholds (e.g., verification criteria).

Abstract: Disclosed in the present invention are a pyrazolone-fused pyrimidine compound, and a preparation method and a use therefor. Provided in the present invention is a pyrazolone-fused pyrimidine compound as in formula (I), said compound having better inhibitory activity towards WEE1 kinase.

Abstract: Disclosed are a pyrazolone-fused pyrimidine compound, a preparation method for same and applications thereof. Provided in the present invention is the pyrazolone-fused pyrimidine compound as represented by formula (II). The compound has improved inhibitory activity with respect to WEE1 kinase.

Abstract: Methods and systems may be configured to verify proper installation of Internet Protocol (IP) connectable building automation devices by installers at remote sites. The installers may be a crowdsourced installers. A service provider may engage an installer to install one or more IP connectable building automation devices. To ensure verification that the one or more IP connectable building automation devices are installed properly, parameters or values based on data from installed IP connectable building automation devices may be provided to or determined by a blockchain network. The blockchain network may compare the parameters or values to thresholds and automatically provide an indication as to whether the parameters or values meet or exceed the thresholds (e.g., verification criteria).

Abstract: Methods and systems may be configured to verify proper installation of Internet Protocol (IP) connectable building automation devices by installers at remote sites. The installers may be a crowdsourced installers. A service provider may engage an installer to install one or more IP connectable building automation devices. To ensure verification that the one or more IP connectable building automation devices are installed properly, parameters or values based on data from installed IP connectable building automation devices may be provided to or determined by a blockchain network. The blockchain network may compare the parameters or values to thresholds and automatically provide an indication as to whether the parameters or values meet or exceed the thresholds (e.g., verification criteria).

Abstract: An integrated motor drive includes a frame assembly, a motor, a motor driver and a heat dissipation assembly. The frame assembly includes a first frame and a second frame. The motor is installed on the first frame. The motor driver is installed on the second frame. The heat dissipation assembly includes a motor heat exchange pipe, a motor driver heat exchange pipe, and a heat dissipation pipe. The motor heat exchange pipe is embedded in the first frame, and located at one side portion of the motor for performing heat exchange with the motor. The motor driver heat exchange pipe is embedded in the second frame for performing heat exchange with the motor driver. The heat dissipation pipe is located at an end portion of the motor, and communicated with the motor heat exchange pipe and the motor driver heat exchange pipe.

Abstract: The present invention discloses a substituted pyridine compound represented by formula I, and a pharmaceutically acceptable salt, stereoisomer and tautomer thereof. The compounds of the present invention are useful in the treatment of cancers.

Abstract: Methods and systems may be configured to verify proper installation of Internet Protocol (IP) connectable building automation devices by installers at remote sites. The installers may be a crowdsourced installers. A service provider may engage an installer to install one or more IP connectable building automation devices. To ensure verification that the one or more IP connectable building automation devices are installed properly, parameters or values based on data from installed IP connectable building automation devices may be provided to or determined by a blockchain network. The blockchain network may compare the parameters or values to thresholds and automatically provide an indication as to whether the parameters or values meet or exceed the thresholds (e.g., verification criteria).

Abstract: Apparatus and methods for powering micron-scale implantable and injectable integrated circuit (IC) chips for in-vivo sensing and acquisition of various physiological signals are provided. The disclosed subject matter includes the integration of piezoelectric transducers, such as polyvinylidene fluoride (PVDF) or lead zirconate titanate (PZT), onto implantable and injectable IC chips for power transfer and data transmission using ultrasound waves generated from commercial ultrasound imaging equipment.

Abstract: A motor sleeve is applied to a motor housing and a motor driver housing. The motor sleeve includes a sleeve base, a second fixing structure, a second coupling structure, a plurality of base fins, a sleeve chassis, a plurality of chassis fins, and a third fixing structure. The second fixing structure is disposed on an inner surface of the sleeve base and correspondingly fixed to a first fixing structure of the motor housing. The sleeve base is installed on a lateral portion of the motor housing. The base fins are separately disposed on an outer surface of the sleeve base and corresponding to a first coupling structure of the motor driver housing. The motor driver housing is coupled to the sleeve base by the first and second coupling structures. The third fixing structure is correspondingly fixed to a fourth fixing structure of the motor housing.

Abstract: A motor sleeve is applied to a motor housing and a motor driver housing. The motor sleeve includes a sleeve base, a second fixing structure, a second coupling structure and a plurality of base fins. The sleeve base includes an outer surface and an inner surface. The second fixing structure is disposed on the inner surface and located corresponding to a first fixing structure of the motor housing. The sleeve base is fixed to the motor housing by the first and second fixing structures. The sleeve base is installed on a side portion of the motor housing. The second coupling structure is disposed on the outer surface. The base fins are separately disposed on the outer surface and located corresponding to a first coupling structure of the motor driver housing. The motor driver housing is coupled to the sleeve base by the first and second coupling structures.

Abstract: The present invention discloses a substituted pyridine compound represented by formula I, and a pharmaceutically acceptable salt, stereoisomer and tautomer thereof. The compounds of the present invention are useful in the treatment of cancers.