Patents by Inventor Chen Tseng

Chen Tseng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210255549
    Abstract: The present disclosure, in some embodiments, relates to a photolithography tool. The photolithography tool includes a source configured to generate electromagnetic radiation. A dynamic focal system is configured to provide the electromagnetic radiation to a plurality of different vertical positions over a substrate stage. The plurality of different vertical positions include a first position having a first depth of focus and a second position having a second depth of focus that is below the first depth of focus and that vertically overlaps the first depth of focus.
    Type: Application
    Filed: May 5, 2021
    Publication date: August 19, 2021
    Inventors: Jun-Yih Yu, De-Fang Huang, De-Chen Tseng, Jia-Feng Chang, Li-Fang Hsu
  • Patent number: 11087427
    Abstract: A method for dynamically limiting a memory bandwidth of a graphics processing unit (GPU) is applicable to a bandwidth-limited system. The bandwidth-limited system includes an audio/video decoder and a GPU. The method includes detecting a plurality of decoding times of a plurality of frames of an audio/video decoded by an audio/video decoder, and adjusting a max grant amount of a memory bandwidth of a GPU according to the plurality of decoding times of the plurality of frames and a target time. Therefore, in the case where the total memory bandwidth is limited, the memory bandwidth of the GPU is limited by the performance of the corresponding audio/video decoder such that, during audio/video playback, the effect of audio/video playback can be prevented from being affected and at the same time a better graphical user interface can be provided.
    Type: Grant
    Filed: August 3, 2018
    Date of Patent: August 10, 2021
    Assignee: REALTEK SEMICONDUCTOR CORP.
    Inventors: Yi-Chen Tseng, Ming-Yang Tseng
  • Publication number: 20210225699
    Abstract: In an embodiment, a method includes: dispensing a first dielectric layer around and on a first metallization pattern, the first dielectric layer including a photoinsensitive molding compound; planarizing the first dielectric layer such that surfaces of the first dielectric layer and the first metallization pattern are planar; forming a second metallization pattern on the first dielectric layer and the first metallization pattern; dispensing a second dielectric layer around the second metallization pattern and on the first dielectric layer, the second dielectric layer including a photosensitive molding compound; patterning the second dielectric layer with openings exposing portions of the second metallization pattern; and forming a third metallization pattern on the second dielectric layer and in the openings extending through the second dielectric layer, the third metallization pattern coupled to the portions of the second metallization pattern exposed by the openings.
    Type: Application
    Filed: January 17, 2020
    Publication date: July 22, 2021
    Inventors: Ting-Chen Tseng, Sih-Hao Liao, Po-Han Wang, Yu-Hsiang Hu, Hung-Jui Kuo
  • Publication number: 20210193605
    Abstract: A package structure includes a semiconductor die, conductive pillars, an insulating encapsulation, a redistribution circuit structure, and a solder resist layer. The conductive pillars are arranged aside of the semiconductor die. The insulating encapsulation encapsulates the semiconductor die and the conductive pillars, and the insulating encapsulation has a first surface and a second surface opposite to the first surface. The redistribution circuit structure is located on the first surface of the insulating encapsulation. The solder resist layer is located on the second surface of the insulating encapsulation, wherein a material of the solder resist layer includes a filler.
    Type: Application
    Filed: December 18, 2019
    Publication date: June 24, 2021
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Ting-Chen Tseng, Hung-Jui Kuo, Yu-Hsiang Hu, Sih-Hao Liao
  • Patent number: 11003089
    Abstract: The present disclosure, in some embodiments, relates to a method of performing a photolithography process. The method includes forming a photosensitive material over a substantially flat upper surface of a substrate. The substantially flat upper surface of the substrate extends between opposing sides of the substrate. The photosensitive material is exposed to electromagnetic radiation at a plurality of depths of focus that are centered at different heights over the substrate. The photosensitive material is developed to remove a part of the photosensitive material.
    Type: Grant
    Filed: April 16, 2020
    Date of Patent: May 11, 2021
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Jun-Yih Yu, De-Fang Huang, De-Chen Tseng, Jia-Feng Chang, Li-Fang Hsu
  • Patent number: 10937968
    Abstract: Provided are a novel compound and an organic electronic device using the same. The novel compound is represented by Formula (I): wherein n1, n2, m1, m2 and m3 are each an integer, the sum of n1 and n2 is 2 or 3; L1, L2 and L3 are each an arylene group; R1 and R2 are each selected from the group consisting of: H, D, an alkyl group, and an aryl group; G is selected from the group consisting of: H, D, —N(Z3)(Z4) group, an alkyl group, an alkenyl group, an alkynyl group, a cycloalkyl group, a heterocycloalkyl group, an aryl group, and a heteroaryl group; and Z1 to Z4 are each selected from the group consisting of: an alkyl group, an alkenyl group, an alkynyl group, a cycloalkyl group, a heterocycloalkyl group, an aryl group, and a heteroaryl group.
    Type: Grant
    Filed: May 7, 2018
    Date of Patent: March 2, 2021
    Assignee: SHANGHAI NICHEM FINE CHEMICAL CO., LTD.
    Inventors: Hui-Ling Wu, Po-Chen Tseng, Shwu-Ju Shieh, Chi-Chung Chen
  • Publication number: 20200310501
    Abstract: A hard disk drive (HDD) carrier bracket for use in mounting a hard disk drive (HDD) in a chassis via a HDD tray includes a first frame member and a second frame member. The second frame member is coupled to the first frame member such that the first and second frame members are moveable relative to one another, between an extended position and a collapsed position. The HDD carrier bracket is installable in the HDD tray without tools. The HDD tray is installable in the chassis without tools.
    Type: Application
    Filed: May 29, 2019
    Publication date: October 1, 2020
    Inventors: Yaw-Tzorng TSORNG, Chun CHANG, Chen TSENG
  • Patent number: 10782748
    Abstract: A hard disk drive (HDD) carrier bracket for use in mounting a hard disk drive (HDD) in a chassis via a HDD tray includes a first frame member and a second frame member. The second frame member is coupled to the first frame member such that the first and second frame members are moveable relative to one another, between an extended position and a collapsed position. The HDD carrier bracket is installable in the HDD tray without tools. The HDD tray is installable in the chassis without tools.
    Type: Grant
    Filed: May 29, 2019
    Date of Patent: September 22, 2020
    Assignee: QUANTA COMPUTER INC.
    Inventors: Yaw-Tzorng Tsorng, Chun Chang, Chen Tseng
  • Publication number: 20200241427
    Abstract: The present disclosure, in some embodiments, relates to a method of performing a photolithography process. The method includes forming a photosensitive material over a substantially flat upper surface of a substrate. The substantially flat upper surface of the substrate extends between opposing sides of the substrate. The photosensitive material is exposed to electromagnetic radiation at a plurality of depths of focus that are centered at different heights over the substrate. The photosensitive material is developed to remove a part of the photosensitive material.
    Type: Application
    Filed: April 16, 2020
    Publication date: July 30, 2020
    Inventors: Jun-Yih Yu, De-Fang Huang, De-Chen Tseng, Jia-Feng Chang, Li-Fang Hsu
  • Publication number: 20200168307
    Abstract: Provided herein is to a blockchain-implemented method and a system for accessing electronic medical and health records by blockchain. The method is operated in a server system that is used to manage one or more medical-health record databases and users' blockchain IDs. The plurality of medical-health record databases can be set by different medical-health institutions. The server system identifies the user's blockchain ID when it receives a request from a terminal device. The user uses a query interface to generate a query command. The server system then obtains one or more medical-health record indexes via blockchain verification according to the user's blockchain ID and the query command. The medical-health records corresponding to the indexes can therefore be obtained after querying the database.
    Type: Application
    Filed: November 28, 2019
    Publication date: May 28, 2020
    Inventors: Ray-Jade Chen, Yu-Sheng Lo, Lan-Ying Kang, Christine Chen, Yi-Chen Tseng
  • Patent number: 10663868
    Abstract: The present disclosure, in some embodiments, relates to a photolithography tool. The photolithography tool includes an illumination source configured to generate electromagnetic radiation and projection optics configured to focus the electromagnetic radiation onto a photosensitive material overlying a substrate according to a pattern on a photomask. A dynamic focal element is configured to dynamically change positions at which the electromagnetic radiation is focused over the substrate during exposure of the photosensitive material. The positions at which the electromagnetic radiation is focused define a plurality of depths of focus. The plurality of depths of focus respectively span a different spatial region within the photosensitive material that is smaller than a thickness of the photosensitive material.
    Type: Grant
    Filed: November 28, 2018
    Date of Patent: May 26, 2020
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Jun-Yih Yu, De-Fang Huang, De-Chen Tseng, Jia-Feng Chang, Li-Fang Hsu
  • Publication number: 20200145549
    Abstract: A copy method used in a cloud server and a peripheral apparatus connected to the cloud server through a network includes steps of: scanning a document by the peripheral apparatus to obtain old image data containing an old information block; transmitting the old information block to the cloud server through the network; generating a new information block based on the old image data by the cloud server, wherein the cloud server generates the new information block being different from the old information block and containing new copy information according to old copy information; transmitting the new information block from the cloud server to the peripheral apparatus; and printing out new image data, containing the new copy information and a portion of the old image data, on a medium by the peripheral apparatus.
    Type: Application
    Filed: January 3, 2020
    Publication date: May 7, 2020
    Inventors: Cheng Chen TSENG, Chen-Chang LI
  • Patent number: 10622576
    Abstract: An organic light-emitting diode (OLED) and a white OLED are provided. The OLED sequentially includes an anode, an emission layer, an electron transport layer, and a cathode. The emission layer includes a triplet-triplet annihilation (TTA) material and a donor material. The doubled triplet energy of the TTA material is greater than the singlet energy of the TTA material. The donor material is disposed between the anode and the TTA material and has a second singlet energy and a second triplet energy. A sensitizer is doped in the emission layer or formed between the TTA material and the donor material when a voltage is applied. The sensitizer has a third singlet energy and a third triplet energy. The third singlet energy and the third triplet energy are both smaller than the second singlet energy.
    Type: Grant
    Filed: March 7, 2017
    Date of Patent: April 14, 2020
    Assignee: Industrial Technology Research Institute
    Inventors: Yu-Jung Peng, Jiun-Haw Lee, Po-Chen Tseng, Bo-Yen Lin, Chi-Feng Lin, Tien-Lung Chiu, Ming-Zer Lee
  • Patent number: 10566513
    Abstract: The utility model provides a light-emitting diode (LED) circuit structure. First cutout performed a substrate forms plural first cutout regions and plural first material regions. Second cutout performed on the substrate forms plural second cutout regions, plural third cutout regions, plural second material regions, and plural third material regions. Besides, a second adhering layer is adhered to another side, which is opposite to the substrate, of the first adhering layer; a heat dissipation layer is adhered to another side, which is opposite the first adhering layer, of the second adhering layer. Accordingly, such the LED circuit does not require conventional electroplating, etching, and washing processes, and further not only the effect of saving energy and reducing carbon emission can be achieved, but also the effect of being flexible, reducing a manufacturing time and reducing manufacturing costs can be achieved.
    Type: Grant
    Filed: September 17, 2018
    Date of Patent: February 18, 2020
    Inventor: Chieh-Chen Tseng
  • Patent number: 10530961
    Abstract: A copying apparatus capable of calibrating a copy position comprises a scanning module scanning an original to obtain an original image; and a processing module being electrically connected to the scanning module and recognizing whether the original image contains an original mark corresponding to a template mark. If the original image contains the original mark, then the processing module generates print data for being printed out according to the original image and a position parameter of the template mark. A copying method capable of calibrating the copy position is also provided. Thus, the copy position can be calibrated according to the mark of the original to prevent the copy result from having a positional offset. Consequently, no positional offset occurs even if the original is copied multiple times based on the previous generation of original.
    Type: Grant
    Filed: May 17, 2017
    Date of Patent: January 7, 2020
    Assignee: AVISION INC.
    Inventors: Chen-Chang Li, Cheng Chen Tseng
  • Patent number: 10530953
    Abstract: A copy method used in a copy system or a copy apparatus connected to a cloud server includes steps of: scanning a document to obtain old image data containing an old information block; generating new image data containing a new information block according to the old image data; printing the new image data on a medium; and comparing different generations of original image data, one of which is contained in the old image data, in the cloud server to judge whether improper modifications are present on the original image data or not, and notifying an information office to perform an inspection when the improper modifications are present.
    Type: Grant
    Filed: June 22, 2017
    Date of Patent: January 7, 2020
    Assignee: AVISION INC.
    Inventors: Cheng Chen Tseng, Chen-Chang Li
  • Publication number: 20190341552
    Abstract: Provided are a novel compound and an organic electronic device using the same. The novel compound is represented by Formula (I): wherein n1, n2, m1, m2 and m3 are each an integer, the sum of n1 and n2 is 2 or 3; L1, L2 and L3 are each an arylene group; R1 and R2 are each selected from the group consisting of: H, D, an alkyl group, and an aryl group; G is selected from the group consisting of: H, D, —N(Z3)(Z4) group, an alkyl group, an alkenyl group, an alkynyl group, a cycloalkyl group, a heterocycloalkyl group, an aryl group, and a heteroaryl group; and Z1 to Z4 are each selected from the group consisting of: an alkyl group, an alkenyl group, an alkynyl group, a cycloalkyl group, a heterocycloalkyl group, an aryl group, and a heteroaryl group.
    Type: Application
    Filed: May 7, 2018
    Publication date: November 7, 2019
    Inventors: Hui-Ling WU, Po-Chen TSENG, Shwu-Ju SHIEH, Chi-Chung CHEN
  • Patent number: 10409339
    Abstract: A computing device is provided with a slot that includes a first locking element and a second locking element configured to receive a removable computing device carrier. The computing device carrier includes a bracket for securing a first computing device in a first receiving space, and second computing device in a second receiving space. The bracket also includes a first latching mechanism configured to secure the first locking element of the slot, and a second latching mechanism configured to secure the second locking element of the slot. The computing device carrier also includes a frame secured to the bracket. The frame includes a first end with a first guide slot, and a second end with a second guide slot. The first and second guide slots are configured to enable the computing device carrier to adjust from a first position to a second position while secured within the slot.
    Type: Grant
    Filed: December 5, 2018
    Date of Patent: September 10, 2019
    Assignee: QUANTA COMPUTER INC.
    Inventors: Chao-Jung Chen, Yaw-Tzorng Tsorng, Chen Tseng, Zhi-Hao Tseng
  • Publication number: 20190269200
    Abstract: A sole structure includes: an anti-skid layer, a rigid layer, an elastic piece and a soft layer which are superimposed upon one another. With the characteristic of the elastic piece being elastically deformable, a rebounding force can be produced to act on the foot to stimulate the ligaments and muscles of the foot, which consequently corrects the flatfoot.
    Type: Application
    Filed: May 16, 2019
    Publication date: September 5, 2019
    Inventor: Yi-Chen TSENG
  • Publication number: 20190272611
    Abstract: A method for dynamically limiting a memory bandwidth of a graphics processing unit (GPU) is applicable to a bandwidth-limited system. The bandwidth-limited system includes an audio/video decoder and a GPU. The method includes detecting a plurality of decoding times of a plurality of frames of an audio/video decoded by an audio/video decoder, and adjusting a max grant amount of a memory bandwidth of a GPU according to the plurality of decoding times of the plurality of frames and a target time. Therefore, in the case where the total memory bandwidth is limited, the memory bandwidth of the GPU is limited by the performance of the corresponding audio/video decoder such that, during audio/video playback, the effect of audio/video playback can be prevented from being affected and at the same time a better graphical user interface can be provided.
    Type: Application
    Filed: August 3, 2018
    Publication date: September 5, 2019
    Applicant: REALTEK SEMICONDUCTOR CORP.
    Inventors: Yi-Chen Tseng, Ming-Yang Tseng