Abstract: A chip-scale image sensor package includes a semiconductor substrate, a transparent substrate, a thin film, and a plurality of conductive pads. The semiconductor substrate has (i) a pixel array, and (ii) a peripheral region surrounding the pixel array. The transparent substrate covers the pixel array, has a bottom substrate surface proximate the pixel array, and a top substrate surface opposite the bottom substrate surface. The thin film is on a region of the top substrate surface directly above both (i) the entire pixel array and (ii) a portion of the peripheral region adjacent to the pixel array. Each of the plurality of conductive pads is located within the peripheral region, and is electrically connected to the pixel array. A portion of each of the plurality of conductive pads is not directly beneath the thin film.

Abstract: An optical element comprising a transparent substrate and an anti-reflective coating, wherein the anti-reflective coating further comprises at least a transparent, high refractive index layer and a transparent, low refractive index layer, wherein the high refractive index layer is in contact with the low refractive index layer; and wherein the high refractive index layer is situated at an interface between the anti-reflective coating and air. Further, the low refractive index layer may be silicon oxide; the high refractive index layer may be tantalum oxide or silicon nitride.

Abstract: The present invention is related to a method for risk detection, diagnosis, prognosis and monitoring of Alzheimer's disease (AD). The method comprises the steps of: (1) measuring the level of glyceraldehyde 3-phosphate dehydrogenase (GAPDH) in a sample from the subject, and (2) comparing the level of GAPDH in the sample with two or more AD reference levels of GAPDH.

Abstract: An example reinforcement structure for protecting a wafer-level camera module includes a top sheet element and a side sheet element. The top sheet element is to be disposed over a top surface of the camera module and includes a first opening for allowing light to pass through to the camera module. The side sheet element is coupled to the top sheet element for securing the reinforcement structure to a printed circuit board (PCB). A second opening in the side sheet element is included to allow an adhesive to be dispensed through the second opening to adhere the reinforcement structure to the camera module.

Abstract: Embodiments of the invention describe an electro-magnetic interference (EMI) shield cover disposed over a wafer level camera module. Said camera module includes substrate having a plurality of imaging pixels, an imaging lens unit disposed on a top side the substrate and a plurality of conductive connectors disposed a bottom side of the substrate, wherein at least one of the conductive connectors comprises a ground connector. The substrate further includes a thru-silicon via (TSV) accessible on the top-side of the substrate and communicatively coupled to the ground connector. The EMI shield is communicatively coupled to the TSV, and thus coupled to the ground connection of the digital camera module.

Abstract: An example reinforcement structure for protecting a wafer-level camera module includes a top sheet element and a side sheet element. The top sheet element is to be disposed over a top surface of the camera module and includes a first opening for allowing light to pass through to the camera module. The side sheet element is coupled to the top sheet element for securing the reinforcement structure to a printed circuit board (PCB). A second opening in the side sheet element is included to allow an adhesive to be dispensed through the second opening to adhere the reinforcement structure to the camera module.