Patents by Inventor Chen Wen

Chen Wen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12009575
    Abstract: A package structure including a first redistribution circuit structure, a semiconductor die, first antennas and second antennas is provided. The semiconductor die is located on and electrically connected to the first redistribution circuit structure. The first antennas and the second antennas are located over the first redistribution circuit structure and electrically connected to the semiconductor die through the first redistribution circuit structure. A first group of the first antennas are located at a first position, a first group of the second antennas are located at a second position, and the first position is different from the second position in a stacking direction of the first redistribution circuit structure and the semiconductor die.
    Type: Grant
    Filed: April 18, 2023
    Date of Patent: June 11, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Nan-Chin Chuang, Chen-Hua Yu, Chung-Shi Liu, Chao-Wen Shih, Shou-Zen Chang
  • Publication number: 20240186408
    Abstract: Transistors with improved saturation drain current and methods for making such transistors are disclosed. The gate is formed in the shape of a longitudinal trench and a plurality of lateral trenches below the longitudinal trench. The resulting dual-recess structure increases the surface area of the gate, which permits additional charge carriers and increases the saturation drain current of the transistor. Such transistors can be useful in high voltage and medium voltage applications such as in display driver integrated circuits.
    Type: Application
    Filed: January 5, 2023
    Publication date: June 6, 2024
    Inventors: Chen-Liang Chu, Chien-Chih Chou, Ta-Yuan Kung, Chun-Hsun Lee, Chih-Wen Yao, Yi-Huan Chen, Ming-Ta Lei
  • Patent number: 12002716
    Abstract: In a method of manufacturing a semiconductor device, a fin structure including a stacked layer of first and second semiconductor layers and a hard mask layer over the stacked layer is formed. A sacrificial cladding layer is formed over at least sidewalls of the exposed hard mask layer and stacked layer. An etching is performed to remove lateral portions of the sacrificial cladding layer, thereby leaving the sacrificial cladding layer on sidewalls of the exposed hard mask layer and stacked layer. A first dielectric layer and a second dielectric layer made of a different material than the first dielectric layer are formed. The second dielectric layer is recessed, and a third dielectric layer made of a different material than the second dielectric layer is formed on the recessed second dielectric layer. During the etching operation, a protection layer is formed over the sacrificial cladding layer.
    Type: Grant
    Filed: March 13, 2023
    Date of Patent: June 4, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Shu-Wen Shen, Chen-Ping Chen
  • Patent number: 11999868
    Abstract: A resin composition and a filter element are provided. The resin composition includes a black coloring agent (A), an ethylenically-unsaturated monomer (B), a solvent (C), a resin (D), and a photoinitiator (E). The black coloring agent (A) includes a titanium black (A-1) and a carbon black (A-2). Based on a total usage amount of 100 parts by weight of the titanium black (A-1) and the carbon black (A-2), a usage amount of the titanium black (A-1) is 50 parts by weight to 75 parts by weight.
    Type: Grant
    Filed: January 7, 2021
    Date of Patent: June 4, 2024
    Assignee: eChem Solutions Corp.
    Inventors: Yu-Wen Chen, Yi-Lun Chiu, Chia-Hao Lou, Chen-Wen Chiu
  • Publication number: 20240176093
    Abstract: An optical system affixed to an electronic apparatus is provided, including a first optical module, a second optical module, and a third optical module. The first optical module is configured to adjust the moving direction of a first light from a first moving direction to a second moving direction, wherein the first moving direction is not parallel to the second moving direction. The second optical module is configured to receive the first light moving in the second moving direction. The first light reaches the third optical module via the first optical module and the second optical module in sequence. The third optical module includes a first photoelectric converter configured to transform the first light into a first image signal.
    Type: Application
    Filed: February 5, 2024
    Publication date: May 30, 2024
    Inventors: Chao-Chang HU, Chih-Wei WENG, Chia-Che WU, Chien-Yu KAO, Hsiao-Hsin HU, He-Ling CHANG, Chao-Hsi WANG, Chen-Hsien FAN, Che-Wei CHANG, Mao-Gen JIAN, Sung-Mao TSAI, Wei-Jhe SHEN, Yung-Ping YANG, Sin-Hong LIN, Tzu-Yu CHANG, Sin-Jhong SONG, Shang-Yu HSU, Meng-Ting LIN, Shih-Wei HUNG, Yu-Huai LIAO, Mao-Kuo HSU, Hsueh-Ju LU, Ching-Chieh HUANG, Chih-Wen CHIANG, Yu-Chiao LO, Ying-Jen WANG, Shu-Shan CHEN, Che-Hsiang CHIU
  • Publication number: 20240178137
    Abstract: A method for determining antenna rule for a radio-frequency (RF) device includes the steps of forming a gate structure on a substrate, forming a source/drain region adjacent to the gate structure, forming a first metal routing on the source/drain region, and then forming a second metal routing on the gate structure. Preferably, a sum of an area of the first metal routing and an area of the second metal routing divided by an area of the gate structure is less than a ratio.
    Type: Application
    Filed: February 10, 2023
    Publication date: May 30, 2024
    Applicant: UNITED MICROELECTRONICS CORP.
    Inventors: XINGXING CHEN, Ching-Yang Wen, Purakh Raj Verma
  • Publication number: 20240162317
    Abstract: A non-volatile memory device includes a memory cell including a substrate, a select gate, a control gate, a planar floating gate, a coupling dielectric layer, an erase gate dielectric layer, and an erase gate. The select gate and the control gate are disposed on the substrate and laterally spaced apart from each other, and the control gate includes a non-vertical surface. The planar floating gate includes a lateral tip laterally spaced apart from the control gate. The coupling dielectric layer includes a first thickness (T1). The erase gate dielectric layer covers the non-vertical surface of the control gate and the lateral tip of the planar floating gate, and includes a second thickness (T2). The erase gate covers the erase gate dielectric layer and the lateral tip of the planar floating gate. The first thickness and the second thickness satisfy the following relation: (T2)<(T1)<2(T2).
    Type: Application
    Filed: October 20, 2023
    Publication date: May 16, 2024
    Inventors: Der-Tsyr Fan, I-Hsin Huang, Tzung-Wen Cheng, Yu-Ming Cheng, Chen-Ming Tsai
  • Publication number: 20240156092
    Abstract: The invention relates to a composition for promoting the growth of legumes. The composition includes auxin, choline chloride and ?-aminobutyric acid (GABA). The invention also relates to a method for promoting the growth of legumes.
    Type: Application
    Filed: October 26, 2022
    Publication date: May 16, 2024
    Inventors: Ting-Wen CHENG, Cho-Chun HUANG, Gui-Jun Li, Kai XIA, Chen-Pang WU
  • Publication number: 20240155298
    Abstract: A bone conduction receiver includes a housing, a vibrating plate, a bracket, a magnetic loop assembly, a coil, and a protective cover. The vibrating plate is disposed inside the housing and keeps a distance from an inner bottom of the housing. The protective cover is located on one side of the vibrating plate, facing away from the inner bottom of the housing, and covers the opening of the accommodation room. The bracket is located on the side of the vibrating plate, facing away from the inner bottom of the housing. The magnetic loop assembly is secured in the bracket. One end of the coil is fixed to an inner side of the protective cover, and another end of the coil extends into the bracket and surrounds the magnetic loop assembly.
    Type: Application
    Filed: April 26, 2023
    Publication date: May 9, 2024
    Inventors: Tseng-Feng Wen, Hui Xue, Yangfang Chen
  • Publication number: 20240152726
    Abstract: A processor-implemented method for a neural architecture search (NAS) starts by generating an over-parameterized super network having multiple layers. The super network has multiple operator types. Each of the layers includes a largest super kernel corresponding to a search space. The method also includes performing gradient descent to evolve a largest super kernel to a small kernel corresponding to the search space in order to generate a range of kernel encodings. The method further includes identifying a subset of kernel encodings from the range of kernel encodings, for each layer of the super network, based on the gradient descent. The method determines a set of candidate architectures based on the subset of kernel encodings, each of the candidate architectures having a different model size. The method selects a target model, from the set of architectures, based on meeting hardware specifications, and then applies the target model.
    Type: Application
    Filed: August 1, 2023
    Publication date: May 9, 2024
    Inventors: Chen FENG, Xiaopeng ZHANG, Shaojie ZHUO, Ramchalam KINATTINKARA RAMAKRISHNAN, Chenzheng SU, Liang SHEN, Zi Wen HAN, Yicheng LIN
  • Publication number: 20240153881
    Abstract: A method of forming semiconductor structure includes attaching backsides of top dies to a front side of a bottom wafer, the bottom wafer comprising a plurality of bottom dies; forming first conductive pillars on the front side of the bottom wafer adjacent to the top dies; forming a first dielectric material on the front side of the bottom wafer around the top dies and around the first conductive pillars; and dicing the bottom wafer to form a plurality of structures, each of the plurality of structures comprising at least one of the top dies and at least one of the bottom dies.
    Type: Application
    Filed: January 2, 2024
    Publication date: May 9, 2024
    Inventors: Chen-Hua Yu, Tzuan-Horng Liu, Ming-Fa Chen, Chao-Wen Shih, Sung-Feng Yeh
  • Patent number: 11977655
    Abstract: A computer-implemented method, a computer system, and computer program product for associating security events. The method includes obtaining a result of implementation of one or more Locality-Sensitive Hashing (LSH) functions to feature data of a first event detected by a first device. The method also includes mapping the result to one or more positions in a data structure. In response to data elements of the one or more positions indicating first information associating with the one or more positions exists in a storage, the method includes obtaining the first information from the storage. The method further includes sending the first information to the first device.
    Type: Grant
    Filed: August 25, 2020
    Date of Patent: May 7, 2024
    Assignee: International Business Machines Corporation
    Inventors: Jia-Sian Jhang, Chen-Yu Kuo, Hsiao-Yung Chen, Lu Cheng Lin, Chien Wen Jung
  • Publication number: 20240142749
    Abstract: An optical element driving mechanism is provided and includes a fixed assembly, a first movable assembly and a first driving assembly. The first movable assembly is configured to connect a first optical element, and the first movable assembly is movable relative to the fixed assembly. The first driving assembly is configured to drive the first movable assembly to move relative to the fixed assembly in a first dimension.
    Type: Application
    Filed: January 4, 2024
    Publication date: May 2, 2024
    Inventors: Chao-Chang HU, Chen-Hsien FAN, Chih-Wen CHIANG, Chien-Yu KAO
  • Publication number: 20240136312
    Abstract: A semiconductor device includes a first wafer having a deep trench capacitor and a second wafer bonded to the first wafer, in which the second wafer includes a first active device on a first silicon-on-insulator (SOI) substrate and a first metal interconnection connected to the first active device and the deep trench capacitor. The first wafer further includes the deep trench capacitor disposed in a substrate, a first inter-layer dielectric (ILD) layer on the deep trench capacitor, a first inter-metal dielectric (IMD) layer on the first ILD layer, and a second metal interconnection in the first ILD layer and the first IMD layer.
    Type: Application
    Filed: November 17, 2022
    Publication date: April 25, 2024
    Applicant: UNITED MICROELECTRONICS CORP.
    Inventors: Purakh Raj Verma, Ching-Yang Wen, XINGXING CHEN
  • Publication number: 20240133421
    Abstract: An electronic device includes a monitor stand, a hinge mechanism, and an operation element. The hinge mechanism includes a back plate, a speed reduction assembly, and a friction assembly. The back plate is fixed to the monitor stand. The speed reduction assembly includes an input plate and a speed reduction member. The speed reduction member is arranged on the input plate. The friction assembly is arranged between the back plate and the input plate. The operation element is connected to the speed reduction member. A rotation center of the operation element coincides with an axis of the back plate and the speed reduction member are coaxially arranged.
    Type: Application
    Filed: January 17, 2023
    Publication date: April 25, 2024
    Inventors: Chih-Wei KUO, Yu-Chun HUNG, Che-Yen CHOU, Chen-Wei TSAI, Hsiang-Wen HUANG
  • Publication number: 20240136280
    Abstract: A method includes forming a dielectric layer over a contact pad of a device, forming a first polymer layer over the dielectric layer, forming a first conductive line and a first portion of a second conductive line over the first polymer layer, patterning a photoresist to form an opening over the first portion of the second conductive feature, wherein after patterning the photoresist the first conductive line remains covered by photoresist, forming a second portion of the second conductive line in the opening, wherein the second portion of the second conductive line physically contacts the first portion of the second conductive line, and forming a second polymer layer extending completely over the first conductive line and the second portion of the second conductive line.
    Type: Application
    Filed: January 2, 2024
    Publication date: April 25, 2024
    Inventors: Chao-Wen Shih, Chen-Hua Yu, Han-Ping Pu, Hsin-Yu Pan, Hao-Yi Tsai, Sen-Kuei Hsu
  • Patent number: 11961791
    Abstract: A device includes a redistribution line, and a polymer region molded over the redistribution line. The polymer region includes a first flat top surface. A conductive region is disposed in the polymer region and electrically coupled to the redistribution line. The conductive region includes a second flat top surface not higher than the first flat top surface.
    Type: Grant
    Filed: May 18, 2022
    Date of Patent: April 16, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Ching-Wen Hsiao, Ming-Da Cheng, Chih-Wei Lin, Chen-Shien Chen, Chih-Hua Chen, Chen-Cheng Kuo
  • Publication number: 20240121771
    Abstract: A scheduling electronic device is used for selecting a candidate time-frequency resource set required for communication of a predetermined electronic device in the group to which the scheduling electronic device belongs; and the scheduling electronic device comprises a processing circuit, and the processing circuit is configured to: receive, from at least one member electronic device located in an overlapping region between said group and other groups, a cooperative sensing result obtained by sensing a time-frequency resource by the at least one member electronic device during at least a portion of a cooperative resource sensing window, so as to assist the scheduling electronic device in selecting a candidate time-frequency resource set, the cooperative resource sensing window being a time period for the at least one member electronic device to perform the assistance so as to sense the time-frequency resource.
    Type: Application
    Filed: April 12, 2022
    Publication date: April 11, 2024
    Applicant: Sony Group Corporation
    Inventors: Yanzhao HOU, Xiaofeng TAO, Yang WEN, Chengrui WANG, Yinan GUO, Xiaoxue WANG, Chen SUN
  • Patent number: 11955385
    Abstract: A semiconductor device includes a first stack structure, a second stack structure, and a third stack structure. Each of the stack structure includes semiconductor layers vertically spaced from one another. The first, second, and third stack structures all extend along a first lateral direction. The second stack structure is disposed between the first and third stack structures. The semiconductor device includes a first gate structure that extends along a second lateral direction and wraps around each of the semiconductor layers. The semiconductor layers of the first stack structure are coupled with respective source/drain structures. The semiconductor layers of the second stack structure are coupled with respective source/drain structures. The semiconductor layers of the third stack structure are coupled with a dielectric passivation layer.
    Type: Grant
    Filed: August 27, 2021
    Date of Patent: April 9, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Shih-Yao Lin, Chih-Han Lin, Chen-Ping Chen, Hsiao Wen Lee
  • Patent number: 11955292
    Abstract: A structure of capacitors connected in parallel includes a substrate. A trench embedded in the substrate. Numerous electrode layers respectively conformally fill in and cover the trench. The electrode layers are formed of numerous nth electrode layers, wherein n is a positive integer from 1 to M, and M is not less than 3. The nth electrode layer with smaller n is closer to the sidewall of the trench. When n equals to M, the Mth electrode layer fills in the center of the trench, and the top surface of the Mth electrode is aligned with the top surface of the substrate. A capacitor dielectric layer is disposed between the adjacent electrode layers. A first conductive plug contacts the nth electrode layer with odd-numbered n. A second conductive plug contacts the nth electrode layer with even-numbered n.
    Type: Grant
    Filed: November 15, 2022
    Date of Patent: April 9, 2024
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Purakh Raj Verma, Ching-Yang Wen, Xingxing Chen, Chao Jin