Abstract: A method of fabricating a contact structure includes the following steps. An opening is formed in a dielectric layer. A conductive material layer is formed within the opening and on the dielectric layer, wherein the conductive material layer includes a bottom section having a first thickness and a top section having a second thickness, the second thickness is greater than the first thickness. A first treatment is performed on the conductive material layer to form a first oxide layer on the bottom section and on the top section of the conductive material layer. A second treatment is performed to remove at least portions of the first oxide layer and at least portions of the conductive material layer, wherein after performing the second treatment, the bottom section and the top section of the conductive material layer have substantially equal thickness.

Abstract: An embodiment for improved authentication of chatbot users for chat history recovery. The embodiment may record a first chat conversation between a first chat service operator and a first user, wherein the first chat conversation includes a first-step authentication and a chat history. The embodiment may detect a request to resume the first chat conversation. The embodiment may, in response to detecting the request to resume the first chat conversation, initiate a recovery process by sending a random-generated token to the first-step authentication. The embodiment may receive verification of the random-generated token. The embodiment may generate, by a large language model, one or more authentication questions based on content of the chat history. The embodiment may authenticate the first user based on one or more correct answers to the one or more authentication questions. The embodiment may resume the first chat conversation including the chat history.

Abstract: The present disclosure relates to the technical field of antennas, and discloses a control method, a control component and a control device.

Abstract: A semiconductor structure and a method of forming the same are provided. An exemplary method of forming the semiconductor structure includes receiving a workpiece including a fin structure over a front side of a substrate, recessing a source region of the fin structure to form a source opening, extending the source opening into the substrate to form a plug opening, forming a semiconductor plug in the plug opening, planarizing the substrate to expose the semiconductor plug from a back side of the substrate, performing a first wet etching process to remove a portion of the substrate, performing a pre-amorphous implantation (PAI) process to amorphize a rest portion of the substrate, performing a second wet etching process to remove the amorphized rest portion of the substrate to form a dielectric opening, depositing a dielectric layer in the dielectric opening, and replacing the semiconductor plug with a backside source contact.

Abstract: A modified polyphenylene ether resin having a structure represented by [Formula 1] is provided.

Abstract: The present disclosure relates to a copolymer and a polymersome for targeted delivery of biomolecules to a living organism. The exemplary copolymer comprises an initiator block, a propagator block, and a linkage connecting the initiator block and the propagator block. The initiator block comprises a glycan head configured to provide a targeted delivery, and the propagator block comprises a functional moiety configured to provide desired properties for the polymersome.

Abstract: Method, device and computer program product for wireless communication are provided. A method includes: transmitting, by a first wireless communication node, a control message to a second wireless communication node, to control the second wireless communication node to instruct a wireless communication terminal to enter a radio resource control, RRC, inactive mode and transmitting at least one small data transmission, SDT, configuration to the wireless communication terminal.

Abstract: A device and a method for detecting a light irradiating angle are disclosed. The device, used to detect the incident direction of a light ray, includes a solar sensor and a processor. The sensing unit of the solar sensor has sensing areas. The sensing areas correspondingly generate sensing signals based on the intensity of the light ray. A mask covers the sensing unit and has an X-shaped light transmitting portion. The light ray transmits the X-shaped light transmitting portion to form an X-axis light ray and a Y-axis light ray. The X-axis light ray intersects the Y-axis light ray. The X-axis light ray and the Y-axis light ray fall on the sensing area. The processor, coupled to the sensing unit, receives the sensing signals and determines information of the incident direction according to the sensing signals.

Abstract: A resin composition and a filter element are provided. The resin composition includes a black coloring agent (A), an ethylenically-unsaturated monomer (B), a solvent (C), a resin (D), and a photoinitiator (E). The black coloring agent (A) includes a titanium black (A-1) and a carbon black (A-2). Based on a total usage amount of 100 parts by weight of the titanium black (A-1) and the carbon black (A-2), a usage amount of the titanium black (A-1) is 50 parts by weight to 75 parts by weight.

Abstract: An optical system affixed to an electronic apparatus is provided, including a first optical module, a second optical module, and a third optical module. The first optical module is configured to adjust the moving direction of a first light from a first moving direction to a second moving direction, wherein the first moving direction is not parallel to the second moving direction. The second optical module is configured to receive the first light moving in the second moving direction. The first light reaches the third optical module via the first optical module and the second optical module in sequence. The third optical module includes a first photoelectric converter configured to transform the first light into a first image signal.

Abstract: This application provide an audio playing method, an electronic device, and a system. The method is applied to a first device, and includes: obtaining first data when a first trigger condition is met, where the first trigger condition includes: a first instruction for playing an audio is received, or a connection to a device configured to play an audio is disconnected, and the first data is data obtained by at least one assisting device capable of communicating with the first device; and determining, based on the first data, that an audio playing manner of the first device is a first manner in a plurality of manners, where the plurality of manners include at least one of the following: playing the audio by using a loudspeaker of the first device, playing the audio by using a second device, or stopping playing the audio.

Abstract: A resin composition and a filter element are provided. The resin composition includes a black coloring agent (A), an ethylenically-unsaturated monomer (B), a solvent (C), a resin (D), and a photoinitiator (E). The black coloring agent (A) includes a titanium black (A-1) and a carbon black (A-2). Based on a total usage amount of 100 parts by weight of the titanium black (A-1) and the carbon black (A-2), a usage amount of the titanium black (A-1) is 50 parts by weight to 75 parts by weight.

Abstract: A resin composition and a filter element are provided. The resin composition includes a black coloring agent (A), an ethylenically-unsaturated monomer (B), a solvent (C), a resin (D), and a photoinitiator (E). The black coloring agent (A) includes a titanium black (A-1) and a carbon black (A-2). Based on a total usage amount of 100 parts by weight of the titanium black (A-1) and the carbon black (A-2), a usage amount of the titanium black (A-1) is 50 parts by weight to 75 parts by weight.

Abstract: The present disclosure provides a probing apparatus for semiconductor devices using pressurized fluid to control the testing conditions. The probing apparatus includes a housing configured to define a testing chamber; a device holder positioned on the housing and configured to hold and support at least one device under test; a platen positioned on the housing and configured to retain at least one probe; a card holder positioned on the platen and configured to hold a probe card including the probe; and at least one flow line positioned in the card holder. The flow line is configured to flow a fluid therein to adjust the temperature of the device under test.

Abstract: A photosensitive resin composition, an optical film and a method of producing the same are provided. The photosensitive resin composition includes a thiol compound (A) having two or more groups represented by formula (I-a), a polyether-modified polysiloxane (B), an ethylenically unsaturated group-containing compound (C) having one or two aromatic rings, a bisphenol fluorene oligomer (D) having one or two (meth)acryloyl groups, and a photoinitiator (E).

Abstract: A black resin composition, a cured film, and a black filter are provided. The black resin composition includes: a black coloring agent (A), an ethylenically-unsaturated monomer (B), a solvent (C), a resin (D), a photoinitiator (E), a UV absorber (F), and a surfactant (G). The resin (D) includes a first resin having a weight-average molecular weight of 2,000 to 20,000. The first resin includes a structural unit having a fluorene ring and two or more ethylenically-polymerizable groups. The UV absorber (F) includes a benzylidene-based derivative.

Abstract: The present disclosure provides a probing apparatus for semiconductor devices using pressurized fluid to control the testing conditions. The probing apparatus includes a housing configured to define a testing chamber; a device holder positioned on the housing and configured to hold and support at least one device under test; a platen positioned on the housing and configured to retain at least one probe; a card holder positioned on the platen and configured to hold a probe card including the probe; and at least one flow line positioned in the card holder. The flow line is configured to flow a fluid therein to adjust the temperature of the device under test.

Abstract: A photosensitive resin composition for imprinting, a cured article and an optical element are provided. The photosensitive resin composition for imprinting includes a resin (A), an ethylenically unsaturated monomer (B), a photoinitiator (C), a solvent (D), and a hydrophobic oligomer (E). The resin (A) has a weight average molecular weight of 1,000 to 50,000 and has two or more ethylenic polymerizable groups.

Abstract: A vestibular system examination device includes a platform unit and an examination unit. The platform unit includes a base, a driving mechanism mounted to the base, and a seat mounted to the driving mechanism and adapted for a user to sit thereon. The seat is driven movably and rotatably with six degrees of freedom by the driving mechanism. The examining unit includes a detector adapted for detecting eye movement or electrooculography of the user, a measuring module electrically connected to the platform unit for measuring location and displacement thereof, and a processing module electrically connected to the detector and the measuring module for receiving and processing data acquired from the detector and the measuring module.

Abstract: A semiconductor device includes a carrier, a power semiconductor die that includes first and second opposite facing main surfaces, a side surface extending from the first main surface to the second main surface, and first and second electrodes disposed on the first and second main surfaces, respectively, a die attach material arranged between the carrier and the first electrode, wherein the die attach material forms a fillet at the side surface of the power semiconductor die, wherein a fillet height of the fillet is less than about 95% of a height of the power semiconductor die, wherein the height of the power semiconductor die is a length of the side surface, and wherein a maximum extension of the die attach material over edges of a main surface of the power semiconductor die facing the die attach material is less than about 200 micrometers.