Abstract: A testing jig for semiconductor components, mainly comprising a main jig body, wherein on its bottom is provided with a retrieving head. While on the center of the bottom of the retrieving head is provided with a concave space, around which is arranged a plurality of air holes which are connected with the internal airways and also connected with the air inlet on the top of the main body. Furthermore, on the bottom of the main jig body is provided with two buffer blocks on opposite sides, which can prevent the chip on the center of the base board from being contacted with external force or foreign objects in the process of retrieving the base board during testing.

Abstract: A multi-layer substrate for an IC chip having a plurality of pads comprises a first layer having a plurality of conducting lines electrically connected to the pads of the IC chip, whereby a first current is generated in the conducting lines, and a second layer has a ground plane electrically connected to a ground, and a plurality of via holes penetrating the second layer and the conducting plane, wherein the via holes are arranged to make a second current in the conducting plane induced by the first current flowing to the ground.

Abstract: The connector has a socket with two parallel rows of holes formed from the front face to the rear face and a tube inserted in each hole and extending from the rear face of the socket and an insert securely inserted between the two parallel rows of tubes and having multiple capacitors each connected to one of the tubes so as to eliminate electromagnetic interference.

Abstract: The present invention relates to a testing jig for semiconductor components, mainly comprising a main jig body, wherein on its bottom is provided with a retrieving head. While on the center of the bottom of the retrieving head is provided with a concave space, around which is arranged a plurality of air holes which are connected with the internal airways and also connected with the air inlet on the top of the main body. Furthermore, on the bottom of the main jig body is provided with two buffer blocks on opposite sides, which can prevent the chip on the center of the base board from being contacted with external force or foreign objects in the process of retrieving the base board during testing.

Abstract: A method of coating phosphor particles by chemical vapor deposition. The phosphors are coated by introducing an inert gas into a reaction vessel; charging phosphor particles into the reaction vessel; heating the reaction vessel to a reaction temperature; introducing a coating precursor which includes carbon into the reaction vessel for a time sufficient to saturate the phosphor particles with the precursor; continuing precursor flow into the reaction vessel; introducing an oxygen/ozone mixture into the reaction vessel, the oxygen/ozone mixture comprising less than 4.4 wt. % ozone; and maintaining the inert gas flow, oxygen/ozone mixture flow and further precursor supply for a time sufficient to coat the phosphor particles. The process produces phosphors having from 2200 to 6300 ppm of carbon on the coating and provides lamp efficacy's of greater than 6.1 lm/watt.

Abstract: A method for reducing electrical noise inside a ball grid array package for installing capacitors between a plurality of power pads and ground pads on a top side of a substrate of the ball grid array package coats solder paste on the plurality of power pads and ground pads, coats adhesive glue beneath the plurality of capacitors, fixes the plurality of capacitors on the power pads and ground pads with the adhesive glue and solder paste, and solidifies the adhesive glue in a reflow soldering stove.

Abstract: A process for preparing particles of zinc sulfide-based electroluminescent phosphor having a moisture resistant coating thereon which comprises the steps of selecting a reaction vessel having a given height and a porous disc at the bottom thereof; charging the reaction vessel with phosphor particles and fluidizing the particles by introducing an inert gas into the vessel through the porous disc; heating the reaction vessel to a reaction temperature; introducing a coating precursor into the reaction vessel at a position adjacent the bottom of the vessel but above the disc; introducing a co-reactant into the reaction vessel at a position substantially mid-way of the given height; and maintaining the inert gas flow, the precursor flow and the co-reactant flow for a time sufficient for a reaction to occur and coat the phosphor with the moisture resistant coating. Apparatus for carrying out the process is also disclosed.

Abstract: A bond pad structure and a method of fabricating such structure are disclosed in the invention. The bond pad structure is formed over a predetermined area defined on a semiconductor substrate. The bond pad structure includes at least two metal layers formed over the predetermined area and at least one sub-structure combination layer which each is formed over the predetermined area and formed between two corresponding first metal layers. Each sub-structure combination layer includes a dielectric layer formed over the predetermined area, formed-through via openings with special disposition on the dielectric layer, a first diffusion barrier layer formed over the dielectric layer and the sidewalls and bottom of the via openings, a metal material filled into the via openings to form via plugs, and a second diffusion barrier layer formed over the first diffusion barrier layer and via plugs.

Abstract: A multi-layered substrate having built-in capacitors is used to decouple high frequency noise generated by voltage fluctuations between a power plane and a ground plane of a multi-layered substrate. At least one kind of dielectric material, which is filled in through holes between the power plane and the ground plane, with high dielectric constant is used to form the built-in capacitors.

Abstract: A multi-layered substrate having built-in capacitors is disclosed. The substrate comprises at least one high permittivity of dielectric material filled in the through holes between the power plane and the ground plane so as to form capacitors. The built in capacitors are to decouple high frequency noise due to the voltage fluctuation.

Abstract: A bond pad structure and a method of fabricating such structure are disclosed in the invention. The bond pad structure is formed over a predetermined area defined on a semiconductor substrate. The bond pad structure includes at least two metal layers formed over the predetermined area and at least one sub-structure combination layer which each is formed over the predetermined area and formed between two corresponding first metal layers. Each sub-structure combination layer includes a dielectric layer formed over the predetermined area, formed-through via openings with special disposition on the dielectric layer, a first diffusion barrier layer formed over the dielectric layer and the sidewalls and bottom of the via openings, a metal material filled into the via openings to form via plugs, and a second diffusion barrier layer formed over the first diffusion barrier layer and via plugs.

Abstract: A phosphor particle has thereon a moisture resistant treatment of a metallic nitride. By moisture resistant is meant a condition allowing the phosphor particle to function in a humid atmosphere for a significantly longer period of time than an untreated particle. The method of making such phosphors comprises the steps of introducing an inert gas into a reaction vessel; charging phosphor particles into the reaction vessel; heating the reaction vessel to a reaction temperature; introducing a nitride coating precursor into the reaction vessel in a manner to avoid restrictive reactions; introducing a co-reactant into the reaction vessel; and maintaining the inert gas flow, co-reactant flow and precursor supply for a time sufficient to moisture-proof the phosphor particles.

Abstract: A method of coating phosphor particles by chemical vapor deposition. The phosphors are coated by introducing an inert gas into a reaction vessel; charging phosphor particles into the reaction vessel; heating the reaction vessel to a reaction temperature; introducing a coating precursor which includes carbon into the reaction vessel for a time sufficient to saturate the phosphor particles with the precursor; continuing precursor flow into the reaction vessel; introducing an oxygen/ozone mixture into the reaction vessel, the oxygen/ozone mixture comprising less than 4.4 wt. % ozone; and maintaining the inert gas flow, oxygen/ozone mixture flow and further precursor supply for a time sufficient to coat the phosphor particles. The process produces phosphors having from 2200 to 6300 ppm of carbon on the coating and provides lamp efficacy's of greater than 6.1 lm/watt.

Abstract: A method of coating phosphor particles that comprises the steps of introducing an inert gas into a reaction vessel; charging phosphor particles into the reaction vessel; heating the reaction vessel to a reaction temperature; introducing a coating precursor into the reaction vessel; introducing an oxygen/ozone mixture into the reaction vessel; and maintaining the agitation, inert gas flow, oxygen/ozone mixture flow and precursor supply for a time sufficient to coat the phosphor particles. This process yields phosphors having a half-life of upwards of 3,100 hours with efficacys of greater than 6 lumens per watt (lm/w).

Abstract: A phosphor particle has thereon a moisture resistant treatment of a metallic nitride. By moisture resistant is meant a condition allowing the phosphor particle to function in a humid atmosphere for a significantly longer period of time than an untreated particle. The method of making such phosphors comprises the steps of introducing an inert gas into a reaction vessel; charging phosphor particles into the reaction vessel; heating the reaction vessel to a reaction temperature; introducing a nitride coating precursor into the reaction vessel in a manner to avoid restrictive reactions; introducing a co-reactant into the reaction vessel; and maintaining the inert gas flow, co-reactant flow and precursor supply for a time sufficient to moisture-proof the phosphor particles.

Abstract: A tray is adapted to receive a plurality of ball grid array devices therein, and includes a base plate having a device-receiving portion and a peripheral portion around the device-receiving portion. The device-receiving portion has a top side formed with a device-receiving recess. The top side of the device-receiving portion is further formed with a partition unit in the device-receiving recess for dividing the device-receiving recess into a plurality of cavities adapted for receiving the ball grid array devices respectively therein. The device-receiving portion further has a bottom side formed with a plurality of openings. Each of the openings is aligned with a corresponding one of the cavities and is adapted to receive an array of ball contacts formed on a bottom side of the ball grid array device that is disposed in the corresponding one of the cavities therein.

Abstract: A method for forming a continuous, conformal non-particulate coating of boron oxide on individual phosphor particles is provided. The method involves reacting a boron-containing precursor with an oxidizing gas in a fluidized bed of phosphor particles. The boron oxide coated phosphor exhibits an increased quantum efficiency under ultraviolet (UV) and vacuum ultraviolet (VUV) excitation.

Abstract: A movable and automatic sawing and clamping device for wood, wherein two pipe-like frame portions are separated from each other by a suitable distance. Two sets of horizontal pieces are orthogonal to these portions and are separately provided therebetween. A clamping device can be formed between these horizontal pieces for clamping a saw tool therebetween. The whole clamping framework can be moved by means of a plurality of bottom rollers to cut the workpiece.

Abstract: Porous ceramic composition comprises 24-45 wt % of gairome, 25-45 wt % of chamotte, 2-10 wt % of low thermal expansivity component, 2-10 wt % of mineralizing agents, and 15-30 wt % of at least two kinds of organic components which provide porosity. The porous ceramic radiation plate is produced by sintering the composition, and the end result is a product that is high in quality and has an efficient thermal radiation transfer.

Abstract: A desk lamp, which includes a lamp shade structure comprised of a lamp shade, a sleeve set in the lamp shade, an adjusting rod having a thread portion on its upper end, and a lamp socket; a lamp bracket being to secure the lamp shade structure to a lamp stand and comprised of two parallel rods and upper, intermediate and lower union swivels; and a pendulum having stepped holes therethrough for the setting therein of screw rod, insulator ring and tubes, and lock nuts. Through the control of the sleeve, the lamp shade is allowed to rotate on the lamp bracket. Through the arrangement of the union swivels, the two parallel rods of the lamp bracket form to separate conductive circuits for conducting electricity. Through the lower union swivel, the lamp bracket is permitted to rotate on the lamp stand.