Abstract: Methods and apparatus for fabricating memory devices are provided. In one aspect, an intermediate stack of dielectric layers are formed on a first stack of dielectric layers in a first tier. The intermediate stack of dielectric layers is then partially or fully etched and have a landing pad layer deposited thereon. In response to planarizing the landing pad layer to expose a top surface of the intermediate stack of dielectric layers, a second stack of dielectric layers are deposited above the planarized landing pad layer. A staircase is formed by etching through the second stack, the intermediate stack, and the first stack of dielectric layers in the staircase region of the memory device. The staircase is located adjacent to one end of the center landing pad, where steps of the staircase are formed within the thickness of the center landing pad.

Abstract: A dairy cowshed monitoring system includes a cooling system having a plurality of operating modes, at least one image sensor, at least one temperature/humidity sensor, and a control circuit. The image sensor is for collecting image data in a dairy cowshed and obtaining a cow drinking water frequency in the dairy cowshed. The temperature/humidity sensor is for collecting a temperature and a humidity in the dairy cowshed and calculating a temperature/humidity index according to the temperature and the humidity. The control circuit is coupled to the cooling system, the image sensor and the temperature/humidity sensor and for receiving the image data, the cow drinking water frequency and the temperature/humidity index and determining whether to activate and control the cooling system in one of the operating modes to cool the dairy cowshed according to the cow drinking water frequency and the temperature/humidity index.

Abstract: A semiconductor device includes a semiconductor substrate, multiple memory cells on the semiconductor substrate arranged along a first dimension and along a second dimension that is orthogonal to the first dimension, in which each memory cell of the multiple memory cells includes a channel region in the semiconductor substrate, a tunnel dielectric layer on the channel region, and a first electrode layer on the tunnel dielectric layer. Along the first dimension, the channel region of each memory cell of the multiple memory cells is separated from the channel region of an adjacent memory cell of the multiple memory cells by a corresponding first air gap, each first air gap extending from below an upper surface of the semiconductor substrate up to an inter-electrode dielectric layer.

Abstract: An ink print head has an ink container for storing fluid, a chip installed at a bottom of the ink container having a central slot for passing fluid, and a dry film formed on the chip having a plurality of ink chambers. The ink print head also has a nozzle plate formed below the dry film, a middle portion of the nozzle plate protruding above the nozzle plate so as to form a central refill chamber, a plurality of nozzles corresponding to the ink chambers of the dry film, and a plurality of heaters set on the chip for heating fluid inside the ink chambers so that the fluid can be ejected from the nozzles of the nozzle plate. The fluid inside the ink container will flow through the central slot into the central refill chamber and then into the ink chambers.

Abstract: The locking and ejecting apparatus includes a latching mechanism, an ejection mechanism, a first string and a second string. The latching mechanism is for locking the module device in a locked position or unlocking the module device from the locked position. The ejection mechanism is for ejecting the module device on disengagement of the latching mechanism from the locked position. During the unlocking and ejecting operations, the second button is pulled right after the first button is pressed. After the module device is released from the locked position and ejected out of the internal bay, the first spring positioned to generate a first force restores the latching mechanism and the second spring positioned to generate a second force restores the ejection mechanism.

Abstract: An ink print head has an ink container for storing fluid, a chip installed at a bottom of the ink container having a central slot for passing fluid, and a dry film formed on the chip having a plurality of ink chambers. The ink print head also has a nozzle plate formed below the dry film, a middle portion of the nozzle plate protruding above the nozzle plate so as to form a central refill chamber, a plurality of nozzles corresponding to the ink chambers of the dry film, and a plurality of heaters set on the chip for heating fluid inside the ink chambers so that the fluid can be ejected from the nozzles of the nozzle plate. The fluid inside the ink container will flow through the central slot into the central refill chamber and then into the ink chambers.

Abstract: A manufacturing method of monolithic integrated thermal bubble inkjet print heads and the structure for the same. The method utilizes semiconductor manufacturing technologies to configure various elements in a thermal bubble inkjet print head, such as ink channels, an ink slot, an energy transducer, an orifice plate, on a single substrate. The ink channels are formed on an top surface of the substrate using the anisotropic etching technique. The ink slot is formed on a back surface of the substrate using the anisotropic etching technique. The energy transducer and the orifice plate are formed in order above the ink channels using the coating and etching techniques. This thermal bubble inkjet print head manufacturing method is particularly useful in the all batch process without employing the steps of precision alignment joint for the orifice plate in a conventional inkjet print head. Therefore, the method can greatly increase production efficiency and lower production costs.

Abstract: The locking and ejecting apparatus includes a latching mechanism, an ejection mechanism, a first string and a second string. The latching mechanism is for locking the module device in a locked position or unlocking the module device from the locked position. The ejection mechanism is for ejecting the module device on disengagement of the latching mechanism from the locked position. During the unlocking and ejecting operations, the second button is pulled right after the first button is pressed. After the module device is released from the locked position and ejected out of the internal bay, the first spring positioned to generate a first force restores the latching mechanism and the second spring positioned to generate a second force restores the ejection mechanism.

Abstract: A manufacturing method of monolithic integrated thermal bubble inkjet print heads and the structure for the same. The method utilizes semiconductor manufacturing technologies to configure various elements in a thermal bubble inkjet print head, such as ink channels, an ink slot, an energy transducer, an orifice plate, on a single substrate. The ink channels are formed on an top surface of the substrate using the anisotropic etching technique. The ink slot is formed on a back surface of the substrate using the anisotropic etching technique. The energy transducer and the orifice plate are formed in order above the ink channels using the coating and etching techniques. This thermal bubble inkjet print head manufacturing method is particularly useful in the all batch process without employing the steps of precision alignment joint for the orifice plate in a conventional inkjet print head. Therefore, the method can greatly increase production efficiency and lower production costs.

Abstract: To install a hard disk drive in a portable computer base housing, an upwardly opening well area is formed within the base housing and is sized to closely receive the disk drive. An electrical connector projects horizontally inwardly through one end of the well area and is operatively mateable with a corresponding connector on the front end of the disk drive. A flexible lowering strap is secured to the rear end of the disk drive. To install the disk drive, its front end is lowered into the well area while holding the strap to keep the rear end of the disk drive elevated. The strap is then used to controllably lower the balance of the disk drive into the well area to prevent installation shock to the disk drive that might occur if it were simply dropped into the well area. The lowered disk drive is then slid along the bottom of the well area to mate the well area and disk drive connectors.