Patents by Inventor Chen-Yu Hsieh

Chen-Yu Hsieh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200303945
    Abstract: In general, one or more loads on a vehicle can be connected to both a first voltage source on the vehicle and a backup vehicle power system on the vehicle. If the voltage provided by the first voltage source to the one or more loads satisfies a voltage threshold, the backup vehicle power system does not provide power to the one or more loads. However, if the voltage provided by the first voltage source to the one or more loads falls below the voltage threshold, the backup vehicle power system provides power to the one or more loads.
    Type: Application
    Filed: March 22, 2019
    Publication date: September 24, 2020
    Applicant: Lyft, Inc.
    Inventors: Chen-yu Hsieh, Catalin Popovici
  • Patent number: 10707331
    Abstract: A method includes forming a fin structure on a substrate, forming a dummy gate structure wrapped around the fin structure, depositing an Interlayer Dielectric (ILD) layer over the fin structure, removing the dummy gate structure to expose a portion of the fin structure, and performing an etching process on the portion of the fin structure to reduce a width of the portion of the fin structure.
    Type: Grant
    Filed: April 28, 2017
    Date of Patent: July 7, 2020
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Ka-Hing Fung, Chen-Yu Hsieh, Che-Yuan Hsu, Ming-Yuan Wu, Hsu-Chieh Cheng
  • Patent number: 10626250
    Abstract: The present invention relates to resin composite materials, and more particularly, to low-dielectric resin composition and prepreg, resin film, resin coated copper, laminate and printed circuit board formed therefrom. The low-dielectric resin composition includes a phosphorus-containing flame retardant as shown in formula (I) and a resin with an active unsaturated bond. The low-dielectric resin composition may further be manufactured as a prepreg, a resin film, a resin coated copper, a laminate, or a printed circuit board, having a high glass transition temperature, low dielectric property, halogen-free flame retardancy and low percent of thermal expansion of laminate.
    Type: Grant
    Filed: August 2, 2016
    Date of Patent: April 21, 2020
    Assignee: Elite Electronic Material(Zhongshan) Co., Ltd.
    Inventors: Zhi-Long Hu, Chen-Yu Hsieh
  • Patent number: 10618993
    Abstract: The present invention provides a novel phosphorus-containing olefin polymer that comprises cycloolefin as a first component and a vinyl phosphorus-containing compound as a second component. The present invention further provides a method for producing such phosphorus-containing olefin polymer and a composition and an article comprising the same.
    Type: Grant
    Filed: May 8, 2017
    Date of Patent: April 14, 2020
    Assignee: ELITE MATERIAL CO., LTD.
    Inventor: Chen-Yu Hsieh
  • Patent number: 10604640
    Abstract: Disclosed is a resin composition which comprises a compound with at least two DOPO groups or a combination thereof as the flame retardant and an aliphatic long-chain maleimide compound. The resin composition is useful for the preparation of various articles, such as a prepreg, a resin film, a resin film with copper foil, a laminate or a printed circuit board, achieving at least one, more or all properties improved of laminate formability, reliability of multiple laminations, chemical resistance, thermal resistance, dielectric constant, dissipation factor, interlayer bonding strength, storage modulus and so on.
    Type: Grant
    Filed: November 3, 2017
    Date of Patent: March 31, 2020
    Assignee: ELITE MATERIAL CO., LTD.
    Inventor: Chen-Yu Hsieh
  • Publication number: 20200039454
    Abstract: In general, one or more loads, such as a sensor suite of an autonomous (or semi-autonomous) vehicle, may be configured to draw power from a supercapacitor. A switching mechanism can selectively connect or disconnect the one or more loads and the supercapacitor from a voltage source of a vehicle power system. By systematically disconnecting the voltage source from the supercapacitor and the one or more loads, the exposure of the voltage source to the one or more loads is minimized. Accordingly, the exposure of the voltage source of the vehicle power system to potentially damaging short circuits or power surges that may arise in relation to the one or more loads can also be minimized.
    Type: Application
    Filed: July 31, 2018
    Publication date: February 6, 2020
    Applicant: Lyft, Inc.
    Inventors: Chen-yu Hsieh, Catalin Popovici
  • Patent number: 10538628
    Abstract: Disclosed is a vinylbenzyl imide resin useful in conjunction with other components to prepare a resin composition for making such as a prepreg, a resin film, a resin film with copper foil, a laminate or a printed circuit board, having improved one or more properties including resin flow, resin filling property, flame retardancy, glass transition temperature, thermal resistance, dielectric constant, dissipation factor and interlayer bonding strength. Also disclosed is a method of preparing the vinylbenzyl imide resin, its prepolymer, a resin composition comprising the vinylbenzyl imide resin and/or its polymer and an article made therefrom.
    Type: Grant
    Filed: November 30, 2017
    Date of Patent: January 21, 2020
    Assignee: Elite Material Co., Ltd.
    Inventor: Chen-Yu Hsieh
  • Publication number: 20190265212
    Abstract: Apparatus and methods for high performance liquid chromatography. The apparatus includes a preparation loop comprising two linear stepping pumps, a sample loop comprising a sample injector, a chromatography column, and a detector device. The detector device can include a flash lamp, a flow cell, and a light sensor comprising an entrance slit, a grating; and a charge-coupled device array.
    Type: Application
    Filed: May 15, 2019
    Publication date: August 29, 2019
    Applicant: ACADEMIA SINICA
    Inventors: Chung-Hsuan CHEN, Chen-Yu HSIEH, Jung-Lee LIN
  • Patent number: 10317379
    Abstract: Apparatus and methods for high performance liquid chromatography. The apparatus includes a preparation loop comprising two linear stepping pumps, a sample loop comprising a sample injector, a chromatography column, and a detector device. The detector device can include a flash lamp, a flow cell, and a light sensor comprising an entrance slit, a grating; and a charge-coupled device array.
    Type: Grant
    Filed: November 23, 2014
    Date of Patent: June 11, 2019
    Assignee: Academia Sinica
    Inventors: Chung-Hsuan Chen, Chen-Yu Hsieh, Jung-Lee Lin
  • Patent number: 10280260
    Abstract: The present invention relates to a phosphorus-containing polyphenylene oxide resin, its preparation method, a method for preparing the prepolymer of the phosphorus-containing polyphenylene oxide, a resin composition and an article thereof, wherein the phosphorus-containing polyphenylene oxide resin has a chemical structure represented by the following formula (I): wherein R? is R? is R?? is hydrogen, Through the use of the above phosphorus-containing polyphenylene oxide resin, an article made from the resin composition can has good flame retardance, good thermal resistance and a lower percent of thermal expansion while dielectric properties can be maintained, such that the present invention is suitable for use in products such as copper clad laminate and printed circuit board.
    Type: Grant
    Filed: August 1, 2016
    Date of Patent: May 7, 2019
    Assignee: ELITE MATERIAL CO., LTD.
    Inventors: Chen-Yu Hsieh, Tse-An Lee, Hui-Ting Shih
  • Publication number: 20190077914
    Abstract: Disclosed is a vinylbenzyl imide resin useful in conjunction with other components to prepare a resin composition for making such as a prepreg, a resin film, a resin film with copper foil, a laminate or a printed circuit board, having improved one or more properties including resin flow, resin filling property, flame retardancy, glass transition temperature, thermal resistance, dielectric constant, dissipation factor and interlayer bonding strength. Also disclosed is a method of preparing the vinylbenzyl imide resin, its prepolymer, a resin composition comprising the vinylbenzyl imide resin and/or its polymer and an article made therefrom.
    Type: Application
    Filed: November 30, 2017
    Publication date: March 14, 2019
    Inventor: Chen-Yu HSIEH
  • Publication number: 20190016874
    Abstract: Disclosed is a resin composition which comprises a compound with at least two DOPO groups or a combination thereof as the flame retardant and an aliphatic long-chain maleimide compound. The resin composition is useful for the preparation of various articles, such as a prepreg, a resin film, a resin film with copper foil, a laminate or a printed circuit board, achieving at least one, more or all properties improved of laminate formability, reliability of multiple laminations, chemical resistance, thermal resistance, dielectric constant, dissipation factor, interlayer bonding strength, storage modulus and so on.
    Type: Application
    Filed: November 3, 2017
    Publication date: January 17, 2019
    Inventor: Chen-Yu HSIEH
  • Publication number: 20180362715
    Abstract: The present invention discloses vinyl-modified maleimide, a resin composition using the same and a preparation thereof. The vinyl-modified maleimide has better solvent selectivity and solvent compatibility. The obtained preparation can satisfy the properties of no crack between multilayer boards and high frequency and low dielectric properties maintained after moisture absorption.
    Type: Application
    Filed: December 12, 2017
    Publication date: December 20, 2018
    Inventor: Chen-Yu HSIEH
  • Publication number: 20180315837
    Abstract: A method includes forming a fin structure on a substrate, forming a dummy gate structure wrapped around the fin structure, depositing an Interlayer Dielectric (ILD) layer over the fin structure, removing the dummy gate structure to expose a portion of the fin structure, and performing an etching process on the portion of the fin structure to reduce a width of the portion of the fin structure.
    Type: Application
    Filed: April 28, 2017
    Publication date: November 1, 2018
    Inventors: Ka-Hing Fung, Chen-Yu Hsieh, Che-Yuan Hsu, Ming-Yuan Wu, Hsu-Chieh Cheng
  • Patent number: 10093774
    Abstract: Provided are a modified polyphenylene ether resin, a method of making the same and a resin composition. Particularly, the modified polyphenylene ether resin has a structure represented by the following formula (I), wherein R, Y, PPE, Z and c are as described in the specification. Also provided are a method of making the modified polyphenylene ether resin, a resin composition comprising the modified polyphenylene ether resin and an article made from the resin composition. Using the modified polyphenylene ether resin described above can achieve a better glass transition temperature, thermal resistance and lower (superior) thermal expansion and dielectric properties.
    Type: Grant
    Filed: August 11, 2016
    Date of Patent: October 9, 2018
    Assignee: ELITE ELECTRONICS MATERIAL (KUNSHAN) CO., LTD.
    Inventors: Chen Yu Hsieh, Yan Zhang
  • Patent number: 10023672
    Abstract: Provided is a process of making a polyphenylene oxide prepolymer, comprising a step of reacting a reactive cycloolefin and a vinyl-containing polyphenylene oxide in the presence of a ruthenium catalyst. The reactive cycloolefin may be selected from dicyclopentadiene monomer, dicyclopentadiene oligomer, dicyclopentadiene polymer, norbornene monomer, norbornene oligomer, norbornene polymer, and a combination thereof; the vinyl-containing polyphenylene oxide may be selected from divinylbenzyl polyphenylene oxide resin, vinylbenzyl-modified polyphenylene oxide resin, methacrylic polyphenylene oxide resin, and a combination thereof; the ruthenium catalyst may be a Grubbs catalyst. Also provided are a polyphenylene oxide prepolymer made by the process, a resin composition containing the polyphenylene oxide prepolymer, and a product made from the resin composition.
    Type: Grant
    Filed: November 16, 2016
    Date of Patent: July 17, 2018
    Assignee: ELITE MATERIAL CO., LTD.
    Inventor: Chen-Yu Hsieh
  • Patent number: 10000599
    Abstract: The disclosure relates to a phosphorus-containing vinyl polyphenylene ether obtained by reacting a phosphorus-containing vinyl compound with a vinyl polyphenylene ether, a resin composition including the phosphorus-containing vinyl polyphenylene ether and a product thereof. Various products can be made from the resin composition, such as resin films, prepregs, resin-coated coppers, laminates or printed circuit boards, and they have one, multiple or all of the following properties: lower coefficient of thermal expansion, lower thermal expansion, higher thermal resistance, better flame retardancy, lower dielectric constant, lower dielectric loss and so forth.
    Type: Grant
    Filed: December 9, 2016
    Date of Patent: June 19, 2018
    Assignee: ELITE MATERIAL CO., LTD.
    Inventor: Chen Yu Hsieh
  • Publication number: 20180086870
    Abstract: The disclosure relates to a phosphorus-containing vinyl polyphenylene ether obtained by reacting a phosphorus-containing vinyl compound with a vinyl polyphenylene ether, a resin composition including the phosphorus-containing vinyl polyphenylene ether and a product thereof. Various products can be made from the resin composition, such as resin films, prepregs, resin-coated coppers, laminates or printed circuit boards, and they have one, multiple or all of the following properties: lower coefficient of thermal expansion, lower thermal expansion, higher thermal resistance, better flame retardancy, lower dielectric constant, lower dielectric loss and so forth.
    Type: Application
    Filed: December 9, 2016
    Publication date: March 29, 2018
    Inventor: Chen Yu HSIEH
  • Patent number: 9926435
    Abstract: A resin composition, a copper-clad laminate using the same, and a printed circuit board using the same are introduced. The resin composition comprises a specific phosphorus-containing salt and a prepolymer of vinyl-containing polyphenylene ether. The resin composition features specific ingredients and proportion to thereby achieve satisfactory properties of prepreg made from the resin composition, and attain satisfactory laminate properties, such as high degree of heat resistance and satisfactory dielectric properties, and thus is suitable for producing a prepreg or a resin film to thereby be applicable to copper-clad laminates and printed circuit boards.
    Type: Grant
    Filed: March 10, 2016
    Date of Patent: March 27, 2018
    Assignee: Elite Material Co., Ltd.
    Inventor: Chen-Yu Hsieh
  • Patent number: 9896551
    Abstract: Provided is a phosphaphenanthrene-based compound represented by the following chemical structure: The phosphaphenanthrene-based compound can be added in a resin composition and made into a prepreg or resin film. The prepreg or resin film made from such resin composition has low coefficient of thermal expansion, low dielectric constant and dissipation factor, and flame retardancy, thereby being suitable for copper-clad laminate or printed circuit board.
    Type: Grant
    Filed: March 30, 2016
    Date of Patent: February 20, 2018
    Assignee: Elite Electronic Material(Zhongshan) Co., Ltd.
    Inventors: Zhi-Long Hu, Chen-Yu Hsieh, Xing-Fa Chen, Xiang Xiong