Abstract: Provided is a phosphaphenanthrene-based compound represented by the following chemical structure: The phosphaphenanthrene-based compound can be added in a resin composition and made into a prepreg or resin film. The prepreg or resin film made from such resin composition has low coefficient of thermal expansion, low dielectric constant and dissipation factor, and flame retardancy, thereby being suitable for copper-clad laminate or printed circuit board.

Abstract: Disclosed is a fluorenylidene-diphenol-containing polyphenylene oxide which is defined by the following structural formula wherein D, X, Y, Z and b are defined in the specification. The fluorenylidene-diphenol-modified polyphenylene oxide resin or its prepolymer may be used for producing resin products with better thermal resistance, dielectric property, flame retardancy and lower thermal expansion. Accordingly, the resin products, such as prepregs, laminates or printed circuit boards, are suitable for use in electronic products with high speed and high frequency signal transmission to further improve the reliability, thermal resistance, and dimensional stability of the electronic products.

Abstract: The present invention belongs to the technical field of resin composite materials, in particular relates to a low dielectric composite material and a laminate and printed circuit board prepared therefrom. The composite material is obtained by adhering a low dielectric resin composition with phosphorus-containing flame retardant onto a substrate; the composition comprises the following components: (A) phosphorus-containing flame retardant; (B) vinyl compound. The phosphorus-containing flame retardant has a structure as shown in formula (I).

Abstract: The invention belongs to the technical field of low dielectric resin compositions, and discloses a low dielectric resin composition with phosphorus-containing flame retardant and a prepreg, resin film, laminate and printed circuit board prepared therefrom. The composition comprises the following components: (A) phosphorus-containing flame retardant; (B) vinyl compound. The phosphorus-containing flame retardant has a structure as shown in formula (I).

Abstract: Provided is a process of making a polyphenylene oxide prepolymer, comprising a step of reacting a reactive cycloolefin and a vinyl-containing polyphenylene oxide in the presence of a ruthenium catalyst. The reactive cycloolefin may be selected from dicyclopentadiene monomer, dicyclopentadiene oligomer, dicyclopentadiene polymer, norbornene monomer, norbornene oligomer, norbornene polymer, and a combination thereof; the vinyl-containing polyphenylene oxide may be selected from divinylbenzyl polyphenylene oxide resin, vinylbenzyl-modified polyphenylene oxide resin, methacrylic polyphenylene oxide resin, and a combination thereof; the ruthenium catalyst may be a Grubbs catalyst. Also provided are a polyphenylene oxide prepolymer made by the process, a resin composition containing the polyphenylene oxide prepolymer, and a product made from the resin composition.

Abstract: The present invention provides a novel phosphorus-containing olefin polymer that comprises cycloolefin as a first component and a vinyl phosphorus-containing compound as a second component. The present invention further provides a method for producing such phosphorus-containing olefin polymer and a composition and an article comprising the same.

Abstract: A resin composition, a copper-clad laminate using the same, and a printed circuit board using the same are introduced. The resin composition comprises a specific phosphorus-containing salt and a prepolymer of vinyl-containing polyphenylene ether. The resin composition features specific ingredients and proportion to thereby achieve satisfactory properties of prepreg made from the resin composition, and attain satisfactory laminate properties, such as high degree of heat resistance and satisfactory dielectric properties, and thus is suitable for producing a prepreg or a resin film to thereby be applicable to copper-clad laminates and printed circuit boards.

Abstract: Provided are a modified polyphenylene ether resin, a method of making the same and a resin composition. Particularly, the modified polyphenylene ether resin has a structure represented by the following formula (I), wherein R, Y, PPE, Z and c are as described in the specification. Also provided are a method of making the modified polyphenylene ether resin, a resin composition comprising the modified polyphenylene ether resin and an article made from the resin composition. Using the modified polyphenylene ether resin described above can achieve a better glass transition temperature, thermal resistance and lower (superior) thermal expansion and dielectric properties.

Abstract: Disclosed is a fluorenylidene-diphenol-containing polyphenylene oxide which is defined by the following structural formula wherein D, X, Y, Z and b are defined in the specification. The fluorenylidene-diphenol-modified polyphenylene oxide resin or its prepolymer may be used for producing resin products with better thermal resistance, dielectric property, flame retardancy and lower thermal expansion. Accordingly, the resin products, such as prepregs, laminates or printed circuit boards, are suitable for use in electronic products with high speed and high frequency signal transmission to further improve the reliability, thermal resistance, and dimensional stability of the electronic products.

Abstract: The present invention relates to resin composite materials, and more particularly, to low-dielectric resin composition and prepreg, resin film, resin coated copper, laminate and printed circuit board formed therefrom. The low-dielectric resin composition includes a phosphorus-containing flame retardant as shown in formula (I) and a resin with an active unsaturated bond. The low-dielectric resin composition may further be manufactured as a prepreg, a resin film, a resin coated copper, a laminate, or a printed circuit board, having a high glass transition temperature, low dielectric property, halogen-free flame retardancy and low percent of thermal expansion of laminate.

Abstract: The present invention relates to a phosphorus-containing polyphenylene oxide resin, its preparation method, a method for preparing the prepolymer of the phosphorus-containing polyphenylene oxide, a resin composition and an article thereof, wherein the phosphorus-containing polyphenylene oxide resin has a chemical structure represented by the following formula (I): wherein R? is R? is R?? is hydrogen, Through the use of the above phosphorus-containing polyphenylene oxide resin, an article made from the resin composition can has good flame retardance, good thermal resistance and a lower percent of thermal expansion while dielectric properties can be maintained, such that the present invention is suitable for use in products such as copper clad laminate and printed circuit board.

Abstract: A low dissipation factor resin composition comprises the following components: (A) an aromatic tetrafunctional vinylbenzyl monomer, its prepolymer or a combination thereof, the aromatic tetrafunctional vinylbenzyl monomer having a structure shown below; (B) flame retardant; and (C) peroxide. The resin composition is applicable to laminates and printed circuit boards featuring low dissipation factor at high frequency and thermal resistance and thermal expansion meeting the demands.

Abstract: Provided is a phosphaphenanthrene-based compound represented by the following chemical structure: The phosphaphenanthrene-based compound can be added in a resin composition and made into a prepreg or resin film. The prepreg or resin film made from such resin composition has low coefficient of thermal expansion, low dielectric constant and dissipation factor, and flame retardancy, thereby being suitable for copper-clad laminate or printed circuit board.

Abstract: Apparatus and methods for creating a pulsed ion beam. The pulsed ion beam can be used for performing mass spectrometry. A pulsed solenoid valve can provide a pulsed ion beam from an electrospray in a pre-vacuum chamber. The pulsed ion beam can enter a high vacuum region and a mass analyzer for mass spectrometry.

Abstract: A low dissipation factor resin composition comprises: (A) 100 to 150 parts by weight of a vinyl-containing compound or a polymer thereof; (B) 0 to 75 parts by weight of styrene-butadiene-divinylbenzene terpolymer, styrene-butadiene-maleic anhydride terpolymer, vinyl functional polybutadiene urethane oligomer or a combination thereof; (C) 30 to 150 parts by weight of flame retardant; and (D) 0.1 to 10 parts by weight of peroxide. The resin composition and a product made thereby are applicable to a copper-clad laminate and a printed circuit board, characterized by having low dissipation factor at high frequency and satisfactory thermal resistance and thermal expansion.

Abstract: The present disclosure is to provide a modified oxazine compound and use of a composition comprising the same.

Abstract: A polyphenylene oxide resin belongs to a polymerized and/or modified thermosetting polyphenylene oxide resin, having a structure represented by formula (I): The polymerized and/or modified thermosetting polyphenylene oxide resin has better flame retardancy, thermal resistance, dielectric constant, dissipation factor, toughness, reactivity, viscosity and solubility. Therefore, the polyphenylene oxide resin is suitable for producing prepregs, resin films, laminates, printed circuit boards and other articles. A method of preparing polyphenylene oxide resins, a prepolymer thereof and a resin composition containing the polyphenylene oxide resin are also provided.

Abstract: A halogen-free resin composition includes (A) 100 parts by weight of polyphenylene oxide resin; (B) 10 to 50 parts by weight of maleimide resin; (C) 5 to 100 parts by weight of polybutadiene copolymer; (D) 5 to 30 parts by weight of cyanate ester resin; and (E) 15 to 150 parts by weight of phosphazene. The halogen-free resin composition is characterized by specific ingredients and proportions thereof to achieve circuit board laminate properties, such as a high glass transition temperature, low coefficient of thermal expansion, low dielectric properties, heat resistance, flame retardation, and being halogen-free, and thus is applicable to the manufacturing of a prepreg or resin film, thereby being applicable to the manufacturing of metal laminates and printed circuit boards.

Abstract: A resin composition, including (A) a polyimide resin; (B) a pre-polymerized maleimide resin; (C) a thermosetting resin; and (D) a flame retardant. The reactants for use in synthesizing the polyimide resin include an acid anhydride and a diamine, with the diamine including 4,4?-diaminodiphenylmethane and its analogous compounds and polyetherdiamines. The resin composition has the following advantages, a resin film or a prepreg is manufactured from the resin composition comprises a polyimide resin synthesized from a diamine of a specific structure and a pre-polymerized maleimide resin, so as to achieve satisfactory characteristics of circuit laminates, such as a low dielectric constant, a low dissipation factor, high heat resistance, and high adhesiveness, so as to be for use in the manufacturing of metal clad laminates and printed circuit boards.

Abstract: The present invention belongs to the technical field of a resin having low dielectric properties, and presents a vinylbenzyl-etherified-DOPO compound resin composition and a preparation method and application thereof. The composition includes a vinylbenzyl-etherified-DOPO compound resin and a vinyl-terminated polyphenylene ether resin. The DOPO resin is vinylbenzyl etherified in the present invention, thus obtaining a vinylbenzyl-etherified-DOPO compound resin having low dielectric properties, and there are no hydroxyl group on itself, no hydroxyl function group will be generated during the cross-linking reaction; and the vinylbenzyl-etherified-DOPO compound resin contains phosphorus atoms, and has flame retardancy.