Abstract: In a method, a resist material is dispensed through a tube of a nozzle of a resist pump system on a wafer. The tube extends from a top to a bottom of the nozzle and has upper, lower, and middle segments. When not dispensing, the resist material is retracted from the lower and the middle segments, and maintained in the upper segment of the tube. When retracting, a first solvent is flown through a tip of the nozzle at the bottom of the nozzle to fill the lower segment of the tube with the first solvent and to produce a gap in the middle segment of the tube between the resist material and the first solvent. The middle segment includes resist material residues on an inner surface wall of the tube and vapor of the first solvent. The vapor of the first solvent prevents the resist material residues from drying.

Abstract: A resin composition includes 100 parts by weight of a fluorine-containing compound and 1 part by weight to 15 parts by weight of a compound of Formula (1); in Formula (1), m and n are individually an integer of 10 to 100; and the fluorine-containing compound includes tetrafluoroethylene homopolymer, perfluoroalkoxy alkane or a combination thereof. Moreover, also provided is an article made from the resin composition, which comprises a prepreg, a resin film, a laminate or a printed circuit board, wherein the article achieves improvement in at least one of the following properties: dielectric constant, dissipation factor, Z-axis coefficient of thermal expansion, MIT bending resistance and tensile strength.

Abstract: An electronic device includes a display and a processor. The processor is electrically coupled to the display. The processor is configured to execute a plurality of program instructions to perform the following steps: defining a window display region and an interface display region on the display when the electronic device is operated in a one-hand operation mode; displaying a desktop display interface corresponding to the one-hand operation mode in the interface display region; and displaying a plugin in the window display region.

Abstract: The disclosure provides a control method, applicable to an electronic device. The control method includes: detecting a sliding operation from a first position to a second position on a touch screen of the electronic device, where the first position is an edge area of the touch screen and the second position is a position in which the sliding operation stops; calculating an angle of the sliding operation based on the first position and the second position; and comparing the angle with a threshold to determine whether to activate a one-handed operation mode of the electronic device.

Abstract: An optoelectronic module, including a substrate, a covering member, a light emitting element, and a light receiving element, is provided. The covering member is disposed on the substrate and includes an upper cover portion, a peripheral sidewall portion connected to the upper cover portion, and an inside partition delimiting a first cavity and a second cavity. The first cavity is separated from the second cavity. The light emitting element is disposed on the substrate as corresponding to the first cavity. The light receiving element is disposed on the substrate as corresponding to the second cavity. The inside partition has a first inner wall surface located in the first cavity and a second inner wall surface located in the second cavity. A first protruded-recessed structure is formed on the first inner wall surface.

Abstract: A method for manufacturing a semiconductor device includes forming a resist underlayer over a substrate. The resist underlayer includes an underlayer composition, including: a polymer with pendant photoacid generator (PAG) groups, pendant thermal acid generator (TAG) groups, a combination of pendant PAG and pendant TAG groups, pendant photobase generator (PBG) groups, pendant thermal base generator (TBG) groups, or a combination of pendant PBG and pendant TBG groups. A photoresist layer including a photoresist composition is formed over the resist underlayer. The photoresist layer is selectively exposed to actinic radiation. The selectively exposed photoresist layer is developed to form a pattern in the photoresist layer.

Abstract: An apparatus and a method for importing fluid, and a method for tearing film are provided. The apparatus imports fluid into a product and tears a breathable film covered on the product, the product defines a vent in a surface, the breathable film covers on the vent. The apparatus includes a transfer assembly and a controller. The breathable film is connected to the transfer assembly. The controller is coupled to the transfer assembly and configured to control the transfer assembly to vertically move relative to the surface of the product to tear the breathable film from the vent.

Abstract: A resin composition includes a vinyl group-containing polyphenylene ether resin, a polyolefin and a magnesium and aluminum combination ionic compound, wherein the magnesium and aluminum combination ionic compound has a thermal resistance of greater than or equal to 600° C. The resin composition may be used to make various articles, such as a prepreg, a resin film, a laminate or a printed circuit board, and at least one of the following improvements can be achieved, including glass transition temperature, copper foil peeling strength, thermal resistance and dissipation factor.

Abstract: An electronic glasses includes a lens frame, a first temple, a second temple, an electronic device and an audio I/O device. The Hall sensor is disposed at one of the lens frame, the first template, and the second temple. The audio I/O device is disposed at another of the lens frame, the first temple and the second temple, and provided with a magnetic element. The Hall sensor provides a first signal for the electronic device when the first temple and/or the second temple are folded to make the Hall sensor and the audio I/O device close to each other, and the Hall sensor provides a second signal for the electronic device when the first temple or the second temple are unfolded to make the Hall sensor and the audio I/O device be away from each other.

Abstract: The present disclosure provides systems and methods for a hydrogen-powered hybrid electric powertrain and the associated hydro-electro-aero-thermal management system (HEATMS).

Abstract: Achieving homogeneous and heterogeneous integration for 2.5D and 3D integrated circuit, chip-to-wafer, chip-to-substrate, or wafer-to-wafer bonding is an essential technology. The landing wafer or substrate is bonded with a carrier by using a temporary bonding material before thinning the landing wafer to the desired thickness. Upon completion of redistribution layer formation, Cu pad formation, or other backside processing, dies or wafers with through-silicon vias are stacked onto the landing substrate before molding and singulation. As the landing wafer usually has interconnection metals in the bond line, and those interconnection metals are typically made from lead-free solder alloys, deformation of those solder alloys during thermocompression bonding becomes an issue for manufacturers. To address this issue, a polymeric material with desired strengths is coated on the device wafer to form a conformal protective layer on top of solder alloys, thus enabling temporary bonding and debonding processes.

Abstract: A resin composition includes 100 parts by weight of a fluorine-containing compound and 1 part by weight to 15 parts by weight of a compound of Formula (1); in Formula (1), m and n are individually an integer of 10 to 100; and the fluorine-containing compound includes tetrafluoroethylene homopolymer, perfluoroalkoxy alkane or a combination thereof. Moreover, also provided is an article made from the resin composition, which comprises a prepreg, a resin film, a laminate or a printed circuit board, wherein the article achieves improvement in at least one of the following properties: dielectric constant, dissipation factor, Z-axis coefficient of thermal expansion, MIT bending resistance and tensile strength.

Abstract: A workpiece orientation mechanism includes: a driving device including a transmission motor and a controller which are connected with each other via signal, the transmission motor defining an axial direction; a rotating seat, combined with the transmission motor, and capable of being driven to rotate by the transmission motor; an orientation head disposed to the rotating seat to rotate synchronously with the rotating seat, wherein the orientation head is capable of moving along the axial direction relative to the rotating seat, one end of the orientation head includes a mounting head, and an inductor is disposed to the orientation head; a reset means, arranged between the rotating seat and the orientation head, and positioning the orientation head at a predetermined position; and a sensor facing the inductor, wherein the sensor is signally connected with the controller.

Abstract: Some embodiments relate to a method for forming a vertical cavity surface emitting laser (VCSEL) structure. The method includes forming an optically active layer over a lower reflective layer and forming an upper reflector over the optically active layer. A first spacer is formed along sidewalls of the upper reflector. An oxidation process is performed with the first spacer in place to oxidize a peripheral region of the optically active layer. A first etch process is performed on the lower reflective layer and the oxidized peripheral region, thereby forming a lower reflector and an optically active region.

Abstract: A method includes forming a conductive pad over an interconnect structure of a wafer, forming a capping layer over the conductive pad, forming a dielectric layer covering the capping layer, and etching the dielectric layer to form an opening in the dielectric layer. The capping layer is exposed to the opening. A wet-cleaning process is then performed on the wafer. During the wet-cleaning process, a top surface of the capping layer is exposed to a chemical solution used for performing the wet-cleaning process. The method further includes depositing a conductive diffusion barrier extending into the opening, and depositing a conductive material over the conductive diffusion barrier.

Abstract: A semiconductor apparatus and methods of processing a semiconductor workpiece are provided. The semiconductor apparatus for pre-wetting a semiconductor workpiece includes a process chamber, a workpiece holder disposed within the process chamber to hold the semiconductor workpiece, a pre-wetting fluid tank disposed outside the process chamber and containing a pre-wetting fluid, and a conduit coupled to the pre-wetting fluid tank and extending into the process chamber. The conduit delivers the pre-wetting fluid from the pre-wetting fluid tank out through an outlet of the conduit to wet a major surface of the semiconductor workpiece comprising a plurality of recess portions.

Abstract: An approach is provided for improving a named entity recognition. Using a multi-label classification in a neural network, a sub-entity is identified in an original sentence. First and second labels are determined indicating first and second candidate types of the sub-entity. First and second replacement sentences are generated. The first replacement sentence replaces the sub-entity in the original sentence with a first sub-entity of the first candidate type. The second replacement sentence replaces the sub-entity in the original sentence with a second sub-entity of the second candidate type. First and second confidence scores for the first and second replacement sentences are determined. Based on the first confidence score exceeding the second confidence score by more than a threshold amount, the neural network is retrained by selecting the first instead of the second candidate type as the sub-entity type.

Abstract: A processing method for automatically generating machining features is provided. A workpiece CAD file is obtained to perform a CAD numerical analysis on a blank body. With the workpiece CAD file being used as a target, a workpiece CAD appearance is compared with the blank body to obtain a feature identification result of a first to-be-processed blank body, which includes identifying data of a to-be-removed blank body and a feature of a first processing surface. A geometric analysis is performed on the first processing surface feature and a tool selection range is determined. A virtual cutting simulation is performed on the first processing surface to generate a processed area data and an unprocessed area data. A spatial coordinate mapping comparison between the unprocessed area data and a surface data of the workpiece CAD file is performed to obtain a feature identification result of a second to-be-processed blank body.