Abstract: Achieving homogeneous and heterogeneous integration for 2.5D and 3D integrated circuit, chip-to-wafer, chip-to-substrate, or wafer-to-wafer bonding is an essential technology. The landing wafer or substrate is bonded with a carrier by using a temporary bonding material before thinning the landing wafer to the desired thickness. Upon completion of redistribution layer formation, Cu pad formation, or other backside processing, dies or wafers with through-silicon vias are stacked onto the landing substrate before molding and singulation. As the landing wafer usually has interconnection metals in the bond line, and those interconnection metals are typically made from lead-free solder alloys, deformation of those solder alloys during thermocompression bonding becomes an issue for manufacturers. To address this issue, a polymeric material with desired strengths is coated on the device wafer to form a conformal protective layer on top of solder alloys, thus enabling temporary bonding and debonding processes.

Abstract: A resin composition includes 100 parts by weight of a fluorine-containing compound and 1 part by weight to 15 parts by weight of a compound of Formula (1); in Formula (1), m and n are individually an integer of 10 to 100; and the fluorine-containing compound includes tetrafluoroethylene homopolymer, perfluoroalkoxy alkane or a combination thereof. Moreover, also provided is an article made from the resin composition, which comprises a prepreg, a resin film, a laminate or a printed circuit board, wherein the article achieves improvement in at least one of the following properties: dielectric constant, dissipation factor, Z-axis coefficient of thermal expansion, MIT bending resistance and tensile strength.

Abstract: A workpiece orientation mechanism includes: a driving device including a transmission motor and a controller which are connected with each other via signal, the transmission motor defining an axial direction; a rotating seat, combined with the transmission motor, and capable of being driven to rotate by the transmission motor; an orientation head disposed to the rotating seat to rotate synchronously with the rotating seat, wherein the orientation head is capable of moving along the axial direction relative to the rotating seat, one end of the orientation head includes a mounting head, and an inductor is disposed to the orientation head; a reset means, arranged between the rotating seat and the orientation head, and positioning the orientation head at a predetermined position; and a sensor facing the inductor, wherein the sensor is signally connected with the controller.

Abstract: Some embodiments relate to a method for forming a vertical cavity surface emitting laser (VCSEL) structure. The method includes forming an optically active layer over a lower reflective layer and forming an upper reflector over the optically active layer. A first spacer is formed along sidewalls of the upper reflector. An oxidation process is performed with the first spacer in place to oxidize a peripheral region of the optically active layer. A first etch process is performed on the lower reflective layer and the oxidized peripheral region, thereby forming a lower reflector and an optically active region.

Abstract: A method includes forming a conductive pad over an interconnect structure of a wafer, forming a capping layer over the conductive pad, forming a dielectric layer covering the capping layer, and etching the dielectric layer to form an opening in the dielectric layer. The capping layer is exposed to the opening. A wet-cleaning process is then performed on the wafer. During the wet-cleaning process, a top surface of the capping layer is exposed to a chemical solution used for performing the wet-cleaning process. The method further includes depositing a conductive diffusion barrier extending into the opening, and depositing a conductive material over the conductive diffusion barrier.

Abstract: A semiconductor apparatus and methods of processing a semiconductor workpiece are provided. The semiconductor apparatus for pre-wetting a semiconductor workpiece includes a process chamber, a workpiece holder disposed within the process chamber to hold the semiconductor workpiece, a pre-wetting fluid tank disposed outside the process chamber and containing a pre-wetting fluid, and a conduit coupled to the pre-wetting fluid tank and extending into the process chamber. The conduit delivers the pre-wetting fluid from the pre-wetting fluid tank out through an outlet of the conduit to wet a major surface of the semiconductor workpiece comprising a plurality of recess portions.

Abstract: An approach is provided for improving a named entity recognition. Using a multi-label classification in a neural network, a sub-entity is identified in an original sentence. First and second labels are determined indicating first and second candidate types of the sub-entity. First and second replacement sentences are generated. The first replacement sentence replaces the sub-entity in the original sentence with a first sub-entity of the first candidate type. The second replacement sentence replaces the sub-entity in the original sentence with a second sub-entity of the second candidate type. First and second confidence scores for the first and second replacement sentences are determined. Based on the first confidence score exceeding the second confidence score by more than a threshold amount, the neural network is retrained by selecting the first instead of the second candidate type as the sub-entity type.

Abstract: A processing method for automatically generating machining features is provided. A workpiece CAD file is obtained to perform a CAD numerical analysis on a blank body. With the workpiece CAD file being used as a target, a workpiece CAD appearance is compared with the blank body to obtain a feature identification result of a first to-be-processed blank body, which includes identifying data of a to-be-removed blank body and a feature of a first processing surface. A geometric analysis is performed on the first processing surface feature and a tool selection range is determined. A virtual cutting simulation is performed on the first processing surface to generate a processed area data and an unprocessed area data. A spatial coordinate mapping comparison between the unprocessed area data and a surface data of the workpiece CAD file is performed to obtain a feature identification result of a second to-be-processed blank body.

Abstract: A memory device and a manufacturing method thereof are provided. The memory device includes a magnetic tunneling junction (MTJ) and a spin Hall electrode (SHE). The MTJ includes a free layer, a reference layer and a barrier layer lying between the free layer and the reference layer. The SHE is in contact with the MTJ, and configured to convert a charge current to a spin current for programming the MTJ. The SHE is formed of an alloy comprising at least one heavy metal element and at least one light transition metal element. The heavy metal element is selected from metal elements with one or more valence electrons filling in 5d orbitals, and the light transition metal element is selected from transition metal elements with one or more valence electrons partially filling in 3d orbitals.

Abstract: The present disclosure provides a method for lithography patterning in accordance with some embodiments. The method includes forming a photoresist layer over a substrate. The photoresist layer includes at least an acid labile group (ALG) and a thermo-base generator (TBG). The method further includes exposing a portion of the photoresist layer to a radiation and performing a baking process after the exposing of the portion of the photoresist layer. The TBG releases a base during the performing of the baking process, resulting in a chemical reaction between the ALG and the base. The method further includes removing an unexposed portion of the photoresist layer, resulting in a patterned photoresist layer.

Abstract: The present disclosure provides a liquid loading device for loading liquid into a product. The product includes a cavity and a liquid inlet communicated with the cavity. The liquid loading device includes a loading module to load liquid into the cavity through the liquid inlet. A sensor senses a pressure in the cavity and generates at least one pressure value. A controller is coupled to the sensor and the loading module, and controls the loading module to operate based on related data. In addition, the present disclosure also provides a liquid loading method.

Abstract: The present disclosure provides systems and methods for a hydrogen-powered hybrid electric powertrain and the associated hydro-electro-aero-thermal management system (HEATMS).

Abstract: A metal member includes a base and a mesh structure arranged on the base. The mesh structure includes a plurality of three-dimensional unit cell structures coupled together in an orderly manner. Each unit cell structure includes at least one first node. The plurality of unit cell structures is coupled together by the at least one first node.

Abstract: A plating apparatus includes a workpiece holder, a plating bath, and a clamp ring. The plating bath is underneath the workpiece holder. The clamp ring is connected to the workpiece holder. The clamp ring includes channels communicating an inner surface of the clamp ring and an outer surface of the clamp ring.

Abstract: A battery charging and swapping system includes a plurality of charging seats, a first charging station, a first charging rail and a first conveying unit. The charging seats are operable to enter a first conveying space defined by the first charging station so as to be stored. The first charging rail is disposed at the first charging station, and supplies electrical energy to the charging seats. Via the first conveying unit, when one of the charging seats entering the first conveying space is carried and moved by the first conveying unit, at least one of the rest of the charging seats in the first conveying space is pushed by the one of the charging seats to move along the first conveying space.

Abstract: Techniques are disclosed for systems and methods associated with locking a micromobility transit vehicle to a stationary object. A multimodal transportation system may include a docking station including a securement point, and a micromobility transit vehicle securable to the securement point of the docking station. The micromobility transit vehicle may include a storage basket and a lock cable including a first end coupled to the storage basket and a second end. The second end of the lock cable may be securable to the securement point of the docking station to lock the micromobility transit vehicle to the docking station. The storage basket may include a pin lock. The pin lock may engage a locking pin of the lock cable to lock the micromobility transit vehicle via the lock cable.

Abstract: An optical element drive mechanism is provided. The optical element drive mechanism includes an immovable part, a movable part, a drive assembly, and a strengthening assembly. The movable part is connected to an optical element. The movable part is movable relative to the immovable part. The drive assembly drives the movable part to move relative to the immovable part. The strengthening assembly strengthens the driving force of the drive assembly. The strengthening assembly is close to the drive assembly.

Abstract: A memory device includes a substrate, a stack structure, a first staircase structure, and a first part of a second staircase structure. The substrate includes a plurality of blocks each having a staircase region, a memory array region, and a word line cutting region. The stack structure is located on the substrate in the memory array region, and includes first insulating layers and conductive layers alternately stacked on each other. The first staircase structure is located on the substrate in the staircase region, and includes first insulating layers and conductive layers alternately stacked on each other. The first part of the second staircase structure is located on the substrate in the word line cutting region, and includes first insulating layers and conductive layers alternately stacked on each other, and two first parts of two second staircase structures in two adjacent blocks are separated from each other.