Patents by Inventor Chen-Yu Wang
Chen-Yu Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11982866Abstract: An optical element driving mechanism is provided and includes a fixed assembly, a movable assembly, a driving assembly and a stopping assembly. The fixed assembly has a main axis. The movable assembly is configured to connect an optical element, and the movable assembly is movable relative to the fixed assembly. The driving assembly is configured to drive the movable assembly to move relative to the fixed assembly. The stopping assembly is configured to limit the movement of the movable assembly relative to the fixed assembly within a range of motion.Type: GrantFiled: December 15, 2022Date of Patent: May 14, 2024Assignee: TDK TAIWAN CORP.Inventors: Chao-Chang Hu, Liang-Ting Ho, Chen-Er Hsu, Yi-Liang Chan, Fu-Lai Tseng, Fu-Yuan Wu, Chen-Chi Kuo, Ying-Jen Wang, Wei-Han Hsia, Yi-Hsin Tseng, Wen-Chang Lin, Chun-Chia Liao, Shou-Jen Liu, Chao-Chun Chang, Yi-Chieh Lin, Shang-Yu Hsu, Yu-Huai Liao, Shih-Wei Hung, Sin-Hong Lin, Kun-Shih Lin, Yu-Cheng Lin, Wen-Yen Huang, Wei-Jhe Shen, Chih-Shiang Wu, Sin-Jhong Song, Che-Hsiang Chiu, Sheng-Chang Lin
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Patent number: 11955405Abstract: A semiconductor package includes a package substrate; semiconductor devices disposed on the package substrate; a package ring disposed on a perimeter of the package substrate surrounding the semiconductor devices; a cover including silicon bonded to the package ring and covering the semiconductor devices; and a thermal interface structure (TIS) thermally connecting the semiconductor devices to the cover.Type: GrantFiled: January 17, 2022Date of Patent: April 9, 2024Assignee: Taiwan Semiconductor Manufacturing Company LimitedInventors: Jen Yu Wang, Chung-Jung Wu, Sheng-Tsung Hsiao, Tung-Liang Shao, Chih-Hang Tung, Chen-Hua Yu
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Publication number: 20240111337Abstract: An electronic device including a body and a receptacle connector is provided. The body has a side wall surface, a receptacle slot located at the side wall surface, a waterproof protrusion protruding from the side wall surface, and two gutters located at the side wall surface, where the waterproof protrusion is located above the receptacle slot, and the two gutters are respectively located at two opposite sides of the receptacle slot. The receptacle connector is disposed in the receptacle slot.Type: ApplicationFiled: May 8, 2023Publication date: April 4, 2024Applicant: Acer IncorporatedInventors: Wei-Chih Wang, Chen-Min Hsiu, Chien-Yu Lee, Szu-Wei Yang, Fang-Ying Huang
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Patent number: 11943877Abstract: A circuit board structure includes a circuit substrate having opposing first and second sides, a redistribution structure disposed at the first side, and a dielectric structure disposed at the second side. The circuit substrate includes a first circuit layer disposed at the first side and a second circuit layer disposed at the second side. The redistribution structure is electrically coupled to the circuit substrate and includes a first leveling dielectric layer covering the first circuit layer, a first thin-film dielectric layer disposed on the first leveling dielectric layer and having a material different from the first leveling dielectric layer, and a first redistributive layer disposed on the first thin-film dielectric layer and penetrating through the first thin-film dielectric layer and the first leveling dielectric layer to be in contact with the first circuit layer. The dielectric structure includes a second leveling dielectric layer disposed below the second circuit layer.Type: GrantFiled: March 2, 2022Date of Patent: March 26, 2024Assignee: Unimicron Technology Corp.Inventors: Wen-Yu Lin, Kai-Ming Yang, Chen-Hao Lin, Pu-Ju Lin, Cheng-Ta Ko, Chin-Sheng Wang, Guang-Hwa Ma, Tzyy-Jang Tseng
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Publication number: 20240097035Abstract: Epitaxial source/drain structures for enhancing performance of multigate devices, such as fin-like field-effect transistors (FETs) or gate-all-around (GAA) FETs, and methods of fabricating the epitaxial source/drain structures, are disclosed herein. An exemplary device includes a dielectric substrate. The device further includes a channel layer, a gate disposed over the channel layer, and an epitaxial source/drain structure disposed adjacent to the channel layer. The channel layer, the gate, and the epitaxial source/drain structure are disposed over the dielectric substrate. The epitaxial source/drain structure includes an inner portion having a first dopant concentration and an outer portion having a second dopant concentration that is less than the first dopant concentration. The inner portion physically contacts the dielectric substrate, and the outer portion is disposed between the inner portion and the channel layer. In some embodiments, the outer portion physically contacts the dielectric substrate.Type: ApplicationFiled: November 29, 2023Publication date: March 21, 2024Inventors: Chen-Ming Lee, I-Wen Wu, Po-Yu Huang, Fu-Kai Yang, Mei-Yun Wang
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Publication number: 20240099154Abstract: A magnetoresistive random access memory (MRAM) device includes a first array region and a second array region on a substrate, a first magnetic tunneling junction (MTJ) on the first array region, a first top electrode on the first MTJ, a second MTJ on the second array region, and a second top electrode on the second MTJ. Preferably, the first top electrode and the second top electrode include different nitrogen to titanium (N/Ti) ratios.Type: ApplicationFiled: November 21, 2023Publication date: March 21, 2024Applicant: UNITED MICROELECTRONICS CORPInventors: Hui-Lin Wang, Si-Han Tsai, Dong-Ming Wu, Chen-Yi Weng, Ching-Hua Hsu, Ju-Chun Fan, Yi-Yu Lin, Che-Wei Chang, Po-Kai Hsu, Jing-Yin Jhang
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Patent number: 11934027Abstract: An optical system affixed to an electronic apparatus is provided, including a first optical module, a second optical module, and a third optical module. The first optical module is configured to adjust the moving direction of a first light from a first moving direction to a second moving direction, wherein the first moving direction is not parallel to the second moving direction. The second optical module is configured to receive the first light moving in the second moving direction. The first light reaches the third optical module via the first optical module and the second optical module in sequence. The third optical module includes a first photoelectric converter configured to transform the first light into a first image signal.Type: GrantFiled: June 21, 2022Date of Patent: March 19, 2024Assignee: TDK TAIWAN CORP.Inventors: Chao-Chang Hu, Chih-Wei Weng, Chia-Che Wu, Chien-Yu Kao, Hsiao-Hsin Hu, He-Ling Chang, Chao-Hsi Wang, Chen-Hsien Fan, Che-Wei Chang, Mao-Gen Jian, Sung-Mao Tsai, Wei-Jhe Shen, Yung-Ping Yang, Sin-Hong Lin, Tzu-Yu Chang, Sin-Jhong Song, Shang-Yu Hsu, Meng-Ting Lin, Shih-Wei Hung, Yu-Huai Liao, Mao-Kuo Hsu, Hsueh-Ju Lu, Ching-Chieh Huang, Chih-Wen Chiang, Yu-Chiao Lo, Ying-Jen Wang, Shu-Shan Chen, Che-Hsiang Chiu
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Publication number: 20240074127Abstract: In a method of manufacturing an electronic package, first grooves are formed on a circuit structure and a second groove is formed in each of the first grooves to allow the circuit structure to become circuit layers. Owing to the second groove is narrower than the first groove, each of the circuit layers has an encircled surface and a notch located on the encircled surface. When a shielding layer is provided to cover an encapsulating body located on the circuit layer, a space of the notch is not covered by the shielding layer such that a portion to be removed of the shielding layer will not remain on the electronic package to become burr after removing the portion to be removed.Type: ApplicationFiled: July 13, 2023Publication date: February 29, 2024Inventors: Chen-Yu Wang, Pai-Sheng Cheng, Huan-Kuen Chen
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Patent number: 11917923Abstract: A magnetoresistive random access memory (MRAM) structure, including a substrate and multiple MRAM cells on the substrate, wherein the MRAM cells are arranged in a memory region adjacent to a logic region. An ultra low-k (ULK) layer covers the MRAM cells, wherein the surface portion of ultra low-k layer is doped with fluorine, and dents are formed on the surface of ultra low-k layer at the boundaries between the memory region and the logic region.Type: GrantFiled: April 28, 2021Date of Patent: February 27, 2024Assignee: UNITED MICROELECTRONICS CORP.Inventors: Hui-Lin Wang, Ching-Hua Hsu, Si-Han Tsai, Shun-Yu Huang, Chen-Yi Weng, Ju-Chun Fan, Che-Wei Chang, Yi-Yu Lin, Po-Kai Hsu, Jing-Yin Jhang, Ya-Jyuan Hung
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Publication number: 20230420287Abstract: A clamp assembly includes at least one clamp which is provided to clamp a workpiece in electroless plating, etching, electroplating or cleaning process. The clamp includes a base, a clamping element and a limiting element. The base is mounted on a carrier and includes a guide hole and a first limiting hole which are communicated with each other. The clamping element includes a guide rod and a second limiting hole, the guide rod is inserted into the guide hole to allow the second limiting hole located on the guide hole to be communicated with the first limiting hole. The limiting element is inserted into the first and second limiting holes to integrate the base with the clamping element for clamping the workpiece.Type: ApplicationFiled: April 21, 2023Publication date: December 28, 2023Inventors: Ching-Wen Chen, Chen-Lung Teng, Kung-An Lin, Chen-Yu Wang
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Publication number: 20230378044Abstract: A flip-chip bonding structure includes a substrate and a chip. A lead of the substrate includes a body, a hollow opening, a bonding island and at least one connecting bridge. The hollow opening is in the body and surrounded by the body. The bonding island is located in the hollow opening such that there is a hollow space in the hollow opening and located between the body and the bonding island. The connecting bridge is located in the hollow space to connect the body and the bonding island. A bump of the chip is bonded to the bonding island by a solder. The solder is restricted on the bonding island and separated from the body by the hollow space so as to avoid the solder from overflowing to the body and avoid the chip from shifting.Type: ApplicationFiled: February 14, 2023Publication date: November 23, 2023Inventors: Chin-Tang Hsieh, Lung-Hua Ho, Chih-Ming Kuo, Chun-Ting Kuo, Yu-Hui Hu, Chih-Hao Chiang, Chen-Yu Wang, Kung-An Lin, Pai-Sheng Cheng
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Publication number: 20230275073Abstract: A package structure is provided herein, which includes a substrate, an integrated transistor, and an encapsulation structure. The integrated transistor is disposed on the substrate and includes a transistor, a capacitor, a resistor, a first Zener diode, and a second Zener diode. The transistor includes a gate, a drain, and a source. The capacitor is electrically connected to the gate, and the resistor is electrically connected to the gate. The first Zener diode includes a first anode and a first cathode electrically connected to the gate. The second Zener diode includes a second anode electrically connected to the first anode and a second cathode electrically connected to the source. The encapsulation structure encapsulates the integrated transistor. The package structure includes a gate terminal, a drain terminal, and a source terminal.Type: ApplicationFiled: February 24, 2023Publication date: August 31, 2023Inventors: Jia-Tay KUO, Chiao FU, Sheng-Bo WANG, Chen-Yu WANG, Yao-Zhong LIU
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Publication number: 20230187378Abstract: In a method of manufacturing a semiconductor package, at least one conductive wire is formed on a substrate in a wire bonding process, a ball end of the conductive wire is located above the substrate, a molding material is provided to cover the conductive wire except the ball end, and an EMI shielding layer is formed on the molding material to connect to the ball end. Owing to the ball end is exposed on the molding material, connection area of the EMI shielding layer to the conductive wire is increased to improve connection strength and reliability between the EMI shielding layer and the conductive wire.Type: ApplicationFiled: November 17, 2022Publication date: June 15, 2023Inventors: Shrane-Ning Jenq, Chen-Yu Wang, Chin-Tang Hsieh, Shu-Yeh Chang, Lung-Hua Ho
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Publication number: 20230135424Abstract: A package including a first carrier, a seed layer, wires, a die and a molding material is provided. The first carrier is removed to expose the seed layer after disposing a second carrier on the molding material, then the seed layer is removed to expose the wires, and a gold layer is deposited on each of the wires by immersion gold plating, finally a semiconductor device is obtained. The gold layer is provided to protect the wires from oxidation and improve solder joint reliability.Type: ApplicationFiled: August 26, 2022Publication date: May 4, 2023Inventors: Shrane-Ning Jenq, Wen-Cheng Hsu, Chen-Yu Wang, Chih-Ming Kuo, Chwan-Tyaw Chen, Lung-Hua Ho
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Publication number: 20220332937Abstract: A styrene-isoprene/butadiene diblock copolymer contains a polystyrene block and a polyisoprene/butadiene block. Based on 100 wt % of the styrene-isoprene/butadiene diblock copolymer, the polystyrene block is 20-45 wt %, and the polyisoprene/butadiene block is 55-80 wt %. The polyisoprene/butadiene block has a polyisoprene unit and a polybutadiene unit. The weight ratio of the polyisoprene unit to the polybutadiene unit is 8:2 to 2:8.Type: ApplicationFiled: April 5, 2022Publication date: October 20, 2022Inventors: Yi-Cheng WAN, Chen-Yu WANG
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Patent number: 11476772Abstract: A voltage converter circuit, comprising: a bridge rectifier; a first transistor, having a first end, a second end and a third end; a second transistor, having a first end and a second end; wherein the first end of the first transistor and the first end of second transistor are electrically connected to bridge rectifier, and the second end of the first transistor is electrically connected to the first end of the second transistor; and a Zener diode, connected between the third end of the first transistor and the second end of the second transistor.Type: GrantFiled: July 31, 2020Date of Patent: October 18, 2022Assignee: EPISTAR CORPORATIONInventors: Sheng-Bo Wang, Chiao Fu, Chang-Hsieh Wu, Jai-Tai Kuo, Chao-Kai Chang, Yao-Zhong Liu, Yi-Ru Shen, Chen-Yu Wang
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Publication number: 20210126548Abstract: A voltage converter circuit, comprising: a bridge rectifier; a first transistor, having a first end, a second end and a third end; a second transistor, having a first end and a second end; wherein the first end of the first transistor and the first end of second transistor are electrically connected to bridge rectifier, and the second end of the first transistor is electrically connected to the first end of the second transistor; and a Zener diode, connected between the third end of the first transistor and the second end of the second transistor.Type: ApplicationFiled: July 31, 2020Publication date: April 29, 2021Inventors: Sheng-Bo Wang, Chiao Fu, Chang-Hsieh Wu, Jai-Tai Kuo, Chao-Kai Chang, Yao-Zhong Liu, Yi-Ru Shen, Chen-Yu Wang
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Patent number: 10826067Abstract: An energy storage device has an anode, a cathode and an electrolyte membrane, installed in between the anode and the cathode, wherein at least one of the anode, the cathode and the electrolyte membrane is incorporated with a copolymer and the copolymer is grafted to a functional group with ionic conductive function. Therefore, the energy storage device, which utilizes copolymers and electrolyte membranes, has better efficiency of charge/discharge performance; thus the efficiency thereof increases; the lifetime thereof is prolonged effectively.Type: GrantFiled: May 30, 2018Date of Patent: November 3, 2020Assignee: POLYBATT MATERIALS CO., LTD.Inventors: Ping-Lin Kuo, Chih-Hao Tsao, Kuan-Ting Lee, Chien-Ju Wu, Chen-Yu Wang, Chang-Yu Hsu
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Patent number: 10791601Abstract: A light-emitting device has a stabilizing-current circuit, a current source having a high electron mobility transistor, and a light source electrically connected to the stabilizing-current circuit and the current source.Type: GrantFiled: March 14, 2019Date of Patent: September 29, 2020Assignee: EPISTAR CORPORATIONInventors: Chao-Kai Chang, Chen-Yu Wang, Chang-Hseih Wu, Jai-Tai Kuo
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Publication number: 20190289685Abstract: A light-emitting device has a stabilizing-current circuit, a current source having a high electron mobility transistor, and a light source electrically connected to the stabilizing-current circuit and the current source.Type: ApplicationFiled: March 14, 2019Publication date: September 19, 2019Inventors: Chao-Kai CHANG, Chen-Yu WANG, Chang-Hseih WU, Jai-Tai KUO