Patents by Inventor Chen

Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12061423
    Abstract: Microwave heating of debris collecting vanes within the source vessel of a lithography apparatus is used to accomplish uniform temperature distribution in order to reduce fall-on contamination and formation of clogs on the inner and outer surfaces of the vanes.
    Type: Grant
    Filed: September 28, 2021
    Date of Patent: August 13, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Cheng Hung Tsai, Sheng-Kang Yu, Shang-Chieh Chien, Heng-Hsin Liu, Li-Jui Chen
  • Patent number: 12063539
    Abstract: Apparatuses, systems, and methods may use an smtc information element or an smtc2-LP information element to calculate timing of a first measurement period to evaluate a serving cell while the UE is in idle mode or inactive mode. Additionally, apparatuses, systems, and methods may use the smtc information element or the smtc2-LP information element to calculate timing of a second measurement period to evaluate intra-frequency cells while the UE is in idle mode or inactive mode.
    Type: Grant
    Filed: April 14, 2021
    Date of Patent: August 13, 2024
    Assignee: APPLE INC.
    Inventors: Jie Cui, Yushu Zhang, Dawei Zhang, Haitong Sun, Hong He, Manasa Raghavan, Yang Tang, Yuqin Chen
  • Patent number: 12062327
    Abstract: An array substrate and a driving method therefor, and a display apparatus are disclosed. The array substrate includes: a base substrate; and a plurality of pixels located on the base substrate, where the plurality of pixels are arranged in an array in a first direction and a second direction. At least one pixel of the plurality of pixels includes: sub-pixels, and a pixel driving chip for driving each sub-pixel in the pixel. The array substrate further includes: a plurality of addressing signal lines located on the base substrate, where the addressing signal lines are coupled to addressing signal ends of pixel driving chips of a row of the pixels arranged in the first direction; and a plurality of data lines located on the base substrate, where the data lines are coupled to data signal ends of pixel driving chips of a column of the pixels arranged in the second direction.
    Type: Grant
    Filed: January 8, 2021
    Date of Patent: August 13, 2024
    Assignees: BOE MLED TECHNOLOGY CO., LTD., BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Xiuling Li, Qibing Gu, Guofeng Hu, Hongge Mei, Nana Gao, Bao Fu, Xiangyi Chen, Lingyun Shi, Wenchieh Huang
  • Patent number: 12061563
    Abstract: An event recorder for a power supply and a method thereof are provided. The event recorder method includes: selecting an event combination; based on the selected event combination, performing a setting step to set a trigger source combination and a record data combination, wherein the setting step further comprises any combination of the following: setting a record data type combination, setting a trigger type combination, setting a resolution combination, and setting a logic combination; and in response to a logic combination result of the trigger source combination, storing the record data combination in a storage unit.
    Type: Grant
    Filed: January 18, 2022
    Date of Patent: August 13, 2024
    Assignee: LITE-ON TECHNOLOGY CORPORATION
    Inventors: Kuang-Hung Chen, Shun-Hung Lo, Nien-Yi Chung, Yu-Shun Liu
  • Patent number: 12063784
    Abstract: In certain aspects, a memory device includes an array of memory cells, a plurality of word lines coupled to the array of memory cells, and a plurality of peripheral circuits coupled to the array of memory cells and configured to control the array of memory cells. A first peripheral circuit of the plurality of peripheral circuits includes a first three-dimensional (3D) transistor coupled to the array of memory cells through at least one of the plurality of word lines. The first 3D transistor includes a 3D semiconductor body, and a gate structure in contact with a plurality of sides of the 3D semiconductor body. The gate structure includes a gate dielectric and a gate electrode.
    Type: Grant
    Filed: September 22, 2021
    Date of Patent: August 13, 2024
    Assignee: YANGTZE MEMORY TECHNOLOGIES CO., LTD.
    Inventors: Liang Chen, Chao Sun, Wei Liu, Wenshan Xu, Wu Tian, Ning Jiang, Lei Xue
  • Patent number: 12061870
    Abstract: This disclosure enables various technologies that can (1) learn new synonyms for a given concept without manual curation techniques, (2) relate (e.g., map) some, many, most, or all raw named entity recognition outputs (e.g., “United States”, “United States of America”) to ontological concepts (e.g., ISO-3166 country code: “USA”), (3) account for false positives from a prior named entity recognition process, or (4) aggregate some, many, most, or all named entity recognition results from machine learning or rules based approaches to provide a best of breed hybrid approach (e.g., synergistic effect).
    Type: Grant
    Filed: October 29, 2020
    Date of Patent: August 13, 2024
    Assignee: Tellic LLC
    Inventors: Richard Edward Wendell, Eric Tanalski, Christopher Russel Sipola, Michael Stanley, Henry Edward Crosby, Loren Lee Chen, Paul Ton
  • Patent number: 12063866
    Abstract: A multilayer magnetic tunnel junction etching method and an MRAM device. A wafer is processed according to particular steps without interrupting vacuum. A reactive ion plasma etching chamber (10) and an ion beam etching chamber (11) are used separately at least one time. The processing of a multilayer magnetic tunnel junction is always in a vacuum environment, thereby avoiding the impact of an external environment on etching. By means of the process of combining etching and cleaning, a device structure maintains good steepness, and the metal contamination and damage of a magnetic tunnel junction film structure are significantly decreased, thereby greatly increasing the performance and reliability of a device. In addition, use of both the ion beam etching chamber (11) and the reactive ion plasma etching chamber (10) solves the technical problem of an existing single etching method, and increases production efficiency and etching process precision.
    Type: Grant
    Filed: May 23, 2019
    Date of Patent: August 13, 2024
    Assignee: JIANGSU LEUVEN INSTRUMENTS CO. LTD
    Inventors: Juebin Wang, Zhongyuan Jiang, Ziming Liu, Dongchen Che, Hushan Cui, Dongdong Hu, Lu Chen, Dajian Han, Zhiwen Zou, Kaidong Xu
  • Patent number: 12062561
    Abstract: A method includes moving a wafer transport device to a position above a load port; lowering a hoist unit of the wafer transport device above the load port, wherein the wafer transport device has a plurality of belts, each of the belts is connected to the hoist unit and wound around a respective belt winding drum; detecting sound waves from the belts by using at least one acoustic sensor to measure tensions of the belts; and comparing the tensions from the belts to determine an inclination of the hoist unit.
    Type: Grant
    Filed: May 19, 2022
    Date of Patent: August 13, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Wei-Chih Chen, Shi-Chi Chen, Ting-Wei Wang, Jen-Ti Wang, Kuo-Fong Chuang
  • Patent number: 12058947
    Abstract: An apparatus for localizing an agricultural machine in an agricultural useful area. The apparatus includes an input interface configured to receive, as input, a route predefined in the useful area and image data related to a monitoring region of the useful area detected by a sensor and located in a vicinity of the agricultural machine. The apparatus also includes an evaluation unit configured to detect a position of the monitoring region with respect to the predefined route and an output interface configured to output the detected position.
    Type: Grant
    Filed: November 12, 2019
    Date of Patent: August 13, 2024
    Assignee: ZF FRIEDRICHSHAFEN AG
    Inventors: Zhihu Chen, Benjamin Rippel
  • Patent number: 12062608
    Abstract: A semiconductor package includes a first die, a second die, an encapsulant, a first inductor and a second inductor. The second die is stacked on the first die along a first direction. The encapsulant encapsulates the second die over the first die. The first inductor is disposed in the encapsulant and has a first spiral structure, wherein the first spiral structure has a plurality of first coils around a first axis, and the first axis is substantially perpendicular to the first direction. The second inductor is disposed in the encapsulant and having a second spiral structure, wherein the first inductor and the second inductor are disposed at opposite sides of the second die.
    Type: Grant
    Filed: July 4, 2022
    Date of Patent: August 13, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Jie Chen, Hsien-Wei Chen, Ming-Fa Chen
  • Patent number: 12063807
    Abstract: The present disclosure provides a display panel and a display device. The display panel includes: a cover plate; a substrate, spaced apart from the cover plate, wherein an edge of the substrate is connected to an edge of the cover plate through an adhesive member, and the substrate comprises a first region enclosed and defined by the adhesive member; and a protective layer, disposed at a side of the substrate away from the cover plate. An impact abruption structure is configured on the protective layer or configured between the protective layer and the adhesive member, and an impact is applied towards the substrate. In this way, a possibility of the adhesive member being damaged while the display panel receiving the impact may be reduced.
    Type: Grant
    Filed: June 2, 2021
    Date of Patent: August 13, 2024
    Assignee: Kunshan Go-Visionox Opto-Electronics Co., Ltd.
    Inventor: Xiaohe Chen
  • Patent number: 12063791
    Abstract: A layout pattern of a magnetoresistive random access memory (MRAM) includes a substrate having a first cell region and a second cell region and a diffusion region on the substrate extending through the first cell region and the second cell region. Preferably, the diffusion region includes a first H-shape and a second H-shape according to a top view.
    Type: Grant
    Filed: September 26, 2022
    Date of Patent: August 13, 2024
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Chun-Yen Tseng, Shu-Ru Wang, Yu-Tse Kuo, Chang-Hung Chen, Yi-Ting Wu, Shu-Wei Yeh, Ya-Lan Chiou, Chun-Hsien Huang
  • Patent number: 12059495
    Abstract: The present invention provides a use of platelet dry powder (PDP) for relieving inflammation or injury in an airway portion, wherein per gram of platelet dry powder (PDP) comprises at least 100,000 platelets.
    Type: Grant
    Filed: June 16, 2022
    Date of Patent: August 13, 2024
    Assignees: SPIRIT SCIENTIFIC CO. LTD.
    Inventors: Chin-Ho Chen, Yi-Shin Tsai, Tzu-Min Yang, Dao Lung Steven Lin
  • Patent number: 12062256
    Abstract: Disclosed herein are a method and a device for remotely diagnosing vehicle faults, a vehicle and a computer storage medium. The method includes monitoring vehicle data uploaded by the vehicle in real time via a cloud platform, and determining whether to identify a preset fault abnormal signal identification from target data of the vehicle data. The method also includes, in response to the fault abnormal signal identification being identified from the target data, sending a fault diagnosis task to the vehicle according to the target data, and receiving diagnosis result data returned by the vehicle after the fault diagnosis task is executed locally by the vehicle. The method further includes generating a remote fault diagnosis result of the vehicle according to the vehicle data and the diagnosis result data.
    Type: Grant
    Filed: July 14, 2023
    Date of Patent: August 13, 2024
    Assignees: ZHEJIANG ZEEKR INTELLIGENT TECHNOLOGY CO., LTD., VIRIDI E-MOBILITY TECHNOLOGY (NINGBO) CO., LTD., ZHEJIANG GEELY HOLDING GROUP CO., LTD.
    Inventors: Shangbing Niu, Zhiwei Zhao, Zhe Sun, Ziwei Deng, Chen Lin, Ruitian Zhang, Huan Wang, Yaqi Niu
  • Patent number: 12059813
    Abstract: Various embodiments of the present technology generally relate to robotic devices, computer-vision systems, and artificial intelligence. More specifically, some embodiments relate to a computer-vision system for robotic devices. In some implementations, a computer-vision is coupled to a robotic arm for picking items from a bin and perturbing items in a bin. A computer-vision system, in accordance with the present technology, may use at least two two-dimensional (2D) images to generate three-dimensional (3D) information about the bin and items in the bin. A method of training artificial neural networks to generate 3D information from 2D images includes obtaining ground truth data for a scene, obtaining at least two images of the scene, and providing the ground truth data and the at least two images to the artificial neural network configured to generate a depth map from the images based on the ground truth data.
    Type: Grant
    Filed: September 8, 2020
    Date of Patent: August 13, 2024
    Assignee: Embodied Intelligence, Inc.
    Inventors: Mostafa Rohaninejad, Nikhil Mishra, Yu Xuan Liu, Yan Duan, Andrew Amir Vaziri, Xi Chen
  • Patent number: 12063540
    Abstract: Processes, systems, and devices for wireless communications are described. A communication device may monitor a wakeup signal monitoring occasion in an inactive duration of a discontinuous reception (DRX) cycle. The communication device may transmit, in a first active duration of the DRX cycle, a channel state information (CSI) report on one or more resources based on monitoring the wakeup signal monitoring occasion. In some examples, the communication device may transmit an indication that the communication device requests reporting of the CSI report in the first active duration of the DRX cycle. The communication device may, in some examples, receive, in a second active duration of the DRX cycle, control information for the UE based on the CSI report.
    Type: Grant
    Filed: July 24, 2023
    Date of Patent: August 13, 2024
    Assignee: QUALCOMM Incorporated
    Inventors: Jelena Damnjanovic, Wooseok Nam, Tao Luo, Peter Gaal, Linhai He, Peter Pui Lok Ang, Juan Montojo, Wanshi Chen
  • Patent number: 12062629
    Abstract: Systems and methods are provided for an integrated chip. An integrated chip includes a package substrate including a plurality of first layers and a plurality of second layers, each second layer being disposed between a respective adjacent pair of the first layers. A transceiver unit is disposed above the package substrate. A waveguide unit including a plurality of waveguides having top and bottom walls formed in the first layers of the package substrate and sidewalls formed in the second layers of the package substrate.
    Type: Grant
    Filed: August 31, 2017
    Date of Patent: August 13, 2024
    Assignees: Taiwan Semiconductor Manufacturing Company Limited, The University of California, Los Angeles (UCLA)
    Inventors: Huan-Neng Chen, Chewn-Pu Jou, Feng Wei Kuo, Lan-Chou Cho, Wen-Shiang Liao, Yanghyo Kim
  • Patent number: 12062523
    Abstract: Methods and systems for uniformly cooling a dome within a plasma treatment system are disclosed. The methods and systems utilize a diffuser including a perforated plate and a cone. The perforated plate includes a center portion and multiple arrays of holes with each array being located circumferentially at a different distance from the center. The cone extends away from the center. The diffuser spreads cooling gas more uniformly across the surface of the dome.
    Type: Grant
    Filed: February 14, 2022
    Date of Patent: August 13, 2024
    Assignee: Taiwan SemiConductor Manufacturing Company, LTD.
    Inventors: Cheng Kuang Tso, Chou-Feng Lee, Chih-Hsien Hsu, Chung-Hsiu Cheng, Jr-Sheng Chen
  • Patent number: D1038742
    Type: Grant
    Filed: June 2, 2023
    Date of Patent: August 13, 2024
    Assignee: Fujian Secure Medical Technology CO., LTD
    Inventors: Yebing Jie, Xiaolin Shen, Jingduan Chen
  • Patent number: D1038791
    Type: Grant
    Filed: June 27, 2023
    Date of Patent: August 13, 2024
    Assignee: Waymo LLC
    Inventors: YooJung Ahn, Jared Gross, Thomas Southworth, Chun Chen, Ricky Wong