Patents by Inventor Chenchen Wang

Chenchen Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12243573
    Abstract: A semiconductor device including a capacitor, with a memory film isolating a first electrode from a contact, formed over a transistor and methods of forming the same are disclosed. In an embodiment, a semiconductor device includes a gate stack over a semiconductor substrate; a capacitor over the gate stack, the capacitor including a first electrode extending along a top surface of the gate stack, the first electrode being U-shaped; a first ferroelectric layer over the first electrode; and a second electrode over the first ferroelectric layer, a top surface of the second electrode being level with a top surface of the first ferroelectric layer, and the top surface of the first ferroelectric layer and the top surface of the second electrode being disposed further from the semiconductor substrate than a topmost surface of the first electrode.
    Type: Grant
    Filed: June 29, 2023
    Date of Patent: March 4, 2025
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chenchen Wang, Sai-Hooi Yeong, Chi On Chui, Yu-Ming Lin
  • Publication number: 20250062223
    Abstract: A semiconductor structure includes a first cell, a second cell, a first bit line, a first source line, a second bit line, and a second source line. The first cell includes a first source structure and a first drain structure. The second cell includes a second source structure and a second drain structure. The first bit line is coupled to the first drain structure, the first source line is coupled to the first source structure, the second bit line is coupled to the second drain structure, and the second source line is coupled to the second source structure. The first source line and the first bit line are alternately arranged, and the second source line and the second bit line are alternately arranged. A distance between the first source line and the first bit line is similar to a distance between the second source line and the second bit line.
    Type: Application
    Filed: November 1, 2024
    Publication date: February 20, 2025
    Inventors: MENG-HAN LIN, SAI-HOOI YEONG, CHENCHEN WANG
  • Patent number: 12165970
    Abstract: A semiconductor memory structure includes a first cell including a first source structure and a first drain structure, a second cell including a second source structure and a second drain structure, a first bit line, a first source line, a second bit line and a second source line. The first source line is coupled to the first source structure. The first bit line is coupled to the first drain structure. The second source line is coupled to the second source structure. The second bit line is coupled to the second drain structure. The first source line and the first bit line are in a first common layer. The second bit line and the second source line are in a second common layer. A distance between the first source line and the first bit line is similar to a distance between the second source line and the second bit line.
    Type: Grant
    Filed: October 24, 2023
    Date of Patent: December 10, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Meng-Han Lin, Sai-Hooi Yeong, Chenchen Wang
  • Patent number: 12083930
    Abstract: A power battery heating system of an electric vehicle including: a heating module configured to heat the power battery of the electric vehicle; a solar sunroof; and a sunroof control unit configured to control the operation of the heating module and the electric energy output of the solar sunroof; wherein the heating system is configured to start a power battery heating operation based on the solar sunroof when the power battery is not in a high voltage output state and the temperature of the power battery is lower than a temperature threshold, the power battery heating operation including: controlling the solar sunroof to output electric energy to the heating module such that the heating module performs the heating of the power battery using the electric energy from the solar sunroof.
    Type: Grant
    Filed: September 30, 2020
    Date of Patent: September 10, 2024
    Assignee: Volvo Car Corporation
    Inventors: Haibo Liang, Xi Wang, Chenchen Wang, Changzheng Shao
  • Publication number: 20240294575
    Abstract: The present disclosure provides a polypeptide capable of dissolving protein aggregates. Also provided is a method of treating a neurodegeneration disease using the polypeptide.
    Type: Application
    Filed: March 11, 2024
    Publication date: September 5, 2024
    Inventor: Chenchen WANG
  • Patent number: 11970517
    Abstract: The present disclosure provides a polypeptide capable of dissolving protein aggregates. Also provided is a method of treating a neurodegeneration disease using the polypeptide.
    Type: Grant
    Filed: August 14, 2022
    Date of Patent: April 30, 2024
    Assignee: REJUKON BIOPHARM INC.
    Inventor: Chenchen Wang
  • Publication number: 20240079591
    Abstract: An electrode material for an energy storage device including a covalent organic framework includes a plurality of aromatic moieties each linked by at least one thioether linkage. An anode including said electrode material, and an energy storage device having said anode.
    Type: Application
    Filed: January 18, 2023
    Publication date: March 7, 2024
    Inventors: Qichun Zhang, Chun-Sing Lee, Chenchen Wang, Shen Xu
  • Publication number: 20240063390
    Abstract: A covalent organic framework includes a plurality of aromatic moieties each linked by at least one thioether linkage, and its preparation method. An energy storage device includes a cell with an electrode including the covalent organic framework.
    Type: Application
    Filed: August 16, 2022
    Publication date: February 22, 2024
    Inventors: Qichun Zhang, Chun Sing Lee, Shen Xu, Chenchen Wang
  • Publication number: 20240055349
    Abstract: A semiconductor memory structure includes a first cell including a first source structure and a first drain structure, a second cell including a second source structure and a second drain structure, a first bit line, a first source line, a second bit line and a second source line. The first source line is coupled to the first source structure. The first bit line is coupled to the first drain structure. The second source line is coupled to the second source structure. The second bit line is coupled to the second drain structure. The first source line and the first bit line are in a first common layer. The second bit line and the second source line are in a second common layer. A distance between the first source line and the first bit line is similar to a distance between the second source line and the second bit line.
    Type: Application
    Filed: October 24, 2023
    Publication date: February 15, 2024
    Inventors: MENG-HAN LIN, SAI-HOOI YEONG, CHENCHEN WANG
  • Patent number: 11903221
    Abstract: A device includes a first transistor over a substrate, a second transistor disposed over the first transistor, and a memory element disposed over the second transistor. The second transistor includes a channel layer, a gate dielectric layer surrounding a sidewall of the channel layer, and a gate electrode surrounding a sidewall of the gate dielectric layer.
    Type: Grant
    Filed: January 22, 2021
    Date of Patent: February 13, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chenchen Wang, Chun-Chieh Lu, Chi On Chui, Yu-Ming Lin, Sai-Hooi Yeong
  • Publication number: 20230397442
    Abstract: A device includes a first transistor over a substrate, a second transistor disposed over the first transistor, and a memory element disposed over the second transistor. The second transistor includes a channel layer, a gate dielectric layer surrounding a sidewall of the channel layer, and a gate electrode surrounding a sidewall of the gate dielectric layer.
    Type: Application
    Filed: August 10, 2023
    Publication date: December 7, 2023
    Inventors: Chenchen Wang, Chun-Chieh Lu, Chi On Chui, Yu-Ming Lin, Sai-Hooi Yeong
  • Patent number: 11837536
    Abstract: A semiconductor memory structure includes a first cell, a second cell, a first bit line, a first source line, a second bit line and a second source line. The first cell includes a first source structure and a first drain structure, and the second cell includes a second source structure and a second drain structure. The first source line is coupled to the first source structure, and the first bit line is coupled to the first drain structure. The second source line is coupled to the second source structure, and the second bit line is coupled to the second drain structure. A distance between the first source line and the second bit line, a distance between the second bit line and the second source line, and a distance between the second source line and the first bit line are similar.
    Type: Grant
    Filed: January 5, 2021
    Date of Patent: December 5, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Meng-Han Lin, Sai-Hooi Yeong, Chenchen Wang
  • Publication number: 20230368830
    Abstract: A semiconductor device including a capacitor, with a memory film isolating a first electrode from a contact, formed over a transistor and methods of forming the same are disclosed. In an embodiment, a semiconductor device includes a gate stack over a semiconductor substrate; a capacitor over the gate stack, the capacitor including a first electrode extending along a top surface of the gate stack, the first electrode being U-shaped; a first ferroelectric layer over the first electrode; and a second electrode over the first ferroelectric layer, a top surface of the second electrode being level with a top surface of the first ferroelectric layer, and the top surface of the first ferroelectric layer and the top surface of the second electrode being disposed further from the semiconductor substrate than a topmost surface of the first electrode.
    Type: Application
    Filed: June 29, 2023
    Publication date: November 16, 2023
    Inventors: Chenchen Wang, Sai-Hooi Yeong, Chi On Chui, Yu-Ming Lin
  • Patent number: 11727976
    Abstract: A semiconductor device including a capacitor, with a memory film isolating a first electrode from a contact, formed over a transistor and methods of forming the same are disclosed. In an embodiment, a semiconductor device includes a gate stack over a semiconductor substrate; a capacitor over the gate stack, the capacitor including a first electrode extending along a top surface of the gate stack, the first electrode being U-shaped; a first ferroelectric layer over the first electrode; and a second electrode over the first ferroelectric layer, a top surface of the second electrode being level with a top surface of the first ferroelectric layer, and the top surface of the first ferroelectric layer and the top surface of the second electrode being disposed further from the semiconductor substrate than a topmost surface of the first electrode.
    Type: Grant
    Filed: July 25, 2022
    Date of Patent: August 15, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chenchen Wang, Sai-Hooi Yeong, Chi On Chui, Yu-Ming Lin
  • Publication number: 20230142083
    Abstract: The present disclosure provides a polypeptide capable of dissolving protein aggregates. Also provided is a method of treating a neurodegeneration disease using the polypeptide.
    Type: Application
    Filed: August 14, 2022
    Publication date: May 11, 2023
    Inventor: Chenchen WANG
  • Publication number: 20220358983
    Abstract: A semiconductor device including a capacitor, with a memory film isolating a first electrode from a contact, formed over a transistor and methods of forming the same are disclosed. In an embodiment, a semiconductor device includes a gate stack over a semiconductor substrate; a capacitor over the gate stack, the capacitor including a first electrode extending along a top surface of the gate stack, the first electrode being U-shaped; a first ferroelectric layer over the first electrode; and a second electrode over the first ferroelectric layer, a top surface of the second electrode being level with a top surface of the first ferroelectric layer, and the top surface of the first ferroelectric layer and the top surface of the second electrode being disposed further from the semiconductor substrate than a topmost surface of the first electrode.
    Type: Application
    Filed: July 25, 2022
    Publication date: November 10, 2022
    Inventors: Chenchen Wang, Sai-Hooi Yeong, Chi On Chui, Yu-Ming Lin
  • Publication number: 20220216142
    Abstract: A semiconductor memory structure includes a first cell, a second cell, a first bit line, a first source line, a second bit line and a second source line. The first cell includes a first source structure and a first drain structure, and the second cell includes a second source structure and a second drain structure. The first source line is coupled to the first source structure, and the first bit line is coupled to the first drain structure. The second source line is coupled to the second source structure, and the second bit line is coupled to the second drain structure. A distance between the first source line and the second bit line, a distance between the second bit line and the second source line, and a distance between the second source line and the first bit line are similar.
    Type: Application
    Filed: January 5, 2021
    Publication date: July 7, 2022
    Inventors: MENG-HAN LIN, SAI-HOOI YEONG, CHENCHEN WANG
  • Publication number: 20220177524
    Abstract: Provided are a method of producing a modified T cell comprising introducing into a precursor T cell a first nucleic acid encoding a Nef protein, wherein the Nef protein upon expression results in down-modulation of the endogenous T cell receptor (TCR) in the modified T cell, wherein the modified T cell furthermore expresses a functional exogenous receptor, such as an engineered TCR (e.g., chimeric TCR), T cell antigen coupler (TAC), TAC-like chimeric receptor, or a chimeric antigen receptor (CAR), the modified cell obtained by the method and the pharmaceutical composition comprising the modified T cell. Also provided is a non-naturally occurring Nef protein comprising one or more mutations.
    Type: Application
    Filed: July 26, 2019
    Publication date: June 9, 2022
    Inventors: Xiaohu FAN, Yuncheng ZHAO, Dawei YU, Wujinan ZHI, Chenchen WANG, Qiuchuan ZHUANG, Pingyan WANG, Xuanxuan GUO
  • Publication number: 20220052115
    Abstract: A device includes a first transistor over a substrate, a second transistor disposed over the first transistor, and a memory element disposed over the second transistor. The second transistor includes a channel layer, a gate dielectric layer surrounding a sidewall of the channel layer, and a gate electrode surrounding a sidewall of the gate dielectric layer.
    Type: Application
    Filed: January 22, 2021
    Publication date: February 17, 2022
    Inventors: Chenchen Wang, Chun-Chieh Lu, Chi On Chui, Yu-Ming Lin, Sai-Hooi Yeong
  • Publication number: 20210107379
    Abstract: A power battery heating system of an electric vehicle including: a heating module configured to heat the power battery of the electric vehicle; a solar sunroof; and a sunroof control unit configured to control the operation of the heating module and the electric energy output of the solar sunroof; wherein the heating system is configured to start a power battery heating operation based on the solar sunroof when the power battery is not in a high voltage output state and the temperature of the power battery is lower than a temperature threshold, the power battery heating operation including: controlling the solar sunroof to output electric energy to the heating module such that the heating module performs the heating of the power battery using the electric energy from the solar sunroof.
    Type: Application
    Filed: September 30, 2020
    Publication date: April 15, 2021
    Inventors: Haibo LIANG, Xi WANG, Chenchen WANG, Changzheng SHAO