Abstract: A mountable arm assembly for fitness equipment, comprises two arm members and a connector for pivot connection of the two arm members. The two arm members respectively provide a plurality of assembly portions for length adjustment of the tension arm. The connector is formed with a pivot connection portion and a plurality of eccentric positioning portions. Specifically, an adjustable disposing angle is formed between the two arm members, and the two arm members set the disposing angle through the one the eccentric positioning portions. The arm assembly can be mounted on fitness equipment and can swing back and forth through the pivot connection portion. The users can select one assembly portion on each of the two arm members for required tension arm lengths and add an applied force and a resistance force respectively on the two assembly portions.

Abstract: The present invention provides a mountable arm assembly for fitness equipment, comprising two arm members and a connector for pivot connection of the two arm members. The two arm members respectively provide a plurality of assembly portions for length adjustment of the tension arm. The connector is formed with a pivot connection portion and a plurality of eccentric positioning portions. Specifically, an adjustable disposing angle is formed between the two arm members, and at least one of the two arm members sets the disposing angle through at least one eccentric positioning portion. The arm assembly can be mounted on fitness equipment and can swing back and forth through the pivot connection portion. The users can select one assembly portion on each of the two arm members for required tension arm lengths and add an applied force and a resistance force respectively on the two assembly portions.

Abstract: An exercise machine such as a stationary exercise bicycle includes a body supported by the ground; an axle disposed in the body; a first gear disposed on the axle; a driving shaft vertically disposed in the body; a second gear disposed on the driving shaft and meshed the first gear; and a horizontally disposed flywheel disposed in a base of the body. A rotation of the axle rotates the flywheel via the first gear, the second gear, and the driving shaft.

Abstract: A modular fitness device includes a fitness equipment and a receiving box. The fitness equipment has a power demand side. The receiving box is disposed at one side of the fitness equipment. A counterweight is disposed in the receiving box. The counterweight is connected to the power demand side via at least one follower. At least one connecting member is disposed between the fitness equipment and the receiving box. The receiving box is formed as a module disposed at one side of the fitness equipment. The production and assembly convenience of the modular fitness device is improved.

Abstract: An exercise machine such as a stationary exercise bicycle includes a body supported by the ground; an axle disposed in the body; a first gear disposed on the axle; a driving shaft vertically disposed in the body; a second gear disposed on the driving shaft and meshed the first gear; and a horizontally disposed flywheel disposed in a base of the body. A rotation of the axle rotates the flywheel via the first gear, the second gear, and the driving shaft.

Abstract: A modular fitness device includes a fitness equipment and a receiving box. The fitness equipment has a power demand side. The receiving box is disposed at one side of the fitness equipment. A counterweight is disposed in the receiving box. The counterweight is connected to the power demand side via at least one follower. At least one connecting member is disposed between the fitness equipment and the receiving box. The receiving box is formed as a module disposed at one side of the fitness equipment. The production and assembly convenience of the modular fitness device is improved.

Abstract: The present invention is scissors with precise control and labor-saving functions. It is to accurately control shears and cooperate with extendable force-arms with double fulcrums to save labor. The present invention comprises: a pair of cutting portions with a pair of cutters, the cutters being connected pivotally; two handle portions having two handle rods with double fulcrums and interaction force-arms, the double fulcrums including two front fulcrums connecting and exactly controlling the cutting portions and two rear fulcrums pivotally located on two rear ends of two handle rods, the rear fuilcrums cooperating with an elastic member to let the handle rods restore; two sliding sleeves located on the handle portions and being extendable based on length demands to assist as handle rods. Therefore, the shears can be controlled easily and precisely.

Abstract: A process for etching deep trenches in a substrate for purposes such as the fabrication of microelectromechanical systems (MEMS), for example, on the substrate. The two-step process includes first etching a tapered trench having a tapered profile and enhanced sidewall passivation in a substrate along a protective mask which defines the desired trench profile on the substrate surface. Next, the tapered trench is trimmed by high-density plasma in an isotropic etching step to provide a straight-profile deep trench with minimum sidewall passivation.

Abstract: A wafer transfer system having a temperature control apparatus. The temperature control apparatus is constructed and arranged so that a material, element, or atomic particle may flow therethrough to heat or cool a wafer carried by the wafer transfer system. The material, element or atomic particle flowing through the temperature control apparatus causes heat to be pumped to or from an upper surface or lower surface. Preferably the temperature control apparatus is a thermoelectric device. Preferably the thermoelectric device includes a plurality of alternating N-type and P-type semiconductor pellets arranged electrically in series and thermally in parallel, and connected to a DC power supply. A switch or relay is provided for altering the direction of current flow to the thermoelectric device from a DC supply.

Abstract: A wafer transfer system having a temperature control apparatus. The temperature control apparatus is constructed and arranged so that a material, element, or atomic particle may flow therethrough to heat or cool a wafer carried by the wafer transfer system. The material, element or atomic particle flowing through the temperature control apparatus causes heat to be pumped to or from an upper surface or lower surface. Preferably the temperature control apparatus is a thermoelectric device. Preferably the thermoelectric device includes a plurality of alternating N-type and P-type semiconductor pellets arranged electrically in series and thermally in parallel, and connected to a DC power supply. A switch or relay is provided for altering the direction of current flow to the thermoelectric device from a DC supply.

Abstract: An optical device packaging technique involves an optical sensor that is formed on a first substrate and flip chip bonded to a second substrate. The second substrate includes a through hole or a transparent section that is aligned with the optical sensor in order to allow light to contact the optical sensor. An embodiment of an optical device structure includes an optical sensor, a first substrate, a second substrate, and a circuit board. The optical sensor is formed on or within the first substrate and the individual sensors or pixels of the optical sensor are electrically connected to contact pads that are exposed on the first substrate. The first substrate is flip chip bonded to the second substrate. The second substrate is flip chip bonded to a circuit board. Another embodiment of an optical device structure includes an optical sensor, a first substrate, and a circuit board as the second substrate.

Abstract: An integrated circuit redistribution structure. The integrated circuit redistribution structure includes a plurality of conductive pads located on an active side of an integrated circuit. The integrated circuit redistribution structure includes a redistribution layer and an under bump material structure for receiving a solder bump. The redistribution layer can include a first mechanically protective layer which adheres to the active side of the integrated circuit. The redistribution layer includes a plurality of conductive lines in which at least one of the conductive lines is connected to at least one conductive pad. Each conductive line includes an adhesion and diffusion barrier layer, an electrical conductor layer, and a first metallic protective layer. The under bump material structure is formed over at least one conductive line.

Abstract: A flip-chip IC package (10) provides a thermally-conductive lid (20) attached to a backside of the chip (12) by a die attach layer (18) of a predetermined thickness range. A rim (22), preferably KOVAR iron-nickel alloy, is formed on the lid (20) with a depth (44) less than a sum (42) of a thickness of the chip, the interconnects (16), and a minimum final thickness (40) of the die attach layer (18) by a predetermined margin (46). An initial thickness of thermally-filled epoxy is applied to the backside of the chip and a layer of lid attach epoxy (24) is applied to the rim of the lid in a thickness sufficient to span the predetermined margin. The lid is floated on the die attach layer (18) with the rim of the lid surrounding the chip and floating on the lid attach material. The lid is clamped against the chip with a force sufficient to compress the die attach material to a predetermined thickness in a range less than the initial thickness and not less than the minimum final thickness (40).

Abstract: A gas discharge through nitrous oxide or nitrogen is used to remove polymeric deposits that form on the surface of a layer of a spin-on glass that was etched in an atmosphere of carbon-fluorine compounds. Removal of the polymeric deposit greatly improves adhesion to the spin-on glass layer of subsequently deposited layers. The removal is accomplished without increasing any tendency of the spin-on glass layer to absorb moisture.

Abstract: A system of interconnecting electrical components having conflicting bonding requirements for mounting the components to a printed circuit board. The system includes a primary printed circuit board having a pattern of through-holes and having arrangements of connection sites to receive electrical components. For example, the connection sites of the primary printed circuit board may be of the type to receive components associated with the bonding requirements of surface mounting. A secondary printed circuit board has a pattern of through-holes corresponding to the pattern of through-holes of the primary printed circuit board. The circuit boards are wave soldered or surface mounted together by means of the corresponding patterns of through-holes. Attached to the secondary printed circuit board is one or more electrical component having bonding requirements which conflict with those of the primary printed circuit board.

Abstract: A method and apparatus for electrically connecting circuitry on a printed circuit board having a plurality of circuit regions, with each circuit region having components operatively associated with input and output signal lines that are electrically isolated from the signal lines of adjacent circuit regions. The input and output signal lines of a particular circuit region are arranged in a closely spaced pattern aligned with a corresponding pattern of traces on an adjacent circuit region. A plurality of connector members are selectively attached to the printed circuit board to provide signal communication among the regions. Each connector member has closely spaced conductive bars which are exposed to contact the signal lines. The conductive bars have a length and a pitch such that the bars place parallel trace patterns in electrical communication when pressed in place.

Abstract: A semiconductor integrated device support structure having a transmission line interconnect structure in a metal block on which the devices are mounted. The metal block is formed photolithographically from layers which define X,Y sections of the block. A plurality of stacked layers contains the complete wireline interconnect network. Each wire is a true coaxial transmission line having an inner conductor, a surrounding dielectric material and an outer conductor. By appropriate choice of radii of the inner conductor and the surrounding dielectric material, favorable impedances may be selected.