Patents by Inventor Cheng Chien

Cheng Chien has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240357680
    Abstract: A multi-link operation (MLO) Wi-Fi dual traffic identification data transmission method is adopted for an MLO Wi-Fi access point (AP) and an MLO Wi-Fi client. The method includes linking the MLO Wi-Fi client to the MLO Wi-Fi access point (AP) with a first link and a second link, rendering traffic in the first link a first block acknowledgement (BA) window with a first traffic identification (TID), rendering traffic in the second link a second block acknowledgement (BA) window with a second traffic identification (TID), using the first block acknowledgement (BA) window with the first TID to transmit data through the first link, and using the second block acknowledgement (BA) window with the second TID to transmit data through the second link.
    Type: Application
    Filed: April 3, 2024
    Publication date: October 24, 2024
    Applicant: MEDIATEK INC.
    Inventors: Tsung-Jung Lee, Ying-You Lin, Cheng-Chien Su, Kuo-Wei Chen
  • Patent number: 12125460
    Abstract: A system that can intelligently help a user judge the resolution requirement of the image content. In an example, the display panel can show in different virtual resolutions or the system can automatically judge whether the image content requires high or low resolution using a similarity judgement. The system can then inform the display panel what virtual resolution should be shown or what the optimal resolution is using the similarity judgment and send the image content to the display panel with that resolution.
    Type: Grant
    Filed: July 13, 2023
    Date of Patent: October 22, 2024
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Hsing-Hung Hsieh, Cheng-Chien Chen, Kuan-Ting Wu
  • Publication number: 20240332218
    Abstract: A semiconductor article which includes a semiconductor substrate, a back end of the line (BEOL) wiring portion on the semiconductor substrate, a through silicon via and a guard ring. The semiconductor substrate is made of a semiconductor material. The BEOL wiring portion includes a plurality of wiring layers having electrically conductive wiring and electrical insulating material. The through silicon via provides a conductive path through the BEOL wiring portion and the semiconductor substrate. The guard ring surrounds the through silicon via in the BEOL wiring portion and in some embodiments in the semiconductor substrate.
    Type: Application
    Filed: June 12, 2024
    Publication date: October 3, 2024
    Inventors: Min-Feng KU, Yao-Chun CHUANG, Ching-Pin LIN, Cheng-Chien LI
  • Publication number: 20240332219
    Abstract: A semiconductor article which includes a semiconductor substrate, a back end of the line (BEOL) wiring portion on the semiconductor substrate, a through silicon via and a guard ring. The semiconductor substrate is made of a semiconductor material. The BEOL wiring portion includes a plurality of wiring layers having electrically conductive wiring and electrical insulating material. The through silicon via provides a conductive path through the BEOL wiring portion and the semiconductor substrate. The guard ring surrounds the through silicon via in the BEOL wiring portion and in some embodiments in the semiconductor substrate.
    Type: Application
    Filed: June 12, 2024
    Publication date: October 3, 2024
    Inventors: Min-Feng KU, Yao-Chun CHUANG, Ching-Pin LIN, Cheng-Chien LI
  • Publication number: 20240274669
    Abstract: An IC structure includes a semiconductor substrate; an isolation structure formed in the semiconductor substrate, thereby defining active regions surrounded by the isolation feature; a first well of a first conductivity type formed in the semiconductor substrate; a neutral region formed in the semiconductor substrate and laterally surrounding the first well; a second well of a second conductivity type formed on the semiconductor substrate and laterally surrounding the neutral region, the second conductivity type being opposite to the first conductivity type; a source disposed on the second well of the semiconductor substrate; a drain disposed on the first well of the semiconductor substrate; and a gate structure interposed between the source and the drain. The gate structure is engaging the first well, the neutral region and the second well of the semiconductor substrate. The source, the drain and the gate structure are configured as a FET.
    Type: Application
    Filed: July 14, 2023
    Publication date: August 15, 2024
    Inventors: YuYing Hsieh, Cheng-Chien Li, Huei-Shan Wu
  • Patent number: 12046566
    Abstract: A semiconductor article which includes a semiconductor substrate, a back end of the line (BEOL) wiring portion on the semiconductor substrate, a through silicon via and a guard ring. The semiconductor substrate is made of a semiconductor material. The BEOL wiring portion includes a plurality of wiring layers having electrically conductive wiring and electrical insulating material. The through silicon via provides a conductive path through the BEOL wiring portion and the semiconductor substrate. The guard ring surrounds the through silicon via in the BEOL wiring portion and in some embodiments in the semiconductor substrate.
    Type: Grant
    Filed: September 21, 2021
    Date of Patent: July 23, 2024
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Min-Feng Ku, Yao-Chun Chuang, Ching-Pin Lin, Cheng-Chien Li
  • Publication number: 20240229526
    Abstract: A displaceable rotating shaft structure and a foldable device having the rotating shaft structure are disclosed. The displaceable rotating shaft structure comprises a support, a rotating shaft, a connecting rod assembly, a guide assembly, and a torsion assembly. The support has a supporting portion. The connecting rod assembly has a first outer end that is rotatably connected to the linking section of the rotating shaft and a second outer end that is pivotally connected to the supporting portion. The guide assembly has a guide rod. The guide rod is configured to displace relative to the supporting portion. When the rotating shaft is rotated, the rotating shaft drives the connecting rod assembly to adjust the angle and the total length of a joint of connecting rods of the connecting rod assembly, a distance between the rotating shaft and the support is changed through the guide assembly.
    Type: Application
    Filed: October 25, 2022
    Publication date: July 11, 2024
    Inventors: WEN-YEN LIN, WEI-CHENG CHIEN
  • Patent number: 12006749
    Abstract: A displaceable rotating shaft structure and a foldable device having the rotating shaft structure are disclosed. The displaceable rotating shaft structure comprises a support, a rotating shaft, a connecting rod assembly, a guide assembly, and a torsion assembly. The support has a supporting portion. The connecting rod assembly has a first outer end that is rotatably connected to the linking section of the rotating shaft and a second outer end that is pivotally connected to the supporting portion. The guide assembly has a guide rod. The guide rod is configured to displace relative to the supporting portion. When the rotating shaft is rotated, the rotating shaft drives the connecting rod assembly to adjust the angle and the total length of a joint of connecting rods of the connecting rod assembly, a distance between the rotating shaft and the support is changed through the guide assembly.
    Type: Grant
    Filed: October 25, 2022
    Date of Patent: June 11, 2024
    Assignee: Fositek Corporation
    Inventors: Wen-Yen Lin, Wei-Cheng Chien
  • Publication number: 20240160714
    Abstract: An access control management system, access control management method and an image capture device are provided. The access control management system includes an image capture device and a processing device. The image capture device includes: a lens; an image sensor configured to sense a light intensity passing through the lens to generate an image of a subject being captured; an image signal processor (ISP) configured to capture a face image in the generated image, perform a de-identification processing on the face image to obtain de-identified image data, and transform the de-identified image data into multiple de-identified features; and an I/O interface configured to output the de-identified features. The processing device is configured to verify an identity of a user to which the de-identified features belong by a trained deep learning model. The deep learning model is trained by using de-identified features and identities of multiple users registered in advance.
    Type: Application
    Filed: September 7, 2023
    Publication date: May 16, 2024
    Applicant: DeCloak Intelligences Co.
    Inventors: Yao-Tung Tsou, Yun-Yu Wang, Guo-Cheng Chien, Kuo-Yu Chang
  • Publication number: 20240161541
    Abstract: A face recognition system and a face recognition method are provided. The face recognition system includes an image capturing device and a processing device. The image capturing device is configured to capture a face image of a user to be recognized, de-identify the face image to obtain de-identified image data, and transform the de-identified image data into multiple de-identified features and output. The processing device is configured to verify an identity of the user to which the de-identified features belong by using a trained machine learning model. The machine learning model is trained by using de-identified features and identities of multiple users registered in advance.
    Type: Application
    Filed: September 6, 2023
    Publication date: May 16, 2024
    Applicant: DeCloak Intelligences Co.
    Inventors: Yao-Tung Tsou, Yun-Yu Wang, Guo-Cheng Chien, Kuo-Yu Chang
  • Publication number: 20240143070
    Abstract: In examples, an electronic device comprises a camera to capture an image of a space and a processor coupled to the camera. The processor is to receive the image of the space from the camera; identify a person in the image and a presentation device in the image; identify a head position of the person based on the image; determine whether the person is viewing the presentation device based on the head position; and perform an action relating to the presentation device based on the determination.
    Type: Application
    Filed: October 27, 2022
    Publication date: May 2, 2024
    Inventors: Peter Siyuan ZHANG, Hsin-Chin LIN, Cheng-Chien CHEN
  • Publication number: 20240133221
    Abstract: A displaceable rotating shaft structure and a foldable device having the rotating shaft structure are disclosed. The displaceable rotating shaft structure comprises a support, a rotating shaft, a connecting rod assembly, a guide assembly, and a torsion assembly. The support has a supporting portion. The connecting rod assembly has a first outer end that is rotatably connected to the linking section of the rotating shaft and a second outer end that is pivotally connected to the supporting portion. The guide assembly has a guide rod. The guide rod is configured to displace relative to the supporting portion. When the rotating shaft is rotated, the rotating shaft drives the connecting rod assembly to adjust the angle and the total length of a joint of connecting rods of the connecting rod assembly, a distance between the rotating shaft and the support is changed through the guide assembly.
    Type: Application
    Filed: October 24, 2022
    Publication date: April 25, 2024
    Inventors: WEN-YEN LIN, WEI-CHENG CHIEN
  • Publication number: 20240103234
    Abstract: A ferrule of optical cable with multi cores includes a casing and at least one main body. The main body is connected to the casing. A plurality of main body through-holes are formed on the at least one main body. The casing and the main body are separately formed and fixed to each other. A plurality of optical fibers of a fiber optical cable pass through the main body through-holes and extrude out of the casing.
    Type: Application
    Filed: June 16, 2023
    Publication date: March 28, 2024
    Inventors: CHIH-CHENG CHIEN, TSO-HAN CHIEN
  • Publication number: 20240074826
    Abstract: A surgical robot including at least one contact module, a control connection module, at least one first robotic arm, and at least one grip control device. A first transmission member of the control connection module drives the control module through a first transmission connecting member. A first shaft member of the first robotic arm is connected with the first transmission member while the grip control device is connected with the first robotic arm by a transmission interface. A force sensing member of the first robotic arm detects a first reaction force from the contact module so that the first robotic arm sends a feedback control signal to the grip control device to control a grip driving member to generate a force feedback for allowing a grip portion to move. Thereby, users can feel movement of the grip portion caused by the force feedback to avoid accidental iatrogenic injuries.
    Type: Application
    Filed: September 14, 2022
    Publication date: March 7, 2024
    Inventors: PO-YUN LIU, CHUN-HUNG KUO, CHIH-CHENG CHIEN, YEN-CHIEH WANG
  • Patent number: 11903907
    Abstract: The invention provides a soluble honokiol derivative (such as a water soluble honokiol derivative) and its application in antagonizing glycoprotein VI receptor and providing antioxidant and neuroprotective effects.
    Type: Grant
    Filed: July 17, 2020
    Date of Patent: February 20, 2024
    Assignees: TAIPEI MEDICAL UNIVERSITY, CATHAY GENERAL HOSPITAL
    Inventors: Joen-Rong Sheu, Fa-Kung Lee, Chih-Cheng Chien, Chih-Ming Ho, Chao-Chien Chang, Cheng-Ying Hsieh, Jing-Ping Liou
  • Patent number: 11907340
    Abstract: An image positioning device is provided in the invention. The image positioning device includes a calculation circuit and a positioning circuit. The calculation circuit obtains a plurality of images from an image capturing device and classifies the images into a plurality of main groups based on a first algorithm, wherein each main group corresponds to a different area and the calculation circuit classifies the images of each main group into a plurality of sub-groups based on a feature of each image of each main group and a clustering algorithm. The positioning circuit is coupled to the calculation circuit. The positioning circuit positions each sub-group in the area corresponding to each main group based on the relative position relationship between each sub-group of each main group.
    Type: Grant
    Filed: July 30, 2021
    Date of Patent: February 20, 2024
    Assignee: QUANTA COMPUTER INC.
    Inventors: Kai-Ju Cheng, Yu-Hsun Chen, Yu-Cheng Chien, Chin-Yuan Ting, Shao-Ang Chen
  • Publication number: 20230361181
    Abstract: A semiconductor device includes a substrate, at least one semiconductor fin, and at least one epitaxy structure. The semiconductor fin is present on the substrate. The semiconductor fin has at least one recess thereon. The epitaxy structure is present in the recess of the semiconductor fin. The epitaxy structure includes a topmost portion, a first portion and a second portion arranged along a direction from the semiconductor fin to the substrate. The first portion has a germanium atomic percentage higher than a germanium atomic percentage of the topmost portion and a germanium atomic percentage of the second portion.
    Type: Application
    Filed: July 17, 2023
    Publication date: November 9, 2023
    Inventors: Chia-Ming Chang, Chi-Wen Liu, Cheng-Chien Li, Hsin-Chieh Huang
  • Publication number: 20230314088
    Abstract: A heat dissipation device for a multipoint heat source includes an evaporator unit and a condenser unit. The evaporator unit includes a multi-channel duct. At least one narrow side of the multi-channel duct has a communication opening in communication with the bottom side of at least one tube of the condenser unit, and a wide side of the multi-channel duct is attached to the multipoint heat source so that a heat conduction medium can be circulated through the evaporator unit and the condenser unit while alternating between a liquid phase and a gaseous phase.
    Type: Application
    Filed: June 30, 2022
    Publication date: October 5, 2023
    Inventors: CHENG-CHIEN WAN, CHENG-RUI WAN, CHUN-HSIEN SU, HUI-FEN HUANG, FONG JOU TU, CHI CHENG CHEN, CHUAN MENG WANG
  • Publication number: 20230306706
    Abstract: Digital image stitching systems and methods are disclosed herein for generating one or more panoramic image views. A plurality of digital images depicting a target feature within an application area are captured by a camera of a scanner device. Motion data is captured, by a sensor coupled to the scanner device, as the scanner device moves relative to the target feature, where relative position data, corresponding to the plurality of digital images, is determined based on the motion data. An angle or position is generated for a first image relative to a second image of the plurality of images, and, based on image matching of the angle or the position of the second image with respect to the first image, a panoramic image view is generated depicting the target feature in a wider field of view of the application area than either the first image or the second image.
    Type: Application
    Filed: March 22, 2023
    Publication date: September 28, 2023
    Inventors: Pei LI, Faiz Feisal SHERMAN, Xinru CUI, Kai-Ju CHENG, Kuan-Chung CHEN, Shao-Ang CHEN, Jia-Chyi WANG, Yu-Cheng CHIEN
  • Patent number: 11749724
    Abstract: A semiconductor device includes a substrate, at least one semiconductor fin, and at least one epitaxy structure. The semiconductor fin is present on the substrate. The semiconductor fin has at least one recess thereon. The epitaxy structure is present in the recess of the semiconductor fin. The epitaxy structure includes a topmost portion, a first portion and a second portion arranged along a direction from the semiconductor fin to the substrate. The first portion has a germanium atomic percentage higher than a germanium atomic percentage of the topmost portion and a germanium atomic percentage of the second portion.
    Type: Grant
    Filed: May 25, 2021
    Date of Patent: September 5, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chia-Ming Chang, Chi-Wen Liu, Cheng-Chien Li, Hsin-Chieh Huang