Patents by Inventor Cheng Chin Lee

Cheng Chin Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200006116
    Abstract: A method and structure for forming an enhanced metal capping layer includes forming a portion of a multi-level metal interconnect network over a substrate. In some embodiments, the portion of the multi-level metal interconnect network includes a plurality of metal regions. In some cases, a dielectric region is disposed between each of the plurality of metal regions. By way of example, a metal capping layer may be deposited over each of the plurality of metal regions. Thereafter, in some embodiments, a self-assembled monolayer (SAM) may be deposited, where the SAM forms selectively on the metal capping layer, while the dielectric region is substantially free of the SAM. In various examples, after selectively forming the SAM on the metal capping layer, a thermal process may be performed, where the SAM prevents diffusion of the metal capping layer during the thermal process.
    Type: Application
    Filed: February 7, 2019
    Publication date: January 2, 2020
    Inventors: Shao-Kuan LEE, Cheng-Chin Lee, Hsin-Yen HUANG, Hai-Ching CHEN, Shau-Lin SHUE
  • Publication number: 20200006060
    Abstract: A structure is provided that includes a first conductive component and a first interlayer dielectric (ILD) that surrounds the first conductive component. A self-assembly layer is formed on the first conductive component but not on the first ILD. A first dielectric layer is formed over the first ILD but not over the first conductive component. A second ILD is formed over the first conductive component and over the first ILD. An opening is etched in the second ILD. The opening is at least partially aligned with the first conductive component. The first dielectric layer protects portions of the first ILD located therebelow from being etched. The opening is filled with a conductive material to form a second conductive component in the opening.
    Type: Application
    Filed: October 26, 2018
    Publication date: January 2, 2020
    Inventors: Shao-Kuan Lee, Hsin-Yen Huang, Yung-Hsu Wu, Cheng-Chin Lee, Hai-Ching Chen, Shau-Lin Shue
  • Patent number: 7068149
    Abstract: A system and method for facilitating delivery and return service between a delivery party and a receiving party. These parties may or may not have pre-registered to use the locker system. The system has locker modules (35) and a system controller (10). The system controller (10) interfaces with the locker modules (35) via a network (30). Each of the locker modules (35) has locker units for depositing and retrieving the goods and a locker controller coupled to control the locker units. Together, the system controller (10) and the locker controller enable steps of the method by processing a user input that is received via a user input interface coupled to the system controller (10) and the locker controller. The user input is associated with the receiving party and provided by the delivery party. Thereafter, the system controller (10) generates a notification message having an identification code for transmitting to the receiving party.
    Type: Grant
    Filed: May 30, 2002
    Date of Patent: June 27, 2006
    Assignee: First Cube Pte Ltd
    Inventors: Cheng Chin Lee, Hon Chew Lee