Abstract: The invention provides a radio-frequency (RF) device package and a method for fabricating the same. An exemplary embodiment of a radio-frequency (RF) device package includes a base, wherein a radio-frequency (RF) device chip is mounted on the base. The RF device chip includes a semiconductor substrate having a front side and a back side. A radio-frequency (RF) component is disposed on the front side of the semiconductor substrate. An interconnect structure is disposed on the RF component, wherein the interconnect structure is electrically connected to the RF component, and a thickness of the semiconductor substrate is less than that of the interconnect structure. A through hole is formed through the semiconductor substrate from the back side of the semiconductor substrate, and is connected to the interconnect structure. A TSV structure is disposed in the through hole.

Abstract: A light source module of an optical apparatus is disclosed. The light source module includes a laser pump unit, a lens unit, and a fiber unit. The laser pump unit generates a laser source. The lens unit converts the laser source into a condensed beam. The fiber unit receives the condensed beam and emits an optical signal. The light source module can achieve effects of low cost, large bandwidth, high resolution, and high stability with well-designed pump power of the laser pump unit, and length, doping material, and core size of the fiber unit.

Abstract: An optical apparatus applied to ophthalmology detection is disclosed. The optical apparatus includes a first light source module, a second light source module, and an interference module. The first light source module is formed by a laser light source and lens units and used to emit a first light signal. The second light source module is formed by fiber units and lens units. The second light source module is coupled to the first light source module in series. The second light source module is used to receive a first light signal and emit a second light signal. The interference module is coupled to the second light source module and used to receive the second light signal and provide a first incident light and a second incident light to an object to be detected and a reference mirror respectively.

Abstract: The present disclosure provides a semiconductor structure which includes a conductive layer and a resistance configurable structure over the conductive layer. The resistance configurable structure includes a first electrode, a resistance configurable layer over the first electrode, and a second electrode over the resistance configurable layer. The first electrode has a first sidewall, a second sidewall, and a bottom surface on the conductive layer. A joint between the first sidewall and the second sidewall includes an electric field enhancement structure. The present disclosure also provides a method for manufacturing the above semiconductor structure, including patterning a hard mask on a conductive layer; forming a spacer around the hard mask; removing at least a portion of the hard mask; forming a conforming resistance configurable layer on the spacer; and forming a second conductive layer on the conforming resistance configurable layer.

Abstract: A system and method of cooling a three dimensional integrated circuit (3D IC) using at least one thermoelectric cooler which is connected to the 3D IC by a plurality of conductive pillars. In some embodiments a controller controls power supply to the thermoelectric cooler, and a temperature monitor provides a temperature input to the controller. In some embodiments the controller maintains a temperature of a 3D IC within a predetermined range by cycling power to the thermoelectric cooler.

Abstract: A method includes generating representative noise variance estimates based on a plurality of received symbols received in an orthogonal frequency division multiplexing (OFDM) signal. The representative noise variance estimates correspond to respective frequency intervals of a plurality of frequency intervals of the OFDM channel. Individual frequency intervals of the plurality of frequency intervals include a plurality of contiguous frequency bins of the OFDM signal.

Abstract: A device includes a proportional-to-absolute-temperature (PTAT) current source having a bandgap reference voltage node, and a negative temperature dynamic load having an input terminal electrically connected to the bandgap reference voltage node.

Abstract: Embodiments of an interconnect structure and methods for forming an interconnect structure are provided. The method includes forming a low-k dielectric layer over a substrate, forming an opening in the low-k dielectric layer, forming a conductor in the opening, forming a capping layer over the conductor, and forming an etch stop layer over the capping layer and the low-k dielectric layer. The etch stop layer includes an N element with a content ratio not less than about 25 at %.

Abstract: A heating and heat dissipating multi-layer circuit board structure for keeping operating temperatures of electronic components is provided. The outer layer of the multi-layer printed circuit board is in contact with electronic components. The operating temperatures of electronic components are measured through by a temperature measuring circuit. When the operating temperature of at least one electronic component is lower than a default temperature, the heating circuits corresponding to the electronic components are enabled respectively to heat the electronic components through corresponding heat conduction elements. When the operating temperature of at least one electronic component is higher than another default temperature, the heating circuits corresponding to the electronic components are disabled to transfer the heat from the electronic components to the heat conduction elements automatically.

Abstract: A memory assist apparatus includes a detection circuit and a compensation circuit. The detection circuit is configured to provide a detection signal indicating whether a bit line configured to provide read access to a data bit stored at a memory bit cell has a voltage below a predetermined threshold. The compensation circuit is configured to pull down the voltage of the bit line if the detection signal indicates that the voltage of the bit line is below the predetermined threshold.

Abstract: A method for disabling a touch point and an electronic device adapted for this method are disclosed. The electronic device includes a touch screen and has a register table. The method includes periodically receiving touch information on the touch screen; generating touch point data corresponding to the touch information; updating the register table according to the touch point data; determining whether there exists a touch point in the register table that remains unmoved for more than a predetermined time period; and if yes, ignoring the touch point. Therefore, the method can exclude the effect to an application program due to unexpected touch behavior, so that the application program can keep operating normally.

Abstract: A semiconductor transistor is formed as follows. A gate electrode is formed over but is insulated from a semiconductor body region. A first layer of insulating material is formed over the gate electrode and the semiconductor body region. A second layer of insulating material different from the first layer of insulating material is formed over the first layer of insulating material. Only the second layer of insulating material is etched to form spacers along the side-walls of the gate electrode. Impurities are implanted through the first layer of insulating material to form a source region and a drain region in the body region. A substantial portion of those portions of the first layer of insulting material extending over the source and drain regions is removed.

Abstract: A learning system with augmented reality is provided. The learning system includes a cloud server recording an operation history of a learner and providing feedback messages, and a mobile device having an image-capturing module capturing an image of a substantial object. Also, the learning system comprises an object database storing a simulated object corresponding to the substantial object, an identification module identifying the image and generating image information, and a processing module which receives and analyzes the image information, obtains the simulated object from the object database according to analyzing results, and displays the simulated object on a display interface of the mobile device. The learning system allows learner to operate simulated object operation instructions on the display interface or directly operate the substantial object to control a display status of the simulated object, and the operation history of learner is transmitted to the cloud server.

Abstract: A portable electrical device with heat dissipation mechanism includes a housing with an acoustic hole, an earphone receptacle with a earphone hole, and two fans. The earphone receptacle and the fans are disposed in the housing. The fans are respectively located adjacent to the acoustic hole and the earphone hole, and generate airflow passing through the acoustic hole and the earphone hole. Thus, the portable electrical device dissipating heat utilizes the holes existing on the housing, without additional heat-dissipation holes.

Abstract: A method of making a semiconductor device including forming a first adhesion layer over a substrate. The method further includes forming a second adhesion layer over the first adhesion layer, where the second adhesion layer is formed using an inert gas with a first flow rate under a first RF power. Additionally, the method includes forming a low-k dielectric layer over the second adhesion layer, where the low-k dielectric layer is formed using the inert gas with a second flow rate under a second RF power under at least one of the following two conditions: 1) the second flow rate is different from the first flow rate; or 2) the second RF power is different from the first RF power. Furthermore, the method includes forming an opening in the dielectric layer, the second adhesion layer, and the first adhesion layer. Additionally, the method includes forming a conductor in the opening.

Abstract: An intraocular pressure detecting device includes an image capturing unit, a processor, and a pressure detection unit. The image capturing unit, coupled to the image capturing unit, is capable of acquiring an eye image. According to the eye image, the processor can determine an intraocular pressure detection area. After the pressure detection unit detects the intraocular pressure detection area, the intraocular pressure is calculated by the processor of the intraocular pressure detecting device.

Abstract: The invention provides a heat-dissipating system and a control method thereof. The heat-dissipating system has a plurality of fans and is configured for adjusting rotation-speeds of the fans. The control method includes following steps: obtaining a plurality of rotation-speed values of the fans; computing out a rotation-speed reference value according to the rotation-speed values; when the rotation-speed reference value is greater than a first threshold value, decreasing the rotation-speeds of the fans through a corresponding fan control signal; when the rotation-speed reference value is less than a second threshold value, increasing the rotation-speeds of the fans through the corresponding fan control signal.

Abstract: The invention provides an optical touch apparatus. The optical touch apparatus includes at least one optical path unit and at least one light sensing unit. The at least one optical path unit is located on a first side of a display unit of the optical touch apparatus and used to receive at least one directional incident light, the at least one directional incident light is focused to form an image in an imaging region through at least one refraction in the at least one optical path unit. The at least one light sensing unit is located at a relative position of the at least one optical path unit, and used to generate a sensing result according to the image in the imaging region.

Abstract: A heat dissipating system is disclosed to be disposed in a casing of an electronic apparatus in which a heat source is disposed. The heat dissipating system includes a heat dissipating device and a heat insulating device. The heat dissipating device is in contact with the heat source and has a predetermined heat dissipating path for dissipating heat generated by the heat source. The heat insulating device includes a first layer that is in contact with one of the heat source and the heat dissipating device, and a second layer that is bonded to the first layer and that cooperates with the first layer to define an evacuated space therebetween.

Abstract: A Ultra-Violet (UV) treatment is performed on an exposed surface of a low-k dielectric layer and an exposed surface of a metal line. After the UV treatment, an organo-metallic soak process is performed on the exposed surface of the low-k dielectric layer and the exposed surface of the metal line. The organo-metallic soak process is performed using a process gas including a metal bonded to an organic group.