Abstract: A semiconductor power device includes a ceramic-metal composite circuit substrate, a flip chip and a metal thermal-conducting layer. The ceramic-metal composite circuit substrate includes first electric-conducting metal pads and a first thermal-conducting metal pad. The first thermal-conducting metal pad is not electrically connected to the first electric-conducting metal pads. The flip chip includes electric-conducting pads and a floating thermal-conducting metal pad. The electric-conducting pads are electrically connected to the first electric-conducting metal pads. The floating thermal-conducting metal pad is not electrically connected to the electric-conducting pads. The metal thermal-conducting layer is disposed on the flip chip.

Abstract: A fan-out semiconductor device includes stacked semiconductor dies having die bond pads arranged in columns exposed at a sidewall of the stacked semiconductor dies. The stacked dies are encapsulated in a photo imageable dielectric (PID) material, which is developed to form through-hole cavities that expose the columns of bond pads of each die at the sidewall. The through-hole cavities are plated or filled with an electrical conductor to form conductive through-holes coupling die bond pads within the columns to each other.

Abstract: A semiconductor device with dual side source/drain (S/D) contact structures and a method of fabricating the same are disclosed. The method includes forming a fin structure on a substrate, forming a superlattice structure on the fin structure, forming first and second S/D regions within the superlattice structure, forming a gate structure between the first and second S/D regions, forming first and second contact structures on first surfaces of the first and second S/D regions, and forming a third contact structure, on a second surface of the first S/D region, with a work function metal (WFM) silicide layer and a dual metal liner. The second surface is opposite to the first surface of the first S/D region and the WFM silicide layer has a work function value closer to a conduction band energy than a valence band energy of a material of the first S/D region.

Abstract: A supported metallocene catalyst includes a carrier and a metallocene component. The carrier includes an inorganic oxide particle and an alkyl aluminoxane material. The inorganic oxide particle includes at least one inorganic oxide compound selected from the group consisting of an oxide of Group 3A and an oxide of Group 4A. The alkyl aluminoxane material includes an alkyl aluminoxane compound and an alkyl aluminum compound that is present in amount ranging from greater than 0.01 wt % to less than 14 wt % base on 100 wt % of the alkyl aluminoxane material. The metallocene component is supported on the carrier, and includes one of a metallocene compound containing a metal from Group 3B, a metallocene compound containing a metal from Group 4B, and a combination thereof. A method for preparing the supported metallocene catalyst and a method for preparing polyolefin using the supported metallocene catalyst are also disclosed.

Abstract: The disclosure provides a power management method. The power management method is applicable to an electronic device. The electronic device is electrically coupled to an adapter, and includes a system and a battery. The adapter has a feed power. The battery has a discharge power. The power management method of the disclosure includes: reading a power value of the battery; determining a state of the system; and discharging power to the system, when the system is in a power-on state and the power value is greater than a charging stopping value, by using the battery, and controlling, according to the discharge power and the feed power, the adapter to selectively supply power to the system. The disclosure further provides an electronic device using the power management method.

Abstract: A power converter having a multi-slope compensation mechanism is provided. A multi-slope compensation circuit of the power converter includes a plurality of first capacitors, a comparator and a plurality of first resistors. A first terminal of each of the plurality of first capacitors and a node between a second terminal of a high-side switch and a first terminal of a low-side switch are connected to an inductor. A plurality of first input terminals of a comparator are respectively connected to second terminals of the plurality of first capacitors, and are respectively connected to first terminals of the plurality of first resistors. Second terminals of the plurality of first resistors are coupled to a second reference voltage. A second input terminal of the comparator is coupled to a first reference voltage. An output terminal of the comparator is connected to an input terminal of a driver circuit.

Abstract: A power chip package and a power module are provided. The power chip package includes a metal cover, a power chip, and a thermal conductive material. A recess is formed on a side surface of the metal cover. The power chip is bonded on the metal cover and is located in the recess. The thermal conductive material fills the recess and surrounds the power chip. At least one first electrode of the power chip is exposed out of the thermal conductive material. The power module includes a circuit board, plural power chip packages and a polymeric resin. The power chip packages are disposed on the circuit board. The polymeric resin packages the power chip packages on the circuit board.

Abstract: A semiconductor component is provided in the present invention. The semiconductor component includes a substrate, a semiconductor working layer disposed on the substrate, an insulating layer disposed on an upper surface of the semiconductor working layer, plural conducting electrodes, and at least a metal layer floated on the upper surface of the semiconductor working layer and within the insulating layer. The conducting electrodes include plural working electrodes disposed within the insulating layer and plural connecting electrodes disposed over the upper surface of the semiconductor working layer. By floating the at least a metal layer on the semiconductor working layer and controlling occupied area of the metal layer and the conducting electrodes on the upper surface of the semiconductor working layer, heat dissipation performance of the semiconductor component can be effectively increased.

Abstract: A backlight module includes a light source array, a reflector module, and an optical film. The light source array includes a plurality of light sources. The light emitted from the light source can be refracted by the lens unit to obtain a specific light-output angle and uniformity. The reflector module includes a plurality of reflector units. Each reflector unit includes a flat portion, a first wall portion, and a corner wall portion, which have structures and arrangements designed to enable the light source to achieve a display effect of less shadows and better contrast.

Abstract: A display apparatus including a circuit substrate, a plurality of light-emitting elements, an optical film, and an adhesive layer is provided. These light-emitting elements are electrically bonded to the circuit substrate. The optical film overlaps the light-emitting elements. The light-emitting elements are disposed between the optical film and the circuit substrate. The adhesive layer is disposed between the optical film and the circuit substrate, and connects the light-emitting elements and the optical film. A cavity is provided between the light-emitting elements, the circuit substrate, and the adhesive layer.

Abstract: A backlight module includes a light source array, a reflector module, and an optical film. The light source array includes a plurality of light sources. The light emitted from the light source can be refracted by the lens unit to obtain a specific light-output angle and uniformity. The reflector module includes a plurality of reflector units. Each reflector unit includes a flat portion, a first wall portion, and a corner wall portion, which have structures and arrangements designed to enable the light source to achieve a display effect of less shadows and better contrast.

Abstract: A display apparatus including a circuit substrate, a plurality of light-emitting elements, an optical film, and an adhesive layer is provided. These light-emitting elements are electrically bonded to the circuit substrate. The optical film overlaps the light-emitting elements. The light-emitting elements are disposed between the optical film and the circuit substrate. The adhesive layer is disposed between the optical film and the circuit substrate, and connects the light-emitting elements and the optical film. A cavity is provided between the light-emitting elements, the circuit substrate, and the adhesive layer.

Abstract: A sealing structure is provided. The sealing structure is adapted to be disposed in an opening. The sealing structure includes a moveable block, a deformable bracket and an elastic member. When the moveable block is moved in a first direction, the deformable bracket pushes the elastic member, and the elastic member is deformed in a second direction and abuts the opening to seal the opening. The sealing structure is disposed in the opening to create a seal.

Abstract: A display module includes a backlight module, a liquid crystal layer disposed on the backlight module, and a first light-expanding layer disposed on the liquid crystal layer. The backlight module provides a surface light source. The surface light source forms an image light through the liquid crystal layer, and the first light-expanding layer increases the viewing angle range of the image light along a first direction. The first light-expanding layer substantially extends along a virtual plane, the first direction is perpendicular to the normal of the virtual plane, and a second direction is perpendicular to the first direction and the normal of the virtual plane. The light intensity at the 60-degree viewing angle of the surface light source along the first direction is lower than the light intensity at the 60-degree viewing angle of the surface light source along the second direction.

Abstract: A display device includes a display panel and a backlight module disposed under the display panel. The display panel has a display area and a light-blocking layer disposed around the display area. The backlight module includes a plurality of light sources, a reflector disposed corresponding to the light sources, an optical modulation film disposed above the light sources and the reflector, a diffusion member sandwiched between the reflector and the optical modulation film, and a diffusion plate disposed on one side of the optical modulation film opposite to the diffusion member, wherein the optical modulation film is sandwiched between the diffusion plate and the diffusion member, and the diffusion member has a transmittance of 65%˜85%.

Abstract: A display module includes a backlight module, a liquid crystal layer disposed on the backlight module, and a first light-expanding layer disposed on the liquid crystal layer. The backlight module provides a surface light source. The surface light source forms an image light through the liquid crystal layer, and the first light-expanding layer increases the viewing angle range of the image light along a first direction. The first light-expanding layer substantially extends along a virtual plane, the first direction is perpendicular to the normal of the virtual plane, and a second direction is perpendicular to the first direction and the normal of the virtual plane. The light intensity at the 60-degree viewing angle of the surface light source along the first direction is lower than the light intensity at the 60-degree viewing angle of the surface light source along the second direction.

Abstract: A manufacturing method of a light-emitting device is provided. A substrate and a light-emitting component disposed on the substrate are provided. A translucent layer is provided. The translucent layer is connected with the light-emitting component by an adhesive layer. A reflective layer is formed above the substrate, wherein the reflective layer covers a lateral surface of the light-emitting component, a lateral surface of the adhesive layer and a lateral surface of the translucent layer. A translucent encapsulant is formed on the substrate to encapsulate the light-emitting component, the translucent layer and the reflective layer.

Abstract: A backlight module including a light output module, a first prism sheet, and a second prism sheet is provided. The light output module has a light output surface. The first prism sheet is disposed on the light output surface of the light output module. The first prism sheet has a plurality of first prism structures extending in a first extending direction. The second prism sheet is disposed on the first prism sheet. The second prism sheet has a plurality of second prism structures extending in a second extending direction. The angle between the first extending direction and the second extending direction is less than or equal to 30 degrees.

Abstract: A backlight module including a light output module, a first prism sheet, and a second prism sheet is provided. The light output module has a light output surface. The first prism sheet is disposed on the light output surface of the light output module. The first prism sheet has a plurality of first prism structures extending in a first extending direction. The second prism sheet is disposed on the first prism sheet. The second prism sheet has a plurality of second prism structures extending in a second extending direction. The angle between the first extending direction and the second extending direction is less than or equal to 30 degrees.

Abstract: The present invention provides a backlight module, including a bottom plate, a plurality of light sources disposed on the bottom plate, one or more light regulation devices, and an optical film. The light regulation device is disposed on the bottom plate and covers at least one light source. Light generated by the light source is emitted out to reach the light regulation device, and the light regulation device regulates the light. The optical film is disposed on a side, opposite to the light source, of the light regulation device.