Abstract: A display device includes a display panel and a backlight module disposed under the display panel. The display panel has a display area and a light-blocking layer disposed around the display area. The backlight module includes a plurality of light sources, a reflector disposed corresponding to the light sources, an optical modulation film disposed above the light sources and the reflector, a diffusion member sandwiched between the reflector and the optical modulation film, and a diffusion plate disposed on one side of the optical modulation film opposite to the diffusion member, wherein the optical modulation film is sandwiched between the diffusion plate and the diffusion member, and the diffusion member has a transmittance of 65%˜85%.

Abstract: A light-emitting device includes a substrate, a light-emitting component, a translucent layer, an adhesive layer, a reflective layer and translucent encapsulant. The light-emitting component is disposed on the substrate. The adhesive layer is formed between the light-emitting component and the translucent layer. The reflective layer is formed above the substrate and covering a lateral surface of the light-emitting component, a lateral surface of the adhesive layer and a lateral surface of the translucent layer. The translucent encapsulant is formed on the substrate and encapsulating the light-emitting component, the translucent layer and the reflective layer.

Abstract: A light-emitting device includes a substrate, a light-emitting component, a translucent layer, an adhesive layer, a reflective layer and translucent encapsulant. The light-emitting component is disposed on the substrate. The adhesive layer is formed between the light-emitting component and the translucent layer. The reflective layer is formed above the substrate and covering a lateral surface of the light-emitting component, a lateral surface of the adhesive layer and a lateral surface of the translucent layer. The translucent encapsulant is formed on the substrate and encapsulating the light-emitting component, the translucent layer and the reflective layer.

Abstract: A calibration method for blood glucose of blood sample comprises the following steps: applying a first voltage to a blood sample to obtain an original level of blood glucose of the blood sample; applying a second voltage to a blood sample to obtain a hematocrit index of the blood sample; and processing the hematocrit index and calibrating the original level of blood glucose of the blood sample. The absolute value of the first voltage is lower than 1 volt and is not equal to 0 volt. The absolute value of the second voltage is higher than or equal to 1 volt. A sensing current corresponding to the original blood level and the hematocrit index corresponding to blood sample are obtained by applying at least two-stage voltages in the specific range to the blood sample, thereby calibrating the original blood glucose according to the hematocrit index.

Abstract: An electrochemical test strip is provided, including a substrate, an electrode structure and an insulative film. The electrode structure is formed on the substrate, including a first electrode and a second electrode. The second electrode includes a first end, a second end, an extension portion, and a bent portion. The extension portion connects the first end with the bent portion, and the bent portion is connected to the second end. The extension portion and the first electrode define a space therebetween for receiving the bent portion. The insulative film covers at least a part of the electrode structure and forms an opening. A sample fluid enters the electrochemical test strip through the opening, and the sample fluid sequentially contacts the first electrode and the second electrode.

Abstract: A calibration method for blood glucose of blood sample comprises the following steps: applying a first voltage to a blood sample to obtain an original level of blood glucose of the blood sample; applying a second voltage to a blood sample to obtain a hematocrit index of the blood sample; and processing the hematocrit index and calibrating the original level of blood glucose of the blood sample. The absolute value of the first voltage is lower than 1 volt and is not equal to 0 volt. The absolute value of the second voltage is higher than or equal to 1 volt. A sensing current corresponding to the original blood level and the hematocrit index corresponding to blood sample are obtained by applying at least two-stage voltages in the specific range to the blood sample, thereby calibrating the original blood glucose according to the hematocrit index.

Abstract: A light source module and a backlight module therewith are disclosed. The light source includes a circuit board and a light-emitting diode disposed on the circuit board. The light-emitting diode includes a package unit and a conductive support. The package unit includes an insulation housing, a heat-dissipating support embedded in the insulation housing, and a light-emitting diode chip disposed on the heat-dissipating support and encapsulated by the insulation housing. The light-emitting diode chip includes two electrodes, which are isolated form the heat-dissipating support. The insulation housing thereon defines a light-out surface. The conductive support is disposed on an exterior side surface of the insulation housing and connected to the heat-dissipating support to protrude out the light-out surface.

Abstract: A backlight module includes a back plate, a plurality of lamps, a lamp fixing base, and a diffusion plate. The back plate has a cavity. The lamps are disposed on or above the back plate. The lamp fixing base is disposed on the back plate for fixing the lamps. The lamp fixing base has a supporting portion extending along a direction away from the back plate. An orthogonal projection of the supporting portion on the back plate is within a boundary of the cavity. The diffusion plate is disposed above or over the back plate, and the supporting portion is suitable for supporting the diffusion plate.

Abstract: A light source module and a backlight module therewith are disclosed. The light source include includes a circuit board and a light-emitting diode disposed on the circuit board. The light-emitting diode includes a package unit and a conductive support. The package unit includes an insulation housing, a heat-dissipating support embedded in the insulation housing, and a light-emitting diode chip disposed on the heat-dissipating support and encapsulated by the insulation housing. The light-emitting diode chip includes two electrodes, which are isolated form the heat-dissipating support. The insulation housing thereon defines a light-out surface. The conductive support is disposed on an exterior side surface of the insulation housing and connected to the heat-dissipating support to protrude out the light-out surface.

Abstract: An edge-type backlight module includes a light guide plate and at least one linear light source. The light guide plate has at least one light-incident sidewall, and the linear light source is substantially parallel to the light-incident sidewall. The linear light source includes a carrier and a plurality of solid-state light-emitting devices. The carrier is equally divided into a first, a second, a third, a fourth, and a fifth device mounting regions sequentially arranged along an extending direction of the carrier. The solid-state light-emitting devices are mounted on the device mounting regions and electrically connected to the carrier. An arrangement pitch of the solid-state light-emitting devices on the fourth device mounting region of the device mounting regions is greater than an arrangement pitch of the solid-state light-emitting devices on the other four device mounting regions.

Abstract: A backlight module includes a back plate, a plurality of lamps, a lamp fixing base, and a diffusion plate. The back plate has a cavity. The lamps are disposed on or above the back plate. The lamp fixing base is disposed on the back plate for fixing the lamps. The lamp fixing base has a supporting portion extending along a direction away from the back plate. An orthogonal projection of the supporting portion on the back plate is within a boundary of the cavity. The diffusion plate is disposed above or over the back plate, and the supporting portion is suitable for supporting the diffusion plate.

Abstract: A method for manufacturing a semiconductor device includes: forming a protrusion-patterned layer on a substrate, the protrusion-patterned layer including a plurality of separated protrusions, each of which includes a base portion formed on the substrate and a top end portion opposite to the base portion; laterally growing a base layer on the top end portions of the protrusions of the protrusion-patterned layer in such a manner that each of the top end portions is covered by the base layer and that the base layer cooperates with the protrusions to define a plurality of cavities thereamong; thickening the base layer to a predetermined layer thickness; and separating the base layer from the substrate by destroying the protrusions of the protrusion-patterned layer.

Abstract: A white-light emitting semiconductor device includes a first light-emitting die, a second light-emitting die, a photostimulable luminescent substance, and a holding assembly. The first light-emitting die emits a first radiation having a first wavelength range. The second light-emitting die emits a second radiation having a second wavelength range, and a third radiation having a third wavelength range different from the second wavelength range. The photostimulable luminescent substance is excitable to emit a fourth radiation having a fourth wavelength range. The fourth radiation is mixed with the first, second, and third radiations to result in white light. The holding assembly holds the first and second light-emitting dies, and the photostimulable luminescent substance.

Abstract: A white-light emitting device includes a first die and a second die. The first die has a first semiconductor light-emitting layer emitting a first primary color light. The second die has a second semiconductor light-emitting layer emitting a second primary color light, and a third semiconductor light-emitting layer mounted proximate to the second semiconductor light-emitting layer and emitting a third primary color light. The first primary color light is combined with the second and third primary color lights so as to produce white light.

Abstract: A method for manufacturing a semiconductor substrate includes: (a) forming a protrusion-patterned layer on an epitaxial substrate, the protrusion-patterned layer including a plurality of separated protrusions, each of which includes a top end portion distal from the epitaxial substrate; (b) laterally growing a base layer on the top end portions of the protrusions of the protrusion-patterned layer to a predetermined layer thickness under an epitaxial temperature higher than room temperature in such a manner that each of the top end portions is covered by the base layer and that the base layer cooperates with the protrusions to define a plurality of cavities thereamong; and (c) separating the base layer from the epitaxial substrate by destroying the protrusions of the protrusion-patterned layer.

Abstract: A light emitting device includes a die and a photostimulable luminescent substance. The die has a first semiconductor light-emitting layer emitting a first color light having a first wavelength range, and a second semiconductor light-emitting layer emitting a second color light having a second wavelength range different from the first wavelength range. The photostimulable luminescent substance is excitable by at least one of the first and second color lights to emit a third color light having a third wavelength range. The third color light is mixed with the first and second color lights to emit a light blend having a wavelength range covering the first, second, and third wavelength ranges.

Abstract: The present invention relates to a single-chip light-emitting diode (LED) with three luminescent spectrums of red, blue and green wavelengths. The single-chip light-emitting diode of the invention comprises a base, two conductive pins, a single-chip light-emitting element, a package material, and red fluorescent powder. The single-chip light-emitting element is disposed on the base and electrically connected to the two conductive pins. The red fluorescent powder is added to the package material. The single-chip light-emitting element comprises a substrate, an N-type cladding layer, a P-type cladding layer, at least one green light-emitting layer, and at least one blue light-emitting layer. The green light-emitting and blue light-emitting layers are formed between the N-type cladding layer and the P-type cladding layer.

Abstract: The invention relates to a light-emitting element with porous light-emitting layers. The light-emitting element comprises: a substrate, a first conductive cladding layer, a second conductive cladding layer and at least one porous light-emitting layer. The porous light-emitting layer is formed between the first conductive cladding layer and the second conductive cladding layer, and has an upper barrier layer, a lower barrier layer and a carrier trap layer. The carrier trap layer positioned between the upper barrier layer and the lower barrier layer has a plurality of chevron structures for defining a plurality of valley shaped structures, and is an indium-containing nitride structure, the energy band gap of which is less than those of the upper barrier layer and the lower barrier layer.

Abstract: A dental floss applicator of this invention comprises a housing, a dental floss stick, a floss spool, a spring rack, a take-up wheel, and a rotary knob with a springy ratchet on the inside. The spring rack has a stop portion engaged with a gear wheel fastened to the floss spool to stretch the dental floss, and a press portion extending to the outside of the housing for pressing by the user to loosen the dental floss on the dental floss stick. The springy ratchet releases the stop portion of the spring rack step by step upon rotation of the rotary knob, allowing the used segment of the dental floss to be taken up.

Abstract: A single-chip white light emitting device, including: a substrate, a buffer layer, a first conductive cladding layer, a second conductive cladding layer, at least one broad-spectrum blue-complimentary light quantum dot emitting layer and at least one blue light emitting layer. The buffer layer is disposed over the substrate. The first conductive cladding layer is disposed over the buffer layer. The broad-spectrum blue-complimentary light quantum dot emitting layer is disposed between the first conductive cladding layer and the second conductive cladding layer. The blue-complimentary light quantum dot emitting layer includes plural quantum dots with an uneven character distribution, so as to increase FWHM of emission wavelength of the quantum dot emitting layer. The blue light emitting layers is disposed between the first and second conductive cladding layers, such that mixing of blue light and blue-complimentary light would generate white light.