Abstract: A polishing pad for a chemical-mechanical polishing apparatus includes a first support layer and a polishing layer. The polishing layer is present on the first support layer. The polishing layer has a top surface that faces away from the first support layer and at least one first cavity that is buried at least beneath the top surface of the polishing layer.

Abstract: A method for wafer pod handling includes at least the following steps. A wafer pod is moved into a load chamber by conveying the wafer pod to the load chamber via one side of a track and removing a cover of the load chamber via an opposing side of the track. The wafer pod that is inside the load chamber is coupled to a port of a platform that is linked to the load chamber. A wafer to be processed is moved from the wafer pod and out of the load chamber to the platform for performing a semiconductor process. Other methods for wafer pod handling are also provided.

Abstract: A method for wafer pod handling includes at least the following steps. A wafer pod is moved into a load chamber by conveying the wafer pod to the load chamber via one side of a track and removing a cover of the load chamber via an opposing side of the track. The wafer pod that is inside the load chamber is coupled to a port of a platform that is linked to the load chamber. A wafer to be processed is moved from the wafer pod and out of the load chamber to the platform for performing a semiconductor process. Other methods for wafer pod handling are also provided.

Abstract: A semiconductor processing station including a platform, a load port, and a carrier transport track is provided. The platform includes an intake/outtake port and a plurality of processing modules. The load port includes a load chamber, a movable cover, and a carrier transfer module. The load chamber communicates with the intake/outtake port and has a load opening at its top end for receiving a transport carrier within the load chamber. The movable cover is disposed at the load opening and configured to seal the load opening. The carrier transfer module is configured to transfer the transport carrier to the intake/outtake port. The carrier transport track has a bottom side configured to open the load chamber.

Abstract: A semiconductor processing station including a platform, a load port, and a carrier transport track is provided. The platform includes an intake/outtake port and a plurality of processing modules. The load port includes a load chamber, a movable cover, and a carrier transfer module. The load chamber communicates with the intake/outtake port and has a load opening at its top end for receiving a transport carrier within the load chamber. The movable cover is disposed at the load opening and configured to seal the load opening. The carrier transfer module is configured to transfer the transport carrier to the intake/outtake port. The carrier transport track has a bottom side configured to open the load chamber.

Abstract: A semiconductor processing station comprises a platform and a load port, wherein the platform includes an intake/outtake port and a plurality of processing modules. The load port includes a load chamber, a movable cover and a carrier transfer module. The load chamber communicates with the intake/outtake port and has a load opening at its top end for receiving a transport carrier within the load chamber. The movable cover is disposed at the load opening and is configured to seal the load opening. The carrier transfer module is configured to transfer the transport carrier to the intake/outtake port. A semiconductor process and a method of operating a semiconductor processing station are also provided.

Abstract: A polishing pad for a chemical-mechanical polishing apparatus includes a first support layer and a polishing layer. The polishing layer is present on the first support layer. The polishing layer has a top surface that faces away from the first support layer and at least one first cavity that is buried at least beneath the top surface of the polishing layer.

Abstract: A polishing pad for a chemical-mechanical polishing apparatus includes a first support layer and a polishing layer. The polishing layer is present on the first support layer. The polishing layer has a top surface that faces away from the first support layer and at least one first cavity that is buried at least beneath the top surface of the polishing layer.

Abstract: A semiconductor processing station comprises a platform and a load port, wherein the platform includes an intake/outtake port and a plurality of processing modules. The load port includes a load chamber, a movable cover and a carrier transfer module. The load chamber communicates with the intake/outtake port and has a load opening at its top end for receiving a transport carrier within the load chamber. The movable cover is disposed at the load opening and is configured to seal the load opening. The carrier transfer module is configured to transfer the transport carrier to the intake/outtake port. A semiconductor process and a method of operating a semiconductor processing station are also provided.

Abstract: A polishing pad for a chemical-mechanical polishing apparatus includes a first support layer and a polishing layer. The polishing layer is present on the first support layer. The polishing layer has a top surface that faces away from the first support layer and at least one first cavity that is buried at least beneath the top surface of the polishing layer.

Abstract: Disclosed is a method and a system for measuring customer delivery service. A projected customer delivery date is generated. At least one projected output volume is determined based on the projected customer delivery date. At least one actual output volume is determined, and an accuracy of the projected customer delivery date is determined based on the at least one projected output volume and the at least one actual output volume.

Abstract: Disclosed is a method and a system for measuring customer delivery service. A projected customer delivery date is generated. At least one projected output volume is determined based on the projected customer delivery date. At least one actual output volume is determined, and an accuracy of the projected customer delivery date is determined based on the at least one projected output volume and the at least one actual output volume.