Abstract: The present invention relates to a coating process and a process system for a cable, and a cable manufactured thereby. The process includes: (1) providing the cable; (2) transporting the cable into immersion device, the cable immerged in first solution to form first coating layer thereon; (3) transporting the cable out of the immersion; (4) transporting the cable into coating device through third wire die, the cable immerged in second solution to form second coating layer thereon, the second layer is attached to the cable through the first layer; (5) transporting the cable out of the coating device through fourth wire die, fourth aperture diameter of the fourth wire die is larger than third aperture diameter of the third wire die; and (6) heating the cable to cure the second coating layer. The system includes: a cable providing device; an immersion device; a coating device; and a heating device.

Abstract: A system and method that improves and enhances the quality of step-scan Fourier Transform Infrared spectroscopy data. The system and method enables the removal of dark voltage with greater accuracy, provides access to previously unobtainable IR spectral information data which is amplified by the disclosed system and method. The system and method removes dark interferogram voltage from an interferogram of interest obtained during nanosecond or microsecond step-scan measurement. The system and method includes a programmable high gain setting to amplify both signal and noise into the analog-to-digital quantization range to allow signal averaging for obtaining additional bits of resolution. The system and method also accounts for and corrects intrinsic offset voltages introduced by the electronics of the disclosed system.

Abstract: A system and method that improves and enhances the quality of step-scan Fourier Transform Infrared spectroscopy data. The system and method enables the removal of dark voltage with greater accuracy, provides access to previously unobtainable IR spectral information data which is amplified by the disclosed system and method. The system and method removes dark interferogram voltage from an interferogram of interest obtained during nanosecond or microsecond step-scan measurement. The system and method includes a programmable high gain setting to amplify both signal and noise into the analog-to-digital quantization range to allow signal averaging for obtaining additional bits of resolution. The system and method also accounts for and corrects intrinsic offset voltages introduced by the electronics of the disclosed system.

Abstract: In one embodiment a varistor may include a ceramic body. The varistor may further comprise a multilayer coating disposed around the ceramic body. The multilayer coating may include an outer layer comprising an epoxy material. The multilayer coating may also include an inner layer that is adjacent the ceramic body and is disposed between the outer layer and the ceramic body. The inner layer may comprise a polymeric material that is composed of an acrylic component.

Abstract: A sorting apparatus for sorting screws includes a first restricting piece, a second restricting piece, and a diversion block. A first pathway is defined between the first restricting piece and the second restricting piece. A second pathway is defined between the first restricting piece and the diversion block. A fourth pathway is defined between the second restricting piece and the diversion block. The first blocking piece is located in the second pathway adjacent to the first pathway. The first blocking piece blocks a long screw to prevent the long screw from sliding from the first pathway to the second pathway and guides the long screw to slide from the first pathway to the fourth pathway. The first blocking piece lets a short screw slide from the first pathway to the second pathway.

Abstract: A keyboard assembly includes a keyboard, two latching structures, and a data cable. The keyboard includes a bottom plate. Each latching structure is located on the bottom plate and includes a positioning post and a latching strip. The positioning post is located on the bottom plate, and the latching strip extends from the positioning post. The data cable is wrapped around the positioning posts to prevent the data cable from extending too long out of the keyboard.

Abstract: An electronic device assembly includes an electronic device, an internal heat dissipating mechanism, an external heat dissipating mechanism, and the heat dissipating mechanism. The electronic device includes a bottom base, and the internal heat dissipating mechanism is secured inside the bottom base, to dissipate heat generated by the electronic device. The external heat dissipating mechanism is secured outside the bottom base. The heat conduction block is secured to the internal heat dissipating mechanism and contacts with the external heat dissipating mechanism. The heat conduction block directs heat from the internal heat dissipating mechanism, and the external heat dissipating mechanism directs heat from the heat conduction block, to increase the heat dissipating efficiency of the internal heat dissipating mechanism, to make the electronic device work in a proper temperature.

Abstract: A circuit board assembly includes a circuit board, a heat dissipating apparatus, and a support member. The heat dissipating apparatus and the support member are attached to opposite sides of the circuit board. The support member helps the circuit board to support the heat dissipating apparatus. A plurality of mounting holes is defined in the circuit board. Each of the plurality of mounting holes includes a mounting portion and a limiting portion narrower than the mounting portion. The support member includes a plurality of taper-shaped mounting posts for engaging with the plurality of mounting holes. When the mounting post is engaged with the mounting portion, the support member is located at an unlatched position where the support member is disengageable from the circuit board. When the mounting post is engaged with the limiting portion, the support member is located at a latched position and secured to the circuit board.

Abstract: A circuit board assembly includes a circuit board and a bracket of a heat sink. The bracket of the heat sink includes a pair of first securing feet and a pair of second securing feet opposite to the pair of first securing feet. A pair of first securing members is secured to the circuit board. A pair of second securing members is secured to the circuit board facing the pair of first securing members. The pair of first securing members includes a pair of elastic pieces which faces the pair of second securing members. The pair of first securing feet abuts against the pair of elastic pieces to elastically deform the pair of elastic pieces. The pair of elastic pieces exerts force on the bracket to push the pair of second securing feet to abut against the pair of second securing members.

Abstract: An electronic device includes a circuit board and a heat sink . A heat generating part is located on the circuit board. Through holes are defined in the circuit board. The heat sink includes a main body and resilient pieces located on the main body. The resilient pieces includes a latching portion and a resisting portion located on the latching portion. The latching portion extends through the through hole to engage with the circuit board. The resisting portion is received in the through hole and abuts the circuit board. The main body closely abuts the heat generating part. The latching portion can be disengaged from the circuit board simply by squeezing the resisting portion.

Abstract: An electronic device includes a circuit board and a heat dissipating module. The circuit board includes a body and a first heat generating part located on the body. The body defines a through hole close to the first heat generating part. The heat dissipating module includes a heat pipe, a first heat dissipating piece attached to the heat pipe and a resilient piece. The resilient piece includes a securing portion secured to the first heat dissipating piece and a resilient arm. The resilient arm is engaged in the through hole to secure the first heat dissipating piece to the body. The first heat dissipating piece abuts the first heat generating part, and the resilient arm is elastically deformable to disengage from the through hole.