Patents by Inventor Cheng-Hsien Kuo
Cheng-Hsien Kuo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8531845Abstract: A structure of an anti tamper case for the solid state disk includes an upper housing and a lower housing. The upper housing has an extending portion formed respectively on the two sides of the flange. The extending portion has at least one opening. The lower housing corresponds to the upper housing and a space is formed there-between for receiving the solid state disk. The lower housing has a hook formed at the flange corresponding to the opening. The hook and the opening are buckled to each other. The hook will be broken by the flange in the opening when the upper and lower housings are separated, thus prevent the user from forcefully opening the case for self maintenance or internal component replacement.Type: GrantFiled: March 29, 2011Date of Patent: September 10, 2013Assignee: Comptake Technology Inc.Inventors: Wei-Hau Chen, Chen-Chia Pai, Tien-Chen Huang, Cheng-Hsien Kuo
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Patent number: 8411443Abstract: A heat-dissipating assembly includes a first heat-dissipating body and a second heat-dissipating body adhered to two sides of the memory. The bottom edge of the first heat-dissipating body has a first supporting piece and first engaging pieces comprising a first stopping section and a first insertion section. The bottom edge of the second heat-dissipating body has a second supporting piece and second engaging pieces comprising a second stopping section and a second insertion section. The second insertion section extends toward the first insertion section. The first insertion section is slidingly disposed inside the second stopping section. The second insertion is slidingly disposed inside the first stopping section. The first stopping section abuts against the second stopping section, so that the first engaging piece and the second engaging piece are slidingly engaged with each other.Type: GrantFiled: January 21, 2011Date of Patent: April 2, 2013Assignee: Comptake Technology Inc.Inventors: Wei-Hau Chen, Tien-Chen Huang, Cheng-Hsien Kuo, Hsiao-Jung Lin
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Publication number: 20120250271Abstract: A structure of an anti tamper case for the solid state disk includes an upper housing and a lower housing. The upper housing has an extending portion formed respectively on the two sides of the flange. The extending portion has at least one opening. The lower housing corresponds to the upper housing and a space is formed there-between for receiving the solid state disk. The lower housing has a hook formed at the flange corresponding to the opening. The hook and the opening are buckled to each other. The hook will be broken by the flange in the opening when the upper and lower housings are separated, thus prevent the user from forcefully opening the case for self maintenance or internal component replacement.Type: ApplicationFiled: March 29, 2011Publication date: October 4, 2012Inventors: Wei-Hau Chen, Chen-Chia Pai, Tien-Chen Huang, Cheng-Hsien Kuo
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Publication number: 20120188707Abstract: A heat-dissipating assembly includes a first heat-dissipating body and a second heat-dissipating body adhered to two sides of the memory. The bottom edge of the first heat-dissipating body has a first supporting piece and first engaging pieces comprising a first stopping section and a first insertion section. The bottom edge of the second heat-dissipating body has a second supporting piece and second engaging pieces comprising a second stopping section and a second insertion section. The second insertion section extends toward the first insertion section. The first insertion section is slidingly disposed inside the second stopping section. The second insertion is slidingly disposed inside the first stopping section. The first stopping section abuts against the second stopping section, so that the first engaging piece and the second engaging piece are slidingly engaged with each other.Type: ApplicationFiled: January 21, 2011Publication date: July 26, 2012Inventors: Wei-Hau CHEN, Tien-Chen Huang, Cheng-Hsien Kuo, Hsiao-Jung Lin
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Publication number: 20080143008Abstract: A molding apparatus includes a die set having a chamber, a vacuum pump communicated to the chamber, and a feeding mechanism suited for supplying a molding material to the chamber of the die set with simultaneous extraction of gas out of the chamber by the vacuum pump.Type: ApplicationFiled: November 21, 2006Publication date: June 19, 2008Inventors: CHENG-HSIEN KUO, MING-JHY JIANG
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Patent number: 7230279Abstract: A memory card is provided. The memory card comprises a substrate, a plurality of electronic package devices, a molding compound and a plastic forming material. The substrate has at least a plurality of outer contacts and a plurality of inner contacts and the outer contacts are electrically connected to the inner contacts. The electronic package devices are located on the substrate and the electronic package devices electrically connect to the inner contacts, respectively. The molding compound is covering the electronic package devices and the corresponding inner contacts. The plastic forming material is covering the molding compound and the substrate, and the plastic forming material exposes the outer contacts.Type: GrantFiled: December 8, 2004Date of Patent: June 12, 2007Assignee: Advanced Flash Memory Card Technology Co., Ltd.Inventors: Cheng-Hsien Kuo, Ming-Jhy Jiang, Cheng-Kang Yu, Hui-Chuan Chuang
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Patent number: 7205644Abstract: A memory card structure comprising a substrate, a plurality of memory chips, some package material and an ultra-thin plastic shell is provided. To fabricate the memory card, a substrate having a first surface and a second surface is provided. The first surface has a plurality of outer contacts and the second surface has at least a cavity. There is a plurality of inner contacts around the cavity. Furthermore, the outer contacts and the inner contacts are electrically connected to each other. The memory chips are stacked up inside the cavity and electrically connected to the inner contacts of the substrate. Then, the memory chips and the inner contacts are encapsulated using the molding compound. Thereafter, the ultra-thin plastic shell is placed over the second surface and attached to the substrate. That portion of the ultra-thin plastic shell covering the memory chips has a thickness of about 0.1˜0.15 mm.Type: GrantFiled: December 8, 2004Date of Patent: April 17, 2007Assignee: Advanced Flash Memory Card Technology Co., Ltd.Inventors: Cheng-Hsien Kuo, Ming-Jhy Jiang, Cheng-Kang Yu, Hui-Chuan Chuang
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Patent number: 7193304Abstract: A memory card structure comprising a substrate, a plurality of memory chips, some molding compound and an ultra-thin plastic shell is provided. To fabricate the memory card, a substrate having a first surface and a second surface is provided. The first surface has a plurality of outer contacts and the second surface has a cavity and a plurality of inner contacts around the cavity. The outer contacts and the inner contacts are electrically connected to each other. The memory chips are stacked up in the same area inside the cavity. Furthermore, the memory chips are electrically connected to the inner contacts. Then, the memory chips and the inner contacts are encapsulated. Thereafter, the ultra-thin plastic shell is placed over the second surface and attached to the substrate. That portion of the ultra-thin plastic shell covering the memory chips has a thickness of about 0.1˜0.4 mm.Type: GrantFiled: December 8, 2004Date of Patent: March 20, 2007Assignee: Advanced Flash Memory Card Technology Co., Ltd.Inventors: Cheng-Hsien Kuo, Ming-Jhy Jiang, Cheng-Kang Yu, Hui-Chuan Chuang
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Publication number: 20060076662Abstract: A memory card structure comprising a substrate, a plurality of memory chips, some molding compound and an ultra-thin plastic shell is provided. To fabricate the memory card, a substrate having a first surface and a second surface is provided. The first surface has a plurality of outer contacts and the second surface has a cavity and a plurality of inner contacts around the cavity. The outer contacts and the inner contacts are electrically connected to each other. The memory chips are stacked up in the same area inside the cavity. Furthermore, the memory chips are electrically connected to the inner contacts. Then, the memory chips and the inner contacts are encapsulated. Thereafter, the ultra-thin plastic shell is placed over the second surface and attached to the substrate. That portion of the ultra-thin plastic shell covering the memory chips has a thickness of about 0.1˜0.4 mm.Type: ApplicationFiled: December 8, 2004Publication date: April 13, 2006Inventors: Cheng-Hsien Kuo, Ming-Jhy Jiang, Cheng-Kang Yu, Hui-Chuan Chuang
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Publication number: 20060077749Abstract: A memory card structure comprising a substrate, a plurality of memory chips, some package material and an ultra-thin plastic shell is provided. To fabricate the memory card, a substrate having a first surface and a second surface is provided. The first surface has a plurality of outer contacts and the second surface has at least a cavity. There is a plurality of inner contacts around the cavity. Furthermore, the outer contacts and the inner contacts are electrically connected to each other. The memory chips are stacked up inside the cavity and electrically connected to the inner contacts of the substrate. Then, the memory chips and the inner contacts are encapsulated using the molding compound. Thereafter, the ultra-thin plastic shell is placed over the second surface and attached to the substrate. That portion of the ultra-thin plastic shell covering the memory chips has a thickness of about 0.1˜0.15 mm.Type: ApplicationFiled: December 8, 2004Publication date: April 13, 2006Inventors: Cheng-Hsien Kuo, Ming-Jhy Jiang, Cheng-Kang Yu, Hui-Chuan Chuang
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Publication number: 20060071313Abstract: A memory card. The memory card comprises a substrate, a plurality of electronic package devices, a molding compound and a plastic forming material. The substrate has at least a plurality of outer contacts and a plurality of inner contacts and the outer contacts are electively connected to the inner contacts. The electronic package devices are located on the substrate and the electronic package devices electively connect to the inner contacts, respectively. The molding compound is covering the electronic package devices and the corresponding inner contacts. The plastic forming material is covering the molding compound and the substrate, and the plastic forming material exposes the outer contacts.Type: ApplicationFiled: December 8, 2004Publication date: April 6, 2006Inventors: Cheng-Hsien Kuo, Ming-Jhy Jiang, Cheng-Kang Yu, Hui-Chuan Chuang
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Publication number: 20050017392Abstract: A molding apparatus includes a die set having a chamber, a vacuum pump communicated to the chamber, and a feeding mechanism suited for supplying a molding material to the chamber of the die set with simultaneous extraction of gas out of the chamber by the vacuum pump.Type: ApplicationFiled: June 18, 2004Publication date: January 27, 2005Inventors: Cheng-Hsien Kuo, Ming-Jhy Jiang, Cheng-Kang Yu, Chih-Chen Huang
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Patent number: D626520Type: GrantFiled: March 23, 2010Date of Patent: November 2, 2010Assignee: Comptake Technology Inc.Inventors: Wei-Hau Chen, Shih-Her Chen, Cheng-Hsien Kuo
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Patent number: D626521Type: GrantFiled: March 23, 2010Date of Patent: November 2, 2010Assignee: CompTake Technology Inc.Inventors: Wei-Hau Chen, Cheng-Hsien Kuo, Shih-Her Chen
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Patent number: D659110Type: GrantFiled: March 23, 2010Date of Patent: May 8, 2012Assignee: ComTake Technology, Inc.Inventors: Wei-Hau Chen, Cheng-Hsien Kuo