Heat-dissipating device for memory

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Description

FIG. 1 is a perspective view of a heat-dissipating device for memory showing my new design wherein a portion of the device is shown separately for ease of illustration;

FIG. 2 is a front elevation view thereof;

FIG. 3 is a rear elevation view thereof;

FIG. 4 is a left side elevation view thereof;

FIG. 5 is a right side elevation view thereof;

FIG. 6 is a top plan view thereof;

FIG. 7 is a bottom plan view thereof;

FIG. 8 is an exploded perspective view of the heat dissipating device thereof; and,

FIG. 9 is a perspective view of the heat dissipating, device thereof.

The broken line showing of the environment is for illustrative purpose only and forms no part of the claimed design.

Claims

The ornamental design for an heat-dissipating device for memory, as shown and described.

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Patent History
Patent number: D659110
Type: Grant
Filed: Mar 23, 2010
Date of Patent: May 8, 2012
Assignee: ComTake Technology, Inc. (Taipei County)
Inventors: Wei-Hau Chen (Taishan Shiang), Cheng-Hsien Kuo (Taishan Shiang)
Primary Examiner: Selina Sikder
Attorney: Muncy, Geissler, Olds & Lowe, PLLC
Application Number: 29/358,133
Classifications
Current U.S. Class: Heat Sink (D13/179)