Abstract: The present disclosure provides a light emitting device. The light emitting device includes a substrate, and an array of light emitting units over the substrate. Each of the light emitting units includes a first electrode and an organic layer over the first electrode. The first electrode includes a bottom surface on the substrate, a top surface opposite to the bottom surface, and a sidewall between the bottom surface and the top surface. The organic layer at least partially covers the top surface and a meeting point of the top surface and the sidewall. The light emitting device also includes an array of bumps over the substrate, and a second electrode over the organic layer and the array of bumps. The array of light emitting units and the array of bumps are alternatively ordered. A method for manufacturing a light emitting device is also provided.

Abstract: The present disclosure provides a light emitting device. The light emitting device includes a substrate, and an array of light emitting units over the substrate. Each of the light emitting units includes a first electrode. The first electrode includes a bottom surface on the substrate, a top surface opposite to the bottom surface, and a sidewall between the bottom surface and the top surface. Each of the light emitting units further includes a second electrode over the first electrode and facing the top surface. Each of the light emitting units further includes an organic layer between the first electrode and the second electrode. The organic layer at least partially covers the top surface and a meeting point of the top surface and the sidewall. The organic layer is discontinuous among the light emitting units. A method for manufacturing a light emitting device is also provided.

Abstract: A light emitting device includes a substrate and a light emitting unit over the substrate. The light emitting unit includes a first electrode, an organic emissive layer over the first electrode, a first electron transportation layer over the organic emissive layer, and a metal-containing layer over the first transportation layer. An end of the first electron transportation layer meets the organic emissive layer and the metal-containing layer at a first meeting point, the organic emissive layer has an end which is close to the first meeting point meets the metal-containing layer at a second meeting point, the second meeting point is spaced apart from the first meeting point and away from the first electron transportation layer. Further, at least one of the first electron transportation layer and the metal-containing layer includes transitional metal or alkali metal.

Abstract: A method of manufacturing a light emitting device includes providing a substrate, forming a plurality of photosensitive bumps over the substrate, forming a photosensitive layer over the plurality of photosensitive bumps, forming a buffer layer between the photosensitive layer and the plurality of photosensitive bumps, patterning the photosensitive layer to form a recess through the photosensitive layer to expose a surface, disposing an organic emissive layer on the surface, forming a metal containing layer over the organic emissive layer, and removing the patterned photosensitive layer.

Abstract: A light emitting device includes a transistor and the transistor has a gate layer, and a dielectric under the gate layer. The light emitting device also includes a capacitor coupled to the transistor The capacitor including a first electrode, a second electrode over the first electrode, and a dielectric between the first and second electrode. The tight emitting device further includes a contact dielectric seprataing the transistor and the capacitor. The dielectric fully surrounds the capacitor and the transistor, wherein the contact dielectric is nitrogen free.

Abstract: A cursor control method is disclosed. The cursor control method is applicable for a touch device and a display device, in which the display device includes a virtual touch area corresponding to a touch area of the touch device. The control method includes the following operations; detecting a click position in the touch area during a click operation; calculating a virtual click coordinate position corresponding to the click coordinate position in the virtual touch area; and performing the click operation at the virtual click coordinate position on the display device.

Abstract: A method of manufacturing a light emitting device includes providing a substrate and forming a plurality of photosensitive bumps over the substrate. The method also includes forming a photosensitive layer over the plurality of photosensitive bumps and patterning the photosensitive layer to form a recess through the photosensitive layer to expose a surface. The method also includes disposing an organic emissive layer on the surface, and removing the patterned photosensitive layer.

Abstract: A method of manufacturing a light emitting device includes providing a substrate, forming a plurality of photosensitive bumps over the substrate, forming a photosensitive layer over the plurality of photosensitive bumps, forming a buffer layer between the photosensitive layer and the plurality of photosensitive bumps, patterning the photosensitive layer to form a recess through the photosensitive layer to expose a surface, disposing an organic emissive layer on the surface, forming a metal containing layer over the organic emissive layer, and removing the patterned photosensitive layer.

Abstract: A cursor control method is disclosed. The cursor control method is applicable for a touch device and a display device, in which the display device includes a virtual touch area corresponding to a touch area of the touch device. The control method includes the following operations; detecting a click position in the touch area during a click operation; calculating a virtual click coordinate position corresponding to the click coordinate position in the virtual touch area; and performing the click operation at the virtual click coordinate position on the display device.

Abstract: A gas purifier to be applied on a wafer substrate accommodating unit with an inlet hole includes an outer tube and an inner tube. The outer tube is disposed on the wafer substrate accommodating unit and has a plurality of first gas filling apertures. One end of the inner tube is a closed end and the other end is an open end. The inner tube has a plurality of second gas filling apertures, and its open end is interconnected with the inlet hole. The inner tube is movably disposed within the outer tube between a first operating position and second operating position. The second gas filling apertures are correspondingly configured to an inner wall of the outer tube when the inner tube is at a first operating position, and interconnected with the first gas filling apertures when the inner tube is at a second operating position.

Abstract: A method of manufacturing a light emitting device includes providing a substrate and forming a plurality of photosensitive bumps over the substrate. The method also includes forming a photosensitive layer over the plurality of photosensitive bumps and patterning the photosensitive layer to form a recess through the photosensitive layer to expose a surface. The method also includes disposing an organic emissive layer on the surface, and removing the patterned photosensitive layer.

Abstract: A light emitting device includes a first type carrier transportation layer and an organic light emitting unit over the first type carrier transportation layer. The light emitting device further includes a second type carrier transportation layer over the organic light emitting unit, wherein the second type is opposite to the first type. At least one of the first type carrier transportation layer and the second type carrier transportation layer includes a metal element.

Abstract: A restricted region transform method and a restricted region transform device are disclosed. The method includes following steps: reading out bare board information of a printed circuit board and layout information of a plurality of components, wherein the layout information of the plurality of components corresponds to a plurality of physical restricted regions; setting a first region according to edge information in the bare board information; setting a plurality of second regions according to projections of the plurality of physical restricted regions on a surface of the printed circuit board; selecting every two second regions, which overlap each other, among the plurality of second regions, and the selected second regions constituting a restriction conflict set; and selectively amending the second regions in the restriction conflict set to remove one or more overlaps from the second regions in the restriction conflict set.

Abstract: The present invention relates to an EUV pod having marks, which comprises a mask pod and one or more mark disposed on the mask pod. One or more sensor of a processing machine is used for detecting the one or more mark. By including the one or more mark, the surface roughness of one or more region of the mask pod detectable by the one or more sensor can be altered. The one or more sensor emits light to the mask pod, which reflects the light to the one or more sensor. The one or more sensor receives the reflection light from the mask pod and judges if the voltage generated by the reflection light falls within the reflection ranges of the mark. Thereby, whether the one or more sensor corresponds to the one or more make can be confirmed.

Abstract: The present invention relates to a wafer transport system and a method of operating the same. The wafer transport system comprises at least one semiconductor apparatus, a track, a transfer device, a positioning device, a carrier and a cleaning device. The wafer transport system transports wafers along the at least one semiconductor apparatus via the carrier riding on the track. The transfer device transfers the wafers from the carrier to the at least one semiconductor apparatus. The positioning device identifies and controls the position of the carrier on the track. The cleaning device maintains the cleanliness of the wafers. The present invention provides advantages for improving the yield rate of a wafer, shortening the fabrication time of a wafer, and offering the flexibility and the extendibility to a wafer transport system.

Abstract: A restricted region transform method and a restricted region transform device are disclosed. The method includes following steps: reading out bare board information of a printed circuit board and layout information of a plurality of components, wherein the layout information of the plurality of components corresponds to a plurality of physical restricted regions; setting a first region according to edge information in the bare board information; setting a plurality of second regions according to projections of the plurality of physical restricted regions on a surface of the printed circuit board; selecting every two second regions, which overlap each other, among the plurality of second regions, and the selected second regions constituting a restriction conflict set; and selectively amending the second regions in the restriction conflict set to remove one or more overlaps from the second regions in the restriction conflict set.

Abstract: A verification method is disclosed. A first entity pattern and a second entity pattern are provided, and a clearance exists between the first entity pattern and the second entity pattern. A third entity pattern is provided by starting from the first entity pattern and moving toward the second entity pattern according to a predetermined clearance value. By determining whether a partial overlap happens between the third entity pattern and the second entity pattern or not by interference inspection to verify whether the size of the clearance is within a safe range of a clearance design or not.

Abstract: A wireless device system and method are disclosed herein, in which the wireless device system includes a wireless device and an electronic device. The wireless device includes an audio receiving unit and an encoder, in which the audio receiving unit receives a knocking wave, and the encoder encodes the knocking wave to a pairing request code. The electronic device includes an audio receiving part, a wireless transceiver and a processor. The audio receiving part receives the knocking wave, and the wireless transceiver receives the pairing request code. The processor encodes the knocking wave to a detecting code, and the electronic device connects with the wireless device when the pairing request code matched the detecting code. The wireless device touches the electronic device so that the knocking wave is generated.

Abstract: A wireless device system and method are disclosed herein, in which the wireless device system includes a wireless device and an electronic device. The wireless device includes an audio receiving unit and an encoder, in which the audio receiving unit receives a knocking wave, and the encoder encodes the knocking wave to a pairing request code. The electronic device includes an audio receiving part, a wireless transceiver and a processor. The audio receiving part receives the knocking wave, and the wireless transceiver receives the pairing request code. The processor encodes the knocking wave to a detecting code, and the electronic device connects with the wireless device when the pairing request code matched the detecting code. The wireless device touches the electronic device so that the knocking wave is generated.

Abstract: The present invention relates to an EUV pod having marks, which comprises a mask pod and one or more mark disposed on the mask pod. One or more sensor of a processing machine is used for detecting the one or more mark. By including the one or more mark, the surface roughness of one or more region of the mask pod detectable by the one or more sensor can be altered. The one or more sensor emits light to the mask pod, which reflects the light to the one or more sensor. The one or more sensor receives the reflection light from the mask pod and judges if the voltage generated by the reflection light falls within the reflection ranges of the mark. Thereby, whether the one or more sensor corresponds to the one or more make can be confirmed.