Patents by Inventor Cheng-Hsuan Lin

Cheng-Hsuan Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230027220
    Abstract: The present disclosure provides a package device and a manufacturing method thereof. The package device includes an electronic device, a conductive pad having a first bottom surface, and a redistribution layer disposed between the conductive pad and the electronic device. The redistribution layer has a second bottom surface, and the conductive pad is electrically connected to the electronic device through the redistribution layer. The first bottom surface is closer to the electronic device than the second bottom in a normal direction of the electronic device.
    Type: Application
    Filed: October 5, 2022
    Publication date: January 26, 2023
    Applicant: InnoLux Corporation
    Inventors: Hsueh-Hsuan Chou, Chia-Chieh Fan, Kuan-Jen Wang, Cheng-Chi Wang, Yi-Hung Lin, Li-Wei Sung
  • Publication number: 20230006114
    Abstract: An optoelectronic package structure and a method of manufacturing an optoelectronic package structure are provided. The optoelectronic package structure includes a photonic component. The photonic component has an electrical connection region, a blocking region and a region for accommodating a device. The blocking region is located between the electrical connection region and the region for accommodating a device.
    Type: Application
    Filed: July 2, 2021
    Publication date: January 5, 2023
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Cheng-Hsuan WU, Chang-Yu LIN, Yu-Sheng HUANG
  • Patent number: 11531380
    Abstract: An electronic device including two bodies and at least one hinge structure is provided. The hinge structure includes a first bracket, a second bracket, a first rotation component, and a second rotation component. The hinge structure is connected to the two bodies via the first bracket and the second bracket respectively. The first rotation component is connected rotatably to the first bracket by taking a first axis as a rotation axis. The second rotation component is connected rotatably to the first rotation component by taking the first axis as a rotation axis, and is connected rotatably to the second bracket by taking a second axis as a rotation axis, wherein the first axis and the second axis are parallel to each other.
    Type: Grant
    Filed: August 19, 2020
    Date of Patent: December 20, 2022
    Assignee: COMPAL ELECTRONICS, INC.
    Inventors: Cheng-Ya Chi, Chien-Chu Chen, Ken-Ping Lin, Cheng-Shiue Jan, Yao-Lin Chang, Han-Hsuan Tsai, Jui-Min Huang, Chih-Wen Chiang
  • Patent number: 11508566
    Abstract: A use of an anthranilic acid derivative as a matrix for a MALDI Mass spectrometry, comprising: preparing a matrix compound represented by the following formula: wherein X is selected from hydrogen and a hydroxyl group, and Y is selected from hydrogen, a methyl group or an acetyl group, provided that when X is hydrogen, Y is hydrogen or an acetyl group, and when X is a hydroxyl group, Y is a methyl group; applying the matrix compound and an analyte onto a sample holder; and analyzing the analyte by the MALDI mass spectrometer.
    Type: Grant
    Filed: September 3, 2020
    Date of Patent: November 22, 2022
    Assignee: National Taiwan University
    Inventors: Cheng-Chih Hsu, Pi-Tai Chou, Chuping Lee, Peng-Hsuan Huang, Li-En Lin, Chun-Ying Huang, Ta-Chun Lin
  • Publication number: 20220367376
    Abstract: A method includes forming an insulating layer over a conductive feature; etching the insulating layer to expose a first surface of the conductive feature; covering the first surface of the conductive feature with a sacrificial material, wherein the sidewalls of the insulating layer are free of the sacrificial material; covering the sidewalls of the insulating layer with a barrier material, wherein the first surface of the conductive feature is free of the barrier material, wherein the barrier material includes tantalum nitride (TaN) doped with a transition metal; removing the sacrificial material; and covering the barrier material and the first surface of the conductive feature with a conductive material.
    Type: Application
    Filed: July 26, 2022
    Publication date: November 17, 2022
    Inventors: Chia-Pang Kuo, Huan-Yu Shih, Wen-Hsuan Chen, Cheng-Lun Tsai, Ya-Lien Lee, Cheng-Hui Weng, Chun-Chieh Lin, Hung-Wen Su, Yao-Min Liu
  • Patent number: 11488899
    Abstract: The present disclosure provides a package device including a conductive pad, a protecting block, and a redistribution layer. The protecting block is disposed on the conductive pad. The redistribution layer is disposed on the protecting block, and the conductive pad is electrically connected to the redistribution layer through the protecting block.
    Type: Grant
    Filed: July 28, 2020
    Date of Patent: November 1, 2022
    Assignee: InnoLux Corporation
    Inventors: Hsueh-Hsuan Chou, Chia-Chieh Fan, Kuan-Jen Wang, Cheng-Chi Wang, Yi-Hung Lin, Li-Wei Sung
  • Patent number: 11485953
    Abstract: The present disclosure provides for a cell stabilizing medium which comprises gelatin. The cell stabilizing medium help maintain cell viability, e.g., after thawing of a biological material post-cryopreservation.
    Type: Grant
    Filed: October 3, 2017
    Date of Patent: November 1, 2022
    Assignee: TRANSWELL BIOTECH CO., LTD.
    Inventors: Ya-Hsuan Chang, Cheng-Yi Lin, Chih-Yuan Chao
  • Patent number: 11480190
    Abstract: A fan module including a first body, a second body, a first fan assembly, a power module, and a second fan assembly is provided. The second body is slidably disposed at the first body to form a circulation space together. The first fan assembly is rotatably disposed at the first body and has sliding grooves. The power module is disposed in the first body and connected to the first fan assembly. The second fan assembly is rotatably disposed at the second body and has sliding portions, respectively and slidably disposed in corresponding sliding grooves. The power module is adapted to drive the first and second fan assemblies to rotate relative to the first body. A link module is adapted to drive the first and second bodies to relatively slide along an axial direction, so that the first and second fan assemblies are relatively separated or overlapped along the axial direction.
    Type: Grant
    Filed: March 27, 2020
    Date of Patent: October 25, 2022
    Assignee: COMPAL ELECTRONICS, INC.
    Inventors: Han-Hsuan Tsai, Jui-Min Huang, Wei-Hao Lan, Chien-Chu Chen, Ching-Ya Tu, Chih-Wen Chiang, Ching-Tai Chang, Ken-Ping Lin, Yao-Lin Chang, Cheng-Ya Chi
  • Patent number: 11475563
    Abstract: A benign tumor development trend assessment system includes an image outputting device and a server computing device. The image outputting device outputs first/second images captured from the same position in a benign tumor. The server computing device includes an image receiving module, an image pre-processing module, a target extracting module, a feature extracting module and a trend analyzing module. The image receiving module receives the first/second images. The image pre-processing module pre-processes the first/second images to obtain first/second local images. The target extracting module automatically detects and delineates tumor regions from the first/second local images to obtain first/second region of interest (ROI) images. The feature extracting module automatically identifies the first/second ROI images to obtain at least one first/second features. The trend analyzing module analyzes the first/second features to obtain a tumor development trend result.
    Type: Grant
    Filed: July 27, 2020
    Date of Patent: October 18, 2022
    Assignee: NATIONAL YANG MING CHIAO TUNG UNIVERSITY
    Inventors: Cheng-Chia Lee, Huai-Che Yang, Wen-Yuh Chung, Chih-Chun Wu, Wan-Yuo Guo, Wei-Kai Lee, Tzu-Hsuan Huang, Chun-Yi Lin, Chia-Feng Lu, Yu-Te Wu
  • Patent number: 11477364
    Abstract: A solid-state image sensor having a first region and a second region adjacent to the first region along a first direction is provided. The solid-state image sensor includes a first unit pattern disposed in the first region. The solid-state image sensor also includes a second unit pattern disposed in the second region and corresponding to the first unit pattern. The first unit pattern and the second unit pattern each includes normal pixels and an auto-focus pixel array. The normal pixels and the auto-focus pixel array in the first unit pattern form a first arrangement, the normal pixels and the auto-focus pixel array in the second unit pattern form a second arrangement, and the first arrangement and the second arrangement are symmetric with respect to the first axis of symmetry.
    Type: Grant
    Filed: August 18, 2021
    Date of Patent: October 18, 2022
    Assignee: VISERA TECHNOLOGIES COMPANY LIMITED
    Inventors: Cheng-Hsuan Lin, Zong-Ru Tu, Yu-Chi Chang, Han-Lin Wu, Hung-Jen Tsai
  • Publication number: 20220321791
    Abstract: A solid-state image sensor having a first region and a second region adjacent to the first region along a first direction is provided. The solid-state image sensor includes a first unit pattern disposed in the first region. The solid-state image sensor also includes a second unit pattern disposed in the second region and corresponding to the first unit pattern. The first unit pattern and the second unit pattern each includes normal pixels and an auto-focus pixel array. The normal pixels and the auto-focus pixel array in the first unit pattern form a first arrangement, the normal pixels and the auto-focus pixel array in the second unit pattern form a second arrangement, and the first arrangement and the second arrangement are symmetric with respect to the first axis of symmetry.
    Type: Application
    Filed: August 18, 2021
    Publication date: October 6, 2022
    Inventors: Cheng-Hsuan LIN, Zong-Ru TU, Yu-Chi CHANG, Han-Lin WU, Hung-Jen TSAI
  • Patent number: 11444028
    Abstract: A semiconductor device and methods of formation are provided. A semiconductor device includes an annealed cobalt plug over a silicide in a first opening of the semiconductor device, wherein the annealed cobalt plug has a repaired lattice structure. The annealed cobalt plug is formed by annealing a cobalt plug at a first temperature for a first duration, while exposing the cobalt plug to a first gas. The repaired lattice structure of the annealed cobalt plug is more regular or homogenized as compared to a cobalt plug that is not so annealed, such that the annealed cobalt plug has a relatively increased conductivity or reduced resistivity.
    Type: Grant
    Filed: December 16, 2019
    Date of Patent: September 13, 2022
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY Ltd.
    Inventors: Hong-Mao Lee, Huicheng Chang, Chia-Han Lai, Chi-Hsuan Ni, Cheng-Tung Lin, Huang-Yi Huang, Chi-Yuan Chen, Li-Ting Wang, Teng-Chun Tsai, Wei-Jung Lin
  • Publication number: 20220272779
    Abstract: A Bluetooth communication system includes: a Bluetooth host device; and a Bluetooth device set which including a first member device and a second member device. The first member device is arranged to operably transmit a corresponding first device information to the Bluetooth host device. The second member device is arranged to operably transmit a corresponding second device information to the Bluetooth host device. The Bluetooth host device is arranged to operably control a display device to simultaneously display a first device item for representing the first member device and a second device item for representing the second member device in a graphical user interface. The Bluetooth host device is further arranged to operably establish a Bluetooth connection with the first member device and conduct pairing procedure with the first member device after receiving a selection command corresponding to the first member device.
    Type: Application
    Filed: February 9, 2022
    Publication date: August 25, 2022
    Applicant: Realtek Semiconductor Corp.
    Inventors: Qing GU, Bi WEI, Yu Hsuan LIU, Yung Chieh LIN, Cheng CAI, Sixian WANG
  • Publication number: 20220271019
    Abstract: A semiconductor package structure and a method of manufacturing a semiconductor package structure are provided. The semiconductor package structure includes a first electronic device and a second electronic device. The first electronic device has an active surface and a lateral surface angled with the active surface, and the lateral surface includes a first portion and a second portion that is non-coplanar with the first portion. The second electronic device is disposed on the active surface of the first electronic device.
    Type: Application
    Filed: February 25, 2021
    Publication date: August 25, 2022
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Chang-Yu LIN, Cheng-Hsuan WU
  • Publication number: 20220256633
    Abstract: A Bluetooth communication system includes: a Bluetooth host device; and a Bluetooth device set which including a first member device and a second member device. The first member device is arranged to operably transmit a first device information corresponding to the first member device and a second device information corresponding to the second member device to the Bluetooth host device. The Bluetooth host device is arranged to operably receive the first device information and the second device information transmitted from the first member device. The Bluetooth host device is further arranged to operably establish a Bluetooth connection with the first member device and conduct pairing procedure with the first member device after receiving a selection command.
    Type: Application
    Filed: February 9, 2022
    Publication date: August 11, 2022
    Applicant: Realtek Semiconductor Corp.
    Inventors: Qing GU, Bi WEI, Yu Hsuan LIU, Yung Chieh LIN, Cheng CAI, Sixian WANG
  • Publication number: 20220256627
    Abstract: A Bluetooth communication system includes: a Bluetooth host device; and a Bluetooth device set which including a first member device and a second member device. The first member device is arranged to operably transmit an auto-pair request, a first device information corresponding to the first member device, and a second device information corresponding to the second member device to the Bluetooth host device. The Bluetooth host device is arranged to operably receive the auto-pair request, the first device information, and the second device information transmitted from the first member device. The Bluetooth host device is further arranged to operably establish a Bluetooth connection with the first member device and conduct pairing procedure with the first member device according to the auto-pair request.
    Type: Application
    Filed: February 9, 2022
    Publication date: August 11, 2022
    Applicant: Realtek Semiconductor Corp.
    Inventors: Qing GU, Bi WEI, Yu Hsuan LIU, Yung Chieh LIN, Cheng CAI, Sixian WANG
  • Publication number: 20220246657
    Abstract: The solid-state image sensor includes a semiconductor substrate having first and second photoelectric conversion elements, a color filter layer, and a hybrid layer. The isolation structure is disposed between the first and second photoelectric conversion elements. The color filter layer is disposed above the semiconductor substrate. The hybrid layer is disposed between the semiconductor substrate and the color filter layer. The hybrid layer includes a first partition structure, a second partition structure, and a transparent layer. The first partition structure is disposed to correspond to the isolation structure. The second partition structure is surrounded by the first partition structure. The transparent layer is between the first partition structure and the second partition structure. The refractive index of the first partition structure and the refractive index of the second partition structure are lower than the refractive index of the transparent layer.
    Type: Application
    Filed: February 1, 2021
    Publication date: August 4, 2022
    Inventors: Cheng-Hsuan LIN, Yu-Chi CHANG, Zong-Ru TU
  • Patent number: 11373910
    Abstract: A method of forming a semiconductor device including a fin field effect transistor (FinFET), the method includes forming a first sacrificial layer over a source/drain structure of a FinFET structure and an isolation insulating layer. The first sacrificial layer is patterned, thereby forming an opening. A first liner layer is formed on the isolation insulating layer in a bottom of the opening and on at least side faces of the patterned first sacrificial layer. After the first liner layer is formed, forming a dielectric layer in the opening. After the dielectric layer is formed, removing the patterned first sacrificial layer, thereby forming a contact opening over the source/drain structure. A conductive layer is formed in the contact opening. The FinFET is an n-type FET, and the source/drain structure includes an epitaxial layer made of Si1-y-a-bGeaSnbM2y, wherein 0<a, 0<b, 0.01?(a+b)?0.1, 0.01?y?0.1, and M2 is P or As.
    Type: Grant
    Filed: June 9, 2020
    Date of Patent: June 28, 2022
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Yasutoshi Okuno, Cheng-Yi Peng, Ziwei Fang, I-Ming Chang, Akira Mineji, Yu-Ming Lin, Meng-Hsuan Hsiao
  • Publication number: 20220181370
    Abstract: An image sensor includes: a group of autofocus sensor units; neighboring sensor units adjacent to and surrounding the group of autofocus sensor units, wherein each of the neighboring sensor units has a first side close to the group of autofocus sensor units, and a second side away from the group of autofocus sensor units. The image sensor further includes: a first light shielding structure disposed between the group of autofocus sensor units and the neighboring sensor units; a first extra light shielding structure laterally extending from the first light shielding structure and disposed on at least one of the first side and the second side of one or more of the neighboring sensor units.
    Type: Application
    Filed: December 9, 2020
    Publication date: June 9, 2022
    Inventors: Cheng-Hsuan LIN, Yu-Chi CHANG
  • Patent number: 11354929
    Abstract: A fingerprint recognition device includes a light source, a light conversion layer, a light detector, and a light filter. The light source is configured to emit a first light having a first wavelength. The light conversion layer is configured to convert the first light to a second light having a second wavelength different from the first wavelength. The light detector is configured to detect the second light reflected by a fingerprint. The light filter is disposed between the light conversion layer and the light detector, and configured to substantially filter out the first light and substantially pass the second light.
    Type: Grant
    Filed: May 6, 2020
    Date of Patent: June 7, 2022
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Ping-Chen Chen, Cheng-Hsuan Lin, Yu-Ling Hsu, Ding-Zheng Lin