Patents by Inventor Cheng-Hsuan Wu

Cheng-Hsuan Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230024259
    Abstract: A wafer backside defect detection method and a wafer backside defect detection apparatus are provided. The wafer backside defect detection method includes the following steps. A peripheral edge area of a wafer backside image that at least one notch is located is cropped off. Adjacent white pixels on the wafer backside image are connected to obtain a plurality of abnormal regions. If a total area of top N of the abnormal regions is more than 10% of an area of the wafer, it is deemed that the wafer has a roughness defect. N is a natural number. If the total area of the top N of the abnormal regions is less than 1% of the area of the wafer and a largest abnormal region of the abnormal regions is longer than a predetermined length, it is deemed that the wafer has a scratch defect.
    Type: Application
    Filed: July 20, 2021
    Publication date: January 26, 2023
    Inventors: Cheng-Hsien CHEN, Chia-Feng HSIAO, Chung-Hsuan WU, Chen-Hui HUANG, Nai-Ying LO, En-Wei TSUI, Yung-Yu YANG, Chen-Hsuan HUNG
  • Publication number: 20230010810
    Abstract: A system and a method for supplying target material in an EUV light source are provided. The system for supplying a target material comprises a priming assembly, a refill assembly and a droplet generator assembly. The priming is configured to transform the target material from a solid state to a liquid state. The refill assembly is in fluid communication with the priming assembly and configured to receive the target material in the liquid state from the priming assembly. Further, the refill assembly includes a purifier configured to purify the target material in the liquid state. The droplet generator assembly is configured to supply the target material in the liquid state from the refill assembly.
    Type: Application
    Filed: July 9, 2021
    Publication date: January 12, 2023
    Inventors: HSIN-FENG CHEN, MING-HSUN TSAI, LI-JUI CHEN, SHANG-CHIEH CHIEN, HENG-HSIN LIU, CHENG-HAO LAI, YU-HUAN CHEN, WEI-SHIN CHENG, YU-KUANG SUN, CHENG-HSUAN WU, YU-FA LO, CHIAO-HUA CHENG
  • Publication number: 20230006114
    Abstract: An optoelectronic package structure and a method of manufacturing an optoelectronic package structure are provided. The optoelectronic package structure includes a photonic component. The photonic component has an electrical connection region, a blocking region and a region for accommodating a device. The blocking region is located between the electrical connection region and the region for accommodating a device.
    Type: Application
    Filed: July 2, 2021
    Publication date: January 5, 2023
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Cheng-Hsuan WU, Chang-Yu LIN, Yu-Sheng HUANG
  • Patent number: 11533799
    Abstract: A system and a method for supplying target material in an EUV light source are provided. The system for supplying a target material comprises a priming assembly, a refill assembly and a droplet generator assembly. The priming is configured to transform the target material from a solid state to a liquid state. The refill assembly is in fluid communication with the priming assembly and configured to receive the target material in the liquid state from the priming assembly. Further, the refill assembly includes a purifier configured to purify the target material in the liquid state. The droplet generator assembly is configured to supply the target material in the liquid state from the refill assembly.
    Type: Grant
    Filed: July 9, 2021
    Date of Patent: December 20, 2022
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Hsin-Feng Chen, Ming-Hsun Tsai, Li-Jui Chen, Shang-Chieh Chien, Heng-Hsin Liu, Cheng-Hao Lai, Yu-Huan Chen, Wei-Shin Cheng, Yu-Kuang Sun, Cheng-Hsuan Wu, Yu-Fa Lo, Chiao-Hua Cheng
  • Patent number: 11528797
    Abstract: An extreme ultraviolet (EUV) photolithography system generates EUV light by irradiating droplets with a laser. The system includes a droplet generator with a nozzle and a piezoelectric structure coupled to the nozzle. The generator outputs groups of droplets. A control system applies a voltage waveform to the piezoelectric structure while the nozzle outputs the group of droplets. The waveform causes the droplets of the group to have a spread of velocities that results in the droplets coalescing into a single droplet prior to being irradiated by the laser.
    Type: Grant
    Filed: April 16, 2021
    Date of Patent: December 13, 2022
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Yu-Kuang Sun, Cheng-Hao Lai, Yu-Huan Chen, Wei-Shin Cheng, Ming-Hsun Tsai, Hsin-Feng Chen, Chiao-Hua Cheng, Cheng-Hsuan Wu, Yu-Fa Lo, Shang-Chieh Chien, Li-Jui Chen, Heng-Hsin Liu
  • Patent number: 11482651
    Abstract: The disclosure discloses an optoelectronic element comprising: an optoelectronic unit comprising a first metal layer, a second metal layer, and an outermost lateral surface; an insulating layer having a first portion overlapping the optoelectronic unit and extending beyond the lateral surface, and a second portion separated from the first portion in a cross-sectional view; and a first conductive layer formed on the insulating layer.
    Type: Grant
    Filed: June 12, 2020
    Date of Patent: October 25, 2022
    Assignee: EPISTAR CORPORATION
    Inventors: Cheng-Nan Han, Tsung-Xian Lee, Min-Hsun Hsieh, Hung-Hsuan Chen, Hsin-Mao Liu, Hsing-Chao Chen, Ching-San Tao, Chih-Peng Ni, Tzer-Perng Chen, Jen-Chau Wu
  • Publication number: 20220334495
    Abstract: Impurities in a liquefied solid fuel utilized in a droplet generator of an extreme ultraviolet photolithography system are removed from vessels containing the liquefied solid fuel. Removal of the impurities increases the stability and predictability of droplet formation which positively impacts wafer yield and droplet generator lifetime.
    Type: Application
    Filed: October 5, 2021
    Publication date: October 20, 2022
    Inventors: Cheng-Hao LAI, Ming-Hsun TSAI, Hsin-Feng CHEN, Wei-Shin CHENG, Yu-Kuang SUN, Cheng-Hsuan WU, Yu-Fa LO, Shih-Yu TU, Jou-Hsuan LU, Shang-Chieh CHIEN, Li-Jui CHEN, Heng-Hsin LIU
  • Publication number: 20220334496
    Abstract: A particle removal device, along with methods of using such, are described. The device includes a handheld module having a body. A first one or more channels and a second one or more channels are formed in the body. The body includes a nozzle, and the handheld module is configured to provide suction by the nozzle and to inject an ionized fluid stream by the nozzle. The body further includes a handle attached to the nozzle.
    Type: Application
    Filed: July 1, 2022
    Publication date: October 20, 2022
    Inventors: Cheng-Hsuan Wu, Ming-Hsun Tsai, Shang-Chieh Chien, Li-Jui Chen, Heng-Hsin Liu
  • Publication number: 20220338334
    Abstract: An extreme ultraviolet (EUV) photolithography system generates EUV light by irradiating droplets with a laser. The system includes a droplet generator with a nozzle and a piezoelectric structure coupled to the nozzle. The generator outputs groups of droplets. A control system applies a voltage waveform to the piezoelectric structure while the nozzle outputs the group of droplets. The waveform causes the droplets of the group to have a spread of velocities that results in the droplets coalescing into a single droplet prior to being irradiated by the laser.
    Type: Application
    Filed: April 16, 2021
    Publication date: October 20, 2022
    Inventors: Yu-Kuang SUN, Cheng-Hao LAI, Yu-Huan CHEN, Wei-Shin CHENG, Ming-Hsun TSAI, Hsin-Feng CHEN, Chiao-Hua CHENG, Cheng-Hsuan WU, Yu-Fa LO, Shang-Chieh CHIEN, Li-Jui CHEN, Heng-Hsin LIU
  • Patent number: 11475563
    Abstract: A benign tumor development trend assessment system includes an image outputting device and a server computing device. The image outputting device outputs first/second images captured from the same position in a benign tumor. The server computing device includes an image receiving module, an image pre-processing module, a target extracting module, a feature extracting module and a trend analyzing module. The image receiving module receives the first/second images. The image pre-processing module pre-processes the first/second images to obtain first/second local images. The target extracting module automatically detects and delineates tumor regions from the first/second local images to obtain first/second region of interest (ROI) images. The feature extracting module automatically identifies the first/second ROI images to obtain at least one first/second features. The trend analyzing module analyzes the first/second features to obtain a tumor development trend result.
    Type: Grant
    Filed: July 27, 2020
    Date of Patent: October 18, 2022
    Assignee: NATIONAL YANG MING CHIAO TUNG UNIVERSITY
    Inventors: Cheng-Chia Lee, Huai-Che Yang, Wen-Yuh Chung, Chih-Chun Wu, Wan-Yuo Guo, Wei-Kai Lee, Tzu-Hsuan Huang, Chun-Yi Lin, Chia-Feng Lu, Yu-Te Wu
  • Patent number: 11477364
    Abstract: A solid-state image sensor having a first region and a second region adjacent to the first region along a first direction is provided. The solid-state image sensor includes a first unit pattern disposed in the first region. The solid-state image sensor also includes a second unit pattern disposed in the second region and corresponding to the first unit pattern. The first unit pattern and the second unit pattern each includes normal pixels and an auto-focus pixel array. The normal pixels and the auto-focus pixel array in the first unit pattern form a first arrangement, the normal pixels and the auto-focus pixel array in the second unit pattern form a second arrangement, and the first arrangement and the second arrangement are symmetric with respect to the first axis of symmetry.
    Type: Grant
    Filed: August 18, 2021
    Date of Patent: October 18, 2022
    Assignee: VISERA TECHNOLOGIES COMPANY LIMITED
    Inventors: Cheng-Hsuan Lin, Zong-Ru Tu, Yu-Chi Chang, Han-Lin Wu, Hung-Jen Tsai
  • Publication number: 20220321791
    Abstract: A solid-state image sensor having a first region and a second region adjacent to the first region along a first direction is provided. The solid-state image sensor includes a first unit pattern disposed in the first region. The solid-state image sensor also includes a second unit pattern disposed in the second region and corresponding to the first unit pattern. The first unit pattern and the second unit pattern each includes normal pixels and an auto-focus pixel array. The normal pixels and the auto-focus pixel array in the first unit pattern form a first arrangement, the normal pixels and the auto-focus pixel array in the second unit pattern form a second arrangement, and the first arrangement and the second arrangement are symmetric with respect to the first axis of symmetry.
    Type: Application
    Filed: August 18, 2021
    Publication date: October 6, 2022
    Inventors: Cheng-Hsuan LIN, Zong-Ru TU, Yu-Chi CHANG, Han-Lin WU, Hung-Jen TSAI
  • Publication number: 20220276572
    Abstract: A photolithographic apparatus includes a droplet generator, a droplet generator maintenance system, and a controller communicating with the droplet generator maintenance system. The droplet generator maintenance system operatively communicates with the droplet generator, a coolant distribution unit, a gas supply unit, and a supporting member. The gas supply unit includes a heat exchange assembly and an air heating assembly. The coolant distribution unit is configured to control the temperature of the droplet generator within the acceptable droplet generator range.
    Type: Application
    Filed: March 14, 2022
    Publication date: September 1, 2022
    Inventors: Yu-Huan CHEN, Cheng-Hsuan WU, Ming-Hsun TSAI, Shang-Chieh CHIEN, Li-Jui CHEN
  • Publication number: 20220279373
    Abstract: A method of UE power profile adaptation to traffic and UE power consumption characteristics based on power profile is proposed. In one preferred embodiment, hybrid of bandwidth part (BWP) and power profile is proposed. UE is configured with multiple BWPs and each BWP includes a set of power profiles. Two types of adaptation triggering can be used, a first type of trigger is based on power saving signals sent from the network, and the second type of trigger is based on timers. When the traffic characteristic for UE changes, the network can send a power saving signal to UE to trigger power profile adaptation, e.g., BWP+power profile switching. When traffic has been digested and becomes sporadic, then power profile adaptation can be triggered based on timers, e.g., a timer for BWP adaptation and another timer for power profile adaptation.
    Type: Application
    Filed: May 6, 2022
    Publication date: September 1, 2022
    Inventors: Chien-Hwa Hwang, Wei-De Wu, Yiju Liao, Cheng-Hsun Li, Chi-Hsuan Hsieh
  • Publication number: 20220271019
    Abstract: A semiconductor package structure and a method of manufacturing a semiconductor package structure are provided. The semiconductor package structure includes a first electronic device and a second electronic device. The first electronic device has an active surface and a lateral surface angled with the active surface, and the lateral surface includes a first portion and a second portion that is non-coplanar with the first portion. The second electronic device is disposed on the active surface of the first electronic device.
    Type: Application
    Filed: February 25, 2021
    Publication date: August 25, 2022
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Chang-Yu LIN, Cheng-Hsuan WU
  • Publication number: 20220236480
    Abstract: An optical communication package structure includes a wiring structure, at least one via structure, a redistribution structure, at least one optical device and at least one electrical device. The wiring structure includes a main portion and a conductive structure disposed on an upper surface of the main portion. The main portion defines at least one through hole extending through the main portion. The via structure is disposed in the at least one through hole of the main portion and electrically connected to the conductive structure. The redistribution structure is disposed on a lower surface of the main portion and electrically connected to the via structure. The optical device is disposed adjacent to the upper surface of the main portion and electrically connected to the conductive structure. The electrical device is disposed on and electrically connected to the conductive structure.
    Type: Application
    Filed: April 12, 2022
    Publication date: July 28, 2022
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Cheng-Hsuan WU, Yung-Hui WANG
  • Patent number: 11392041
    Abstract: A particle removal device, along with methods of using such, are described. The device includes a handheld module having a body. A first one or more channels and a second one or more channels are formed in the body. The body includes a nozzle, and the handheld module is configured to provide suction by the nozzle and to inject an ionized fluid stream by the nozzle. The body further includes a handle attached to the nozzle.
    Type: Grant
    Filed: April 26, 2021
    Date of Patent: July 19, 2022
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Cheng-Hsuan Wu, Ming-Hsun Tsai, Shang-Chieh Chien, Li-Jui Chen, Heng-Hsin Liu
  • Publication number: 20220223528
    Abstract: A method for semiconductor manufacturing is disclosed. The method includes receiving a device having a first surface through which a first metal or an oxide of the first metal is exposed. The method further includes depositing a dielectric film having Si, N, C, and O over the first surface such that the dielectric film has a higher concentration of N and C in a first portion of the dielectric film near the first surface than in a second portion of the dielectric film further away from the first surface than the first portion. The method further includes forming a conductive feature over the dielectric film. The dielectric film electrically insulates the conductive feature from the first metal or the oxide of the first metal.
    Type: Application
    Filed: April 4, 2022
    Publication date: July 14, 2022
    Inventors: Cheng-Yi Wu, Li-Hsuan Chu, Ching-Wen Wen, Chia-Chun Hung, Chen Liang Chang, Chin-Szu Lee, Hsiang Liu
  • Patent number: 11388667
    Abstract: In an aspect of the disclosure, a method, a computer-readable medium, and an apparatus are provided. The apparatus may be a UE. The UE attempts to detect a trigger event. The UE determines values of a first set of power configuration parameters when the trigger event is detected. The UE transmits or receives signals in accordance with the values of the first set of power configuration parameters.
    Type: Grant
    Filed: November 18, 2020
    Date of Patent: July 12, 2022
    Assignee: MEDIATEK INC.
    Inventors: Yiju Liao, Wei-De Wu, Chien Hwa Hwang, Cheng-Hsun Li, Chi-Hsuan Hsieh, Xiu-Sheng Li
  • Patent number: 11300727
    Abstract: An optical communication package structure includes a wiring structure, at least one via structure, a redistribution structure, at least one optical device and at least one electrical device. The wiring structure includes a main portion and a conductive structure disposed on an upper surface of the main portion. The main portion defines at least one through hole extending through the main portion. The via structure is disposed in the at least one through hole of the main portion and electrically connected to the conductive structure. The redistribution structure is disposed on a lower surface of the main portion and electrically connected to the via structure. The optical device is disposed adjacent to the upper surface of the main portion and electrically connected to the conductive structure. The electrical device is disposed on and electrically connected to the conductive structure.
    Type: Grant
    Filed: July 31, 2019
    Date of Patent: April 12, 2022
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Cheng-Hsuan Wu, Yung-Hui Wang