Abstract: A package includes a photonic layer on a substrate, the photonic layer including a silicon waveguide coupled to a grating coupler; an interconnect structure over the photonic layer; an electronic die and a first dielectric layer over the interconnect structure, where the electronic die is connected to the interconnect structure; a first substrate bonded to the electronic die and the first dielectric layer; a socket attached to a top surface of the first substrate; and a fiber holder coupled to the first substrate through the socket, where the fiber holder includes a prism that re-orients an optical path of an optical signal.

Abstract: A semiconductor package includes a redistribution structure, a supporting layer, a semiconductor device, and a transition waveguide structure. The redistribution structure includes a plurality of connectors. The supporting layer is formed over the redistribution structure and disposed beside and between the plurality of connectors. The semiconductor device is disposed on the supporting layer and bonded to the plurality of connectors, wherein the semiconductor device includes a device waveguide. The transition waveguide structure is disposed on the supporting layer adjacent to the semiconductor device, wherein the transition waveguide structure is optically coupled to the device waveguide.

Abstract: A package includes an electronic die, a photonic die underlying and electronically communicating with the electronic die, a lens disposed on the electronic die, and a prism structure disposed on the lens and optically coupled to the photonic die. The prism structure includes first and second polymer layers, the first polymer layer includes a first curved surface concaving toward the photonic die, the second polymer layer embedded in the first polymer layer includes a second curved surface substantially conforming to the first curved surface, and an outer sidewall of the second polymer layer substantially aligned with an outer sidewall of the first polymer layer.

Abstract: An integrated circuit package and a method of forming the same are provided. The integrated circuit package includes a photonic integrated circuit die. The photonic integrated circuit die includes an optical coupler. The integrated circuit package further includes an encapsulant encapsulating the photonic integrated circuit die, a first redistribution structure over the photonic integrated circuit die and the encapsulant, and an opening extending through the first redistribution structure and exposing the optical coupler.

Abstract: A modified polyphenylene ether resin having a structure represented by [Formula 1] is provided.

Abstract: A package includes a photonic layer on a substrate, the photonic layer including a silicon waveguide coupled to a grating coupler; an interconnect structure over the photonic layer; an electronic die and a first dielectric layer over the interconnect structure, where the electronic die is connected to the interconnect structure; a first substrate bonded to the electronic die and the first dielectric layer; a socket attached to a top surface of the first substrate; and a fiber holder coupled to the first substrate through the socket, where the fiber holder includes a prism that re-orients an optical path of an optical signal.

Abstract: The disclosure provides a quantum device and a microwave device. The quantum device includes a first partition, a second partition, an upper circuit board, a lower circuit board and a flexible circuit. The second partition is arranged below the first partition. The first partition and the second partition are used to define an ultra-low temperature chamber of the quantum device. The upper circuit board, the lower circuit board and the flexible circuit are arranged in the ultra-low temperature chamber. The upper circuit board is disposed on a lower surface of the first partition. The lower circuit board is disposed on an upper surface of the second partition. The flexible circuit is electrically connected between the upper circuit board and the lower circuit board to provide multiple signal paths for mutual signal transmission between the upper circuit board and the lower circuit board.

Abstract: A light-transmitting antenna includes a substrate, a first and a second conductive pattern. The first and the second conductive pattern is disposed on a first and a second surface of the substrate respectively. The first conductive pattern includes a first feeder unit, a first and a second radiation unit, a first and a second coupling unit and a first parasitic unit. The first feeder unit is connected to the second radiation unit. The first and the second radiation unit are located between the first and the second coupling unit. One side and the other side of the first parasitic unit is connected to the second coupling unit and adjacent to the first coupling unit respectively. The second conductive pattern includes a second feeder unit, a third coupling unit, a second parasitic unit, and a fourth coupling unit.

Abstract: A light-transmitting antenna includes a substrate, a first conductive pattern, and a second conductive pattern. The first conductive pattern has a first feeder unit, a first radiation unit, a second radiation unit, and a first connection unit. The first feeder unit and the first connection unit are connected to two sides of the first radiation unit. The first connection unit connects the first radiation unit and the second radiation unit. The second conductive pattern has a second feeder unit, a third radiation unit, a fourth radiation unit, and a second connection unit. The second feeder unit and the second connection unit are connected to two sides of the third radiation unit. The second connection unit connects the third radiation unit and the fourth radiation unit. An orthogonal projection of the second feeder unit on a first surface of the substrate at least partially overlaps the first feeder unit.

Abstract: A motherboard having a smart charging function is provided. A connection interface is configured to an electrical device. A first controller is coupled to the switching circuit and communicates with the electrical device via a first transmission path. A second controller is coupled to the switching circuit and communicates with the electrical device via a second transmission path. In a standard charge mode, the first transmission path is turned on and the first controller directs a voltage converter circuit to generate first charge power to the electrical device. In a fast charge mode, the first controller determines whether the electrical device has a specific operating system. Responsive to determining that the electrical device does not have the specific operating system, the second transmission path is turned on and the second controller directs the voltage converter circuit to generate second charge power to the electrical device.

Abstract: A motherboard having a charging function is provided. A connection interface is configured to an electrical device. A first controller communicates with the electrical device via a first transmission path. A second controller communicates with the electrical device via a second transmission path. In a first mode, the first controller directs a voltage converter circuit to generate first charge power to the electrical device. In a second mode, the second controller directs the voltage converter circuit to generate second charge power to the electrical device. In a third mode, the first controller determines whether the electrical device is a specific device. Responsive to the electrical device not being the specific device, the voltage converter circuit generates third charge power to the electrical device. Responsive to the electrical device being the specific device, the voltage converter circuit generates fourth charge power to the electrical device.

Abstract: A motherboard having a charging function is provided. A connection interface is configured to an electrical device. A first controller communicates with the electrical device via a first transmission path. A second controller communicates with the electrical device via a second transmission path. In a first mode, the first controller directs a voltage converter circuit to generate first charge power to the electrical device. In a second mode, the second controller directs the voltage converter circuit to generate second charge power to the electrical device. In a third mode, the first controller determines whether the electrical device is a specific device. Responsive to the electrical device not being the specific device, the voltage converter circuit generates third charge power to the electrical device. Responsive to the electrical device being the specific device, the voltage converter circuit generates fourth charge power to the electrical device.

Abstract: A motherboard having a smart charging function is provided. A connection interface is configured to an electrical device. A first controller is coupled to the switching circuit and communicates with the electrical device via a first transmission path. A second controller is coupled to the switching circuit and communicates with the electrical device via a second transmission path. In a standard charge mode, the first transmission path is turned on and the first controller directs a voltage converter circuit to generate first charge power to the electrical device. In a fast charge mode, the first controller determines whether the electrical device has a specific operating system. Responsive to determining that the electrical device does not have the specific operating system, the second transmission path is turned on and the second controller directs the voltage converter circuit to generate second charge power to the electrical device.

Abstract: An integrated millimeter-wave chip package structure including an interposer structure, a millimeter-wave chip and a substrate is provided. The interposer structure includes at least an antenna pattern and at least a plated through-hole structure penetrating through the interposer structure and connected to the at least one antenna pattern. The millimeter-wave chip is electrically connected to the at least antenna pattern located either above or below the millimeter-wave chip through the at least plated through-hole structure.

Abstract: An integrated millimeter-wave chip package structure including an interposer structure, a millimeter-wave chip and a substrate is provided. The interposer structure includes at least an antenna pattern and at least a plated through-hole structure penetrating through the interposer structure and connected to the at least one antenna pattern. The millimeter-wave chip is electrically connected to the at least antenna pattern located either above or below the millimeter-wave chip through the at least plated through-hole structure.

Abstract: An integrated antenna package including a laminated structure and a multi-layered substrate is provided. The laminated structure includes at least a chip embedded therein and at least a plated through-hole structure penetrating the laminated structure. The multi-layered substrate is stacked on the laminated structure. The multi-layered substrate includes at least a metal layer located on one side of the multi-layered substrate away from the laminated structure and the metal layer includes at least an antenna pattern located above the chip. The multi-layered substrate includes at least a plated via and through-hole structure penetrating the multi-layered substrate and electrically connected to the chip, so that the antenna pattern is electrically connect with the chip. Also, the manufacturing method of the integrated antenna package is provided.

Abstract: An RFID sealing device for a bottle is disclosed, which provides information of production resumes, stock control, sale control and so like, where the information may be adapted for a computerized foods management system for the upstream manufacturer and the downstream sellers. Since the metal cap plays a part in the RFID sealing device, the RFID shall malfunction once the bottle cap has been turned or opened before sale, so that the present RFID sealing device plays a function of safety identifier to the bottled liquid or food in addition.

Abstract: An inductor structure including a plurality of solenoids and at least one connecting line is provided. One of the solenoids serves as a core, and the remaining solenoids are sequentially wound around the core solenoid. Axes of the solenoids are substantially directed to the same direction. Each connecting line is correspondingly connected between ends of two adjacent solenoids to serially connect the solenoids.

Abstract: An RFID sealing device for a bottle is disclosed, which provides information of production resumes, stock control, sale control and so like, where the information may be adapted for a computerized foods management system for the upstream manufacturer and the downstream sellers. Since the metal cap plays a part in the RFID sealing device, the RFID shall malfunction once the bottle cap has been turned or opened before sale, so that the present RFID sealing device plays a function of safety identifier to the bottled liquid or food in addition.

Abstract: An inductor structure including a plurality of solenoids and at least one connecting line is provided. One of the solenoids serves as a core, and the remaining solenoids are sequentially wound around the core solenoid. Axes of the solenoids are substantially directed to the same direction. Each connecting line is correspondingly connected between ends of two adjacent solenoids to serially connect the solenoids.