Abstract: The disclosure provides a quantum device and a microwave device. The quantum device includes a first partition, a second partition, an upper circuit board, a lower circuit board and a flexible circuit. The second partition is arranged below the first partition. The first partition and the second partition are used to define an ultra-low temperature chamber of the quantum device. The upper circuit board, the lower circuit board and the flexible circuit are arranged in the ultra-low temperature chamber. The upper circuit board is disposed on a lower surface of the first partition. The lower circuit board is disposed on an upper surface of the second partition. The flexible circuit is electrically connected between the upper circuit board and the lower circuit board to provide multiple signal paths for mutual signal transmission between the upper circuit board and the lower circuit board.

Abstract: A light-transmitting antenna includes a substrate, a first and a second conductive pattern. The first and the second conductive pattern is disposed on a first and a second surface of the substrate respectively. The first conductive pattern includes a first feeder unit, a first and a second radiation unit, a first and a second coupling unit and a first parasitic unit. The first feeder unit is connected to the second radiation unit. The first and the second radiation unit are located between the first and the second coupling unit. One side and the other side of the first parasitic unit is connected to the second coupling unit and adjacent to the first coupling unit respectively. The second conductive pattern includes a second feeder unit, a third coupling unit, a second parasitic unit, and a fourth coupling unit.

Abstract: A light-transmitting antenna includes a substrate, a first conductive pattern, and a second conductive pattern. The first conductive pattern has a first feeder unit, a first radiation unit, a second radiation unit, and a first connection unit. The first feeder unit and the first connection unit are connected to two sides of the first radiation unit. The first connection unit connects the first radiation unit and the second radiation unit. The second conductive pattern has a second feeder unit, a third radiation unit, a fourth radiation unit, and a second connection unit. The second feeder unit and the second connection unit are connected to two sides of the third radiation unit. The second connection unit connects the third radiation unit and the fourth radiation unit. An orthogonal projection of the second feeder unit on a first surface of the substrate at least partially overlaps the first feeder unit.

Abstract: A motherboard having a smart charging function is provided. A connection interface is configured to an electrical device. A first controller is coupled to the switching circuit and communicates with the electrical device via a first transmission path. A second controller is coupled to the switching circuit and communicates with the electrical device via a second transmission path. In a standard charge mode, the first transmission path is turned on and the first controller directs a voltage converter circuit to generate first charge power to the electrical device. In a fast charge mode, the first controller determines whether the electrical device has a specific operating system. Responsive to determining that the electrical device does not have the specific operating system, the second transmission path is turned on and the second controller directs the voltage converter circuit to generate second charge power to the electrical device.

Abstract: A motherboard having a charging function is provided. A connection interface is configured to an electrical device. A first controller communicates with the electrical device via a first transmission path. A second controller communicates with the electrical device via a second transmission path. In a first mode, the first controller directs a voltage converter circuit to generate first charge power to the electrical device. In a second mode, the second controller directs the voltage converter circuit to generate second charge power to the electrical device. In a third mode, the first controller determines whether the electrical device is a specific device. Responsive to the electrical device not being the specific device, the voltage converter circuit generates third charge power to the electrical device. Responsive to the electrical device being the specific device, the voltage converter circuit generates fourth charge power to the electrical device.

Abstract: A motherboard having a charging function is provided. A connection interface is configured to an electrical device. A first controller communicates with the electrical device via a first transmission path. A second controller communicates with the electrical device via a second transmission path. In a first mode, the first controller directs a voltage converter circuit to generate first charge power to the electrical device. In a second mode, the second controller directs the voltage converter circuit to generate second charge power to the electrical device. In a third mode, the first controller determines whether the electrical device is a specific device. Responsive to the electrical device not being the specific device, the voltage converter circuit generates third charge power to the electrical device. Responsive to the electrical device being the specific device, the voltage converter circuit generates fourth charge power to the electrical device.

Abstract: A motherboard having a smart charging function is provided. A connection interface is configured to an electrical device. A first controller is coupled to the switching circuit and communicates with the electrical device via a first transmission path. A second controller is coupled to the switching circuit and communicates with the electrical device via a second transmission path. In a standard charge mode, the first transmission path is turned on and the first controller directs a voltage converter circuit to generate first charge power to the electrical device. In a fast charge mode, the first controller determines whether the electrical device has a specific operating system. Responsive to determining that the electrical device does not have the specific operating system, the second transmission path is turned on and the second controller directs the voltage converter circuit to generate second charge power to the electrical device.

Abstract: An integrated millimeter-wave chip package structure including an interposer structure, a millimeter-wave chip and a substrate is provided. The interposer structure includes at least an antenna pattern and at least a plated through-hole structure penetrating through the interposer structure and connected to the at least one antenna pattern. The millimeter-wave chip is electrically connected to the at least antenna pattern located either above or below the millimeter-wave chip through the at least plated through-hole structure.

Abstract: An integrated millimeter-wave chip package structure including an interposer structure, a millimeter-wave chip and a substrate is provided. The interposer structure includes at least an antenna pattern and at least a plated through-hole structure penetrating through the interposer structure and connected to the at least one antenna pattern. The millimeter-wave chip is electrically connected to the at least antenna pattern located either above or below the millimeter-wave chip through the at least plated through-hole structure.

Abstract: An integrated antenna package including a laminated structure and a multi-layered substrate is provided. The laminated structure includes at least a chip embedded therein and at least a plated through-hole structure penetrating the laminated structure. The multi-layered substrate is stacked on the laminated structure. The multi-layered substrate includes at least a metal layer located on one side of the multi-layered substrate away from the laminated structure and the metal layer includes at least an antenna pattern located above the chip. The multi-layered substrate includes at least a plated via and through-hole structure penetrating the multi-layered substrate and electrically connected to the chip, so that the antenna pattern is electrically connect with the chip. Also, the manufacturing method of the integrated antenna package is provided.

Abstract: An RFID sealing device for a bottle is disclosed, which provides information of production resumes, stock control, sale control and so like, where the information may be adapted for a computerized foods management system for the upstream manufacturer and the downstream sellers. Since the metal cap plays a part in the RFID sealing device, the RFID shall malfunction once the bottle cap has been turned or opened before sale, so that the present RFID sealing device plays a function of safety identifier to the bottled liquid or food in addition.

Abstract: An inductor structure including a plurality of solenoids and at least one connecting line is provided. One of the solenoids serves as a core, and the remaining solenoids are sequentially wound around the core solenoid. Axes of the solenoids are substantially directed to the same direction. Each connecting line is correspondingly connected between ends of two adjacent solenoids to serially connect the solenoids.

Abstract: An RFID sealing device for a bottle is disclosed, which provides information of production resumes, stock control, sale control and so like, where the information may be adapted for a computerized foods management system for the upstream manufacturer and the downstream sellers. Since the metal cap plays a part in the RFID sealing device, the RFID shall malfunction once the bottle cap has been turned or opened before sale, so that the present RFID sealing device plays a function of safety identifier to the bottled liquid or food in addition.

Abstract: An inductor structure including a plurality of solenoids and at least one connecting line is provided. One of the solenoids serves as a core, and the remaining solenoids are sequentially wound around the core solenoid. Axes of the solenoids are substantially directed to the same direction. Each connecting line is correspondingly connected between ends of two adjacent solenoids to serially connect the solenoids.

Abstract: A three-dimensional inductor is provided. The three-dimensional inductor is disposed in a multi-layered substrate. The multi-layered substrate includes at least a dielectric layer and at least two metal layers. The three-dimensional inductor includes a first coil and a second coil. The second coil is electrically connected to the first coil. The first coil is on a first plane and formed on a first metal layer. The second coil is on a second plane and disposed in a variety of dielectric layers and metal layer. The first plane is not parallel to or is vertical to the second plane such that the magnetic field generated by the first coil and the magnetic field generated by the second coil are not parallel to each other or are vertical to each other.

Abstract: Radio-frequency identification (RFID) tag antenna, tags and communications systems using the same are presented. The RFID tag antenna includes a patterned conductive loop having a plurality of longitudinal conductive sections and a pair of transverse conductive sections connecting to each end of the longitudinal conductive sections to serve as a matching network. A pair of extended conductive arms is electrically connected to the patterned conductive loop via two nodes. A bonding pad with an RFID chip disposed thereon is arranged at the central area of the pair of extended conductive arms.

Abstract: An inductor device comprising a first conductive pattern on a first layer of a substrate, a second conductive pattern on a second layer of the substrate, and a first region between the first layer and the second layer through which at least one hole is coupled between the first dielectric layer and the second dielectric layer, wherein a magnetic field induced by at least one of the first conductive pattern or the second conductive pattern at the first region is more intensive than that induced by at least one of the first conductive pattern or the second conductive pattern at a second region between the first conductive layer and the second conductive layer.

Abstract: A three-dimensional inductor is provided. The three-dimensional inductor is disposed in a multi-layered substrate. The multi-layered substrate includes at least a dielectric layer and at least two metal layers. The three-dimensional inductor includes a first coil and a second coil. The second coil is electrically connected to the first coil. The first coil is on a first plane and formed on a first metal layer. The second coil is on a second plane and disposed in a variety of dielectric layers and metal layer. The first plane is not parallel to or is vertical to the second plane such that the magnetic field generated by the first coil and the magnetic field generated by the second coil are not parallel to each other or are vertical to each other.

Abstract: A dual-port capacitor structure includes a first electrode plate having a first opening; a second electrode plate having a second opening; and a third electrode plate, disposed in the first opening of the first electrode plate and the second opening of the second electrode plate. The first electrode plate, the second electrode plate and the third electrode plate locate on the same plane.

Abstract: A capacitor structure is provided. In the capacitor structure, a signal electrode plate and an extension ground electrode plate are disposed on the same plane to form a co-plane capacitor structure. Due to slow wave characteristic, the resonance frequency of the capacitor structure is effectively raised and the capacitor structure may be applied in high frequency.