Abstract: An electronic device includes a flexible substrate and a conductive wire. The conductive wire is disposed on the flexible substrate and includes a metal portion and a plurality of openings disposed in the metal portion. The metal portion includes a plurality of extending portions and a plurality of joint portions, and each of the openings is surrounded by two of the plurality of extending portions and two of the plurality of joint portions. A ratio of a sum of widths of the plurality of extending portions to a sum of widths of the plurality of joint portions is in a range from 0.8 to 1.2.

Abstract: A front-end module, compatible with various baseband chipset configurations, that includes a transmit signal path having a transmit amplifier, to amplify an outgoing signal, and a coupler. The coupler diverts a first portion of the outgoing signal, to a transmit-receive switch, a second portion to a receive path switch, and a third portion to a RF-coupling port. As included is a receive signal path including a low-noise amplifier, configured to receive an incoming signal, and a receive path switch. The receive path switch receives the incoming signal, from the transmit-receive switch, and the second portion of the outgoing signal from the coupler. The receive signal path also includes a receive port configured to selectively receive, through the receive path switch, incoming signals from an antenna and the second portion of the outgoing signal. A RF coupling port connects to the coupler to receive the third portion of the outgoing signal.

Abstract: An electronic test device includes a test seat and at least one probe. The test seat has a hole-defining surface that defines a probe hole, and has two positioning sections being proximate respectively to two ends of the probe hole opposite to each other, at least one first protrusion that protrudes inwardly from the at least one positioning sections of the hole-defining surface, and at least one second protrusion that protrudes inwardly from the hole-defining surface between the positioning sections. The at least one probe is positioned in the probe hole. A thickness of each of the at least one first protrusion and the at least one second protrusion ranges from five to thirty percent of a depth of the probe hole.

Abstract: An electronic test device includes a test seat and at least one probe. The test seat has a hole-defining surface that defines a probe hole, and has two positioning sections being proximate respectively to two ends of the probe hole opposite to each other, at least one first protrusion that protrudes inwardly from the at least one positioning sections of the hole-defining surface, and at least one second protrusion that protrudes inwardly from the hole-defining surface between the positioning sections. The at least one probe is positioned in the probe hole. A thickness of each of the at least one first protrusion and the at least one second protrusion ranges from five to thirty percent of a depth of the probe hole.

Abstract: A testing method for testing wafer level chip scale packages formed on a wafer including a wafer substrate and spaced-apart contact electrodes disposed on the wafer substrate, includes: providing a test device including a probe card formed with a plurality of parallel probe holes having a uniform cross-sectional dimension, and a plurality of probes respectively received in the probe holes and extending respectively in the probe holes along axes of the probe holes; and electrically connecting the contact electrodes to the probes. A distance between the axes of two adjacent ones of the probe holes is equal to a smallest spacing between two adjacent ones of the contact electrodes and is not greater than 0.5 mm.

Abstract: An electronic test apparatus is adapted for testing an electronic component which includes a circuit substrate and a plurality of contact electrodes disposed on the circuit substrate. The electronic test apparatus includes a test seat and a plurality of spring probes. The test seat includes a metallic main body that has a first side adapted to be in contact with the circuit substrate and a second side opposite to the first side, and that is formed with a plurality of spaced-apart probe holes extending through the first and second sides, and a temperature sensor disposed in the metallic main body. The spring probes are adapted to be electrically connected to the contact electrodes and each is positioned in a respective one of the probe holes.

Abstract: A control device, for a light emitting diode (LED), wherein the LED is driven by a current to emit light, the control device comprising a microcontroller, coupled to the LED, for providing the current to the LED according to a current setup signal; and a pulse width modulation (PWM) circuit, coupled to the microcontroller, for generating the current setup signal, and adjusting a pulse width of the current setup signal according to a control signal, to adjust the current generated by the microcontroller.

Abstract: An electronic test apparatus is adapted for testing an electronic component which includes a circuit substrate and a plurality of contact electrodes disposed on the circuit substrate. The electronic test apparatus includes a test seat and a plurality of spring probes. The test seat includes a metallic main body that has a first side adapted to be in contact with the circuit substrate and a second side opposite to the first side, and that is formed with a plurality of spaced-apart probe holes extending through the first and second sides, and a temperature sensor disposed in the metallic main body. The spring probes are adapted to be electrically connected to the contact electrodes and each is positioned in a respective one of the probe holes.

Abstract: A testing method for testing wafer level chip scale packages formed on a wafer including a wafer substrate and spaced-apart contact electrodes disposed on the wafer substrate, includes: providing a test device including a probe card formed with a plurality of parallel probe holes having a uniform cross-sectional dimension, and a plurality of probes respectively received in the probe holes and extending respectively in the probe holes along axes of the probe holes; and electrically connecting the contact electrodes to the probes. A distance between the axes of two adjacent ones of the probe holes is equal to a smallest spacing between two adjacent ones of the contact electrodes and is not greater than 0.5 mm.

Abstract: An electronic test equipment is adapted to test an electronic component. The electronic component has a circuit body and a plurality of connectors that are electrically connected to the circuit body. The electronic test equipment includes a metallic test seat and a plurality of spring probes. The metallic test seat is adapted to support the circuit body thereon, and is formed with a plurality of spaced-apart probe holes extending therethrough and possessing diameters that are substantially the same. Each of the probe holes is adapted to receive a corresponding one of the connectors. The spring probes are respectively and entirely positioned within the probe holes, and are adapted to electrically contact the connectors.

Abstract: A capacitive touch pad includes a sensor layer for sensing a touch of an object and a dummy trace below the sensor layer. The dummy trace is sensed to obtain a sensed value while the dummy trace is shielded by the sensor layer from interference of the object such that the sensed value reflects only environmental variation. Therefore, environmental variation can be identified depending on the sensed value, and the sensor layer can be calibrated properly.

Abstract: A capacitive touch pad includes a sensor layer for sensing a touch of an object and a dummy trace below the sensor layer. The dummy trace is sensed to obtain a sensed value while the dummy trace is shielded by the sensor layer from interference of the object such that the sensed value reflects only environmental variation. Therefore, environmental variation can be identified depending on the sensed value, and the sensor layer can be calibrated properly.

Abstract: A capacitive touchpad includes a first trace established by a string of first rhombic sensing cells successively in a first direction and a plurality of singular second rhombic sensing cells branched in a second direction from the string of first rhombic sensing cells, and a second trace established by a string of third rhombic sensing cells successively in the first direction and a plurality of singular fourth rhombic sensing cells branched in the second direction from the string of third rhombic sensing cells, and the second rhombic sensing cells are interleaved with the fourth rhombic sensing cells in the first direction. The capacitive touchpad is thus improved in its linearity.

Abstract: A method of making a heat pipe includes the steps of: providing a mandrel, a capillary wick and a straight tubular shell; inserting the mandrel and the capillary wick into the shell; cramming powder into the shell, wherein the powder can be sintered between the shell and the mandrel; sintering the shell having the mandrel, the capillary wick and the powder therein; and drawing the mandrel out of the shell and filling working media into the pipe, and vacuuming and sealing the pipe. The mandrel defines a longitudinal slot therein, and the capillary wick is positioned in the slot.

Abstract: A performance testing apparatus for a heat pipe includes an immovable portion having a cooling structure defined therein for cooling a heat pipe to be tested. A movable portion is capable of moving relative to the immovable portion and has a cooling structure defined therein for cooling the heat pipe. A receiving structure is located between the immovable portion and the movable portion for receiving the heat pipe therein. At least a temperature sensor is attached to at least one of the immovable portion and the movable portion for thermally contacting the heat pipe in the receiving structure for detecting temperature of the heat pipe. An enclosure encloses the immovable portion and the movable portion therein and has sidewalls thereof slidably contacting at least one of the immovable portion and the movable portion.

Abstract: A performance testing apparatus for a heat pipe includes an immovable portion having a cooling structure defined therein for cooling a heat pipe requiring to be tested. A movable portion is capable of moving relative to the immovable portion and has a cooling structure therein for cooling the heat pipe. A receiving structure is located between the immovable portion and the movable portion for receiving the heat pipe therein. At least one temperature sensor is attached to at least one of the immovable portion and the movable portion. The least one temperature sensor has a detecting section exposed in the receiving structure for thermally contacting the heat pipe in the receiving structure to detect a temperature of the heat pipe.

Abstract: A sealing structure formed at an end of a heat pipe, includes a two-layer structure, which can be divided into two walls and a rib interconnecting the walls together, wherein the rib points to a center of the heat pipe. A method for manufacturing the sealing structure includes following steps: (1) providing a metallic pipe with an end sealed and an opposite open portion; (2) pressing the open portion of the pipe to form the two-layer sealing structure by using a pair of pressing molds, wherein the pair of pressing molds comprises a first pressing mold and a second pressing mold, the first mold having an M-shaped convex portion, the second mold having an M-shaped concave portion corresponding to the convex portion.

Abstract: A method for controlling write parameters in a data-write process includes steps of: emitting a laser beam to be focused on a disc to write data onto the disc; determining whether a check-point predetermined for the disc is detected; at occurrence of the check-point is detected, pausing the data-write process and starting to detect a quality of the data; judging whether a block error rate of the data exceeds a predetermined rate; calculating a write speed based on the block error rate; and adjusting the write parameters based on the quality and the write speed.

Abstract: An optimal power calibration method includes steps of: performing a first optimal power calibration procedure at a first power calibration area with a first recording speed to obtain a first optimal power level corresponding to the first recording speed; performing a second optimal power calibration procedure at a second power calibration area with a second recording speed to obtain a second optimal power level corresponding to the second recording speed, the second recording speed being higher than the first recording speed; and determining an optimal recording power level for recording data on a disc at a predetermined speed based on the first optimal power level and the second optimal power level.

Abstract: A sealing structure formed at an end of a heat pipe, includes a two-layer structure, which can be divided into two walls and a rib interconnecting the walls together, wherein the rib points to a center of the heat pipe. A method for manufacturing the sealing structure includes following steps: (1) providing a metallic pipe with an end sealed and an opposite open portion; (2) pressing the open portion of the pipe to form the two-layer sealing structure by using a pair of pressing molds, wherein the pair of pressing molds comprises a first pressing mold and a second pressing mold, the first mold having an M-shaped convex portion, the second mold having an M-shaped concave portion corresponding to the convex portion.