Patents by Inventor Cheng-Hung Tsai

Cheng-Hung Tsai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11171039
    Abstract: A composite semiconductor substrate includes a semiconductor substrate, an oxygen-doped crystalline semiconductor layer and an insulative layer. The oxygen-doped crystalline semiconductor layer is over the semiconductor substrate, and the oxygen-doped crystalline semiconductor layer includes a crystalline semiconductor material and a plurality of oxygen dopants. The insulative layer is over the oxygen-doped crystalline semiconductor layer.
    Type: Grant
    Filed: March 29, 2018
    Date of Patent: November 9, 2021
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Min-Ying Tsai, Cheng-Ta Wu, Yu-Hung Cheng, Yeur-Luen Tu
  • Patent number: 11135289
    Abstract: The present invention relates to fucoidan-quaternized chitosan nanoparticles, an immunogenic composition containing the fucoidan-quatemized chitosan nanoparticles, and a method of delivering an agent to a cell by the fucoidan-quaternized chitosan nanoparticles.
    Type: Grant
    Filed: April 24, 2019
    Date of Patent: October 5, 2021
    Assignee: NATIONAL DEFENSE MEDICAL CENTER
    Inventors: Jenn-jong Young, Chuan-Chang Chuang, Meng-Hung Tsai, Huey-Fen Shyu, Cheng-cheung Chen, Kuang-ming Cheng, Jyh-Hwa Kau, Hui-Ju Yen, Fwu-Long Mi
  • Publication number: 20210305164
    Abstract: A semiconductor device includes a stacked structure, first conductive terminals and second conductive terminals. The stacked structure includes a first semiconductor component having a first area and a second semiconductor component stacked on the first semiconductor component and having a second area smaller than the first area, wherein an extending direction of the first area and an extending direction of the second area are perpendicular to a stacking direction of the first semiconductor component and the second semiconductor component. The first conductive terminals are located on the stacked structure, electrically coupled to the first semiconductor component and aside of the second semiconductor component. The second conductive terminals are located on the stacked structure and electrically coupled to the second semiconductor component.
    Type: Application
    Filed: March 30, 2020
    Publication date: September 30, 2021
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Ming-Hung Tseng, Cheng-Chieh Hsieh, Hao-Yi Tsai
  • Patent number: 11127704
    Abstract: A semiconductor device includes a substrate and at least one bump structure disposed over the substrate. The at least one bump structure includes a pillar formed of a metal having a lower solderability than copper or a copper alloy to a solder alloy disposed over the substrate. A solder alloy is formed directly over and in contact with an upper surface of the metal having the lower solderability than copper or a copper alloy. The pillar has a height of greater than 10 ?m.
    Type: Grant
    Filed: October 24, 2018
    Date of Patent: September 21, 2021
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Pei-Haw Tsao, Chen-Shien Chen, Cheng-Hung Tsai, Kuo-Chin Chang, Li-Huan Chu
  • Publication number: 20210240288
    Abstract: A touch panel includes a cover lens located at top of the touch panel, plural touch sensor units, and plural sensing channels. The touch sensor units are disposed below the cover lens and arranged in rows and columns. The touch sensor units are disposed on the sensing channels. Each of touch sensor units acquires a sensing magnitude for identifying a position of the cover lens that touched by the stylus according to signals outputted by the sensing channels. The sensing magnitude of one of the touch sensor units is composed of the signals of the adjacent sensing channels located within a vertical projection of the one of the touch sensor units.
    Type: Application
    Filed: September 20, 2020
    Publication date: August 5, 2021
    Inventors: Yaw-Guang CHANG, Hui-Min WANG, Cheng-Hung TSAI, Chung-Wen CHANG
  • Patent number: 11049490
    Abstract: An audio playback device receives an instruction from a user to select a target voice model from a plurality of voice models and assigns the target voice model to a target character in a text. The audio playback device also transforms the text into a speech, and during the process of transforming the text into the speech, transforms sentences of the target character in the text into the speech of the target character according to the target voice model.
    Type: Grant
    Filed: November 30, 2018
    Date of Patent: June 29, 2021
    Assignee: Institute For Information Industry
    Inventors: Guang-Feng Deng, Cheng-Hung Tsai, Tsun Ku, Zhi-Guo Zhu, Han-Wen Liu
  • Publication number: 20210142784
    Abstract: A speech synthesis system includes an operating interface, a storage unit and a processor. The operating interface provides a plurality of language options for a user to select one output language option therefrom. The storage unit stores a plurality of acoustic models. Each acoustic model corresponds to one of the language options and includes a plurality of phoneme labels corresponding to a specific vocal. The processor receives a text file and generates output speech data corresponding to the specific vocal according to the text file, a speech synthesizer, and one of the acoustic models which corresponds to the output language option.
    Type: Application
    Filed: December 1, 2019
    Publication date: May 13, 2021
    Inventors: Guang-Feng DENG, Cheng-Hung TSAI, Han-Wen LIU, Chih-Chung CHIEN, Chuan-Wen CHEN
  • Publication number: 20200326827
    Abstract: A touch panel includes a first electrode layer and a second electrode layer. The first electrode layer has transmitting electrodes arranged in transmitting channels and traces respectively coupled to the transmitting channels. The second electrode layer has receiving electrodes arranged in receiving channels. At least one of the traces, the transmitting channels and one of the receiving channels in proximity of the traces form touch detection blocks that respectively correspond to the transmitting channels. For each touch detection block, in a circle area overlapped with at least one of the traces and substantially in the touch detection block corresponding to one of the transmitting channels, a summation of areas of the corresponded transmitting channel and the trace coupled to the corresponded transmitting channel is substantially larger than a summation of areas of the other transmitting channels and the other traces.
    Type: Application
    Filed: April 10, 2019
    Publication date: October 15, 2020
    Inventors: Cheng-Hung TSAI, Chin-Yuan CHIANG, Wai-Pan WU, Shen-Feng TAI
  • Publication number: 20200241662
    Abstract: A touch system includes channel electrodes that are mapped to touch pixels such that a number of the channel electrodes in each dimension is lower than a number of the touch pixels in said dimension. In one embodiment, each channel electrode has different adjacent channel electrodes at different positions of the mapped touch pixel. In another embodiment, each touch pixel in said dimension is laterally extended to at least one adjacent touch pixel in said dimension. In a further embodiment, original sensing channel electrodes and mirrored sensing channel electrodes are alternately corresponded to the driving channel electrodes.
    Type: Application
    Filed: January 24, 2019
    Publication date: July 30, 2020
    Inventors: Cheng-Hung Tsai, Chin-Yuan Chiang, Wai-Pan Wu, Li-Lin Liu, Shen-Feng Tai
  • Patent number: 10712886
    Abstract: A sensing unit in the touch panel includes a first electrode formed in a first film and a second electrode formed in a second film. The first electrode includes multiple extending portions and at least one connecting portion. The extending portions extend along a first direction. The connecting portion extends along a second direction which is different from the first direction. The extending portions are spaced from each other by a distance along the second direction, and the connecting portion connects the extending portions. The second electrode includes a circular pad having an opening. The extending portions at least partially overlap with the circular pad, and the connecting portion is formed in an area overlapping with the opening.
    Type: Grant
    Filed: October 5, 2018
    Date of Patent: July 14, 2020
    Assignee: HIMAX TECHNOLOGIES LIMITED
    Inventors: Cheng-Hung Tsai, Ying-Zhuan Liu, Xue-Xia Cai, Yuan-Ting Chen, Jui-Ni Li, Wai-Pan Wu, Shen-Feng Tai
  • Patent number: 10690758
    Abstract: A structure for attaching an ultrasound sensor to a side portion of a vehicle includes a bracket via which the ultrasound sensor is attached to face the ground under the floor of the vehicle and to be inclined at a predetermined angle with respect to the horizontal plane such that water drops adhering to the ultrasound sensor flow downward.
    Type: Grant
    Filed: August 30, 2018
    Date of Patent: June 23, 2020
    Inventors: Yasuhiro Tamura, Ryoichi Enoki, Shoji Yokoyama, Jun Sugimoto, Tatsuya Tachibana, Yangjian Li, Takuya Tamura, Qi Chen, Kai-Wei Yeh, Cheng-Hung Tsai, Yu-Ming Lee
  • Patent number: 10649601
    Abstract: A method for improving touch performance of a capacitive touch screen with a non-rectangular shape is provided. The capacitive touch screen includes plural complete cells and at least one incomplete cell for sensing. The method includes: determining whether an active area of the incomplete cell is different from an active area of each of the complete cells; and performing a mutual capacitance compensation on the incomplete cell to compensate a mutual capacitance of the incomplete cell when the active area of the incomplete cell is different from the active area of each of the complete cells.
    Type: Grant
    Filed: October 28, 2018
    Date of Patent: May 12, 2020
    Assignee: HIMAX TECHNOLOGIES LIMITED
    Inventors: Cheng-Hung Tsai, Yan-Hua Shu, Jen-Chieh Lin, Wai-Pan Wu
  • Publication number: 20200133410
    Abstract: A method for improving touch performance of a capacitive touch screen with a non-rectangular shape is provided. The capacitive touch screen includes plural complete cells and at least one incomplete cell for sensing. The method includes: determining whether an active area of the incomplete cell is different from an active area of each of the complete cells; and performing a mutual capacitance compensation on the incomplete cell to compensate a mutual capacitance of the incomplete cell when the active area of the incomplete cell is different from the active area of each of the complete cells.
    Type: Application
    Filed: October 28, 2018
    Publication date: April 30, 2020
    Inventors: Cheng-Hung TSAI, Yan-Hua SHU, Jen-Chieh LIN, Wai-Pan WU
  • Publication number: 20200135169
    Abstract: An audio playback device receives an instruction from a user to select a target voice model from a plurality of voice models and assigns the target voice model to a target character in a text. The audio playback device also transforms the text into a speech, and during the process of transforming the text into the speech, transforms sentences of the target character in the text into the speech of the target character according to the target voice model.
    Type: Application
    Filed: November 30, 2018
    Publication date: April 30, 2020
    Inventors: Guang-Feng DENG, Cheng-Hung TSAI, Tsun KU, Zhi-Guo ZHU, Han-Wen LIU
  • Publication number: 20200133018
    Abstract: A DOE module including a transparent substrate, a first electrode, a second electrode, a first sensing wire, a sensing layer, a DOE layer, and an insulating layer is provided. The first electrode is disposed on the transparent substrate, and the second electrode is disposed on the transparent substrate. The first sensing wire is distributed on the transparent substrate and electrically connected to the first electrode. The sensing layer is distributed on the transparent substrate and electrically connected to the second electrode. The first sensing wire is insulated from the sensing layer to form a capacitance between the first sensing wire and the sensing layer. The DOE layer is disposed on the transparent substrate. The insulating layer covers the first sensing wire and the sensing layer. The insulating layer has a first opening and a second opening respectively exposing the first electrode and the second electrode.
    Type: Application
    Filed: August 23, 2019
    Publication date: April 30, 2020
    Applicant: HIMAX TECHNOLOGIES LIMITED
    Inventors: Biing-Seng Wu, Han-Yi Kuo, Kuan-Ming Chen, Chih-Yu Chuang, Shi-Jen Wu, Jui-Ni Li, Cheng-Hung Tsai, Chin-Yuan Chiang, Chia-Ming Hsu, Chiau-Ling Huang
  • Patent number: 10521060
    Abstract: A reflected-capacitive touch panel of a wearable electronic device includes a center touch sensing portion composed of a plurality of mutual-capacitance sensors; a border touch sensing portion composed of a plurality of hybrid self-capacitance and mutual-capacitance sensors; and a predetermined bonding area into which channels of the center touch sensing portion and the border touch sensing portion are routed.
    Type: Grant
    Filed: December 29, 2017
    Date of Patent: December 31, 2019
    Assignee: Himax Technologies Limited
    Inventors: Cheng-Hung Tsai, Yao-Mao Liu, Wen-Juan Li, Jyun-Yan Liu, Li-Lin Liu, Jui-Ni Li, Wai-Pan Wu, Shen-Feng Tai
  • Publication number: 20190391687
    Abstract: A sensing unit in the touch panel includes a first electrode formed in a first film and a second electrode formed in a second film. The first electrode includes multiple extending portions and at least one connecting portion. The extending portions extend along a first direction. The connecting portion extends along a second direction which is different from the first direction. The extending portions are spaced from each other by a distance along the second direction, and the connecting portion connects the extending portions. The second electrode includes a circular pad having an opening. The extending portions at least partially overlap with the circular pad, and the connecting portion is formed in an area overlapping with the opening.
    Type: Application
    Filed: October 5, 2018
    Publication date: December 26, 2019
    Inventors: Cheng-Hung TSAI, Ying-Zhuan LIU, Xue-Xia CAI, Yuan-Ting CHEN, Jui-Ni LI, Wai-Pan WU, Shen-Feng TAI
  • Publication number: 20190265341
    Abstract: A structure for attaching an ultrasound sensor to a side portion of a vehicle includes a bracket via which the ultrasound sensor is attached to face the ground under the floor of the vehicle and to be inclined at a predetermined angle with respect to the horizontal plane such that water drops adhering to the ultrasound sensor flow downward.
    Type: Application
    Filed: August 30, 2018
    Publication date: August 29, 2019
    Applicants: Honda Access Corp., Honda Access Taiwan Co., Ltd., Whetron Electronics Co., Ltd.
    Inventors: Yasuhiro Tamura, Ryoichi Enoki, Shoji Yokoyama, Jun Sugimoto, Tatsuya Tachibana, Yangjian Li, Takuya Tamura, Qi Chen, Kai-Wei Yeh, Cheng-Hung Tsai, Yu-Ming Lee
  • Patent number: 10310671
    Abstract: A touch sensor device provided herein includes a sensor pad disposed on a carrier, wherein the sensor pad includes a first electrode, a second electrode, a third electrode and a grounding electrode. The first electrode surrounds a periphery of the second electrode and a first gap is formed between the first electrode and the second electrode. The first electrode surrounds a periphery of the third electrode, and a second gap is formed between the first electrode and the third electrode. The grounding electrode surrounds a periphery of the pad sensor, wherein a third gap is formed between the first electrode and the grounding electrode.
    Type: Grant
    Filed: April 28, 2017
    Date of Patent: June 4, 2019
    Assignee: HIMAX TECHNOLOGIES LIMITED
    Inventors: Cheng-Hung Tsai, Xuexia Cai, Yuan-Ting Chen, Jui-Ni Li, Wai-Pan Wu, Shen-Feng Tai
  • Publication number: 20190164920
    Abstract: A semiconductor device includes a substrate and at least one bump structure disposed over the substrate. The at least one bump structure includes a pillar formed of a metal having a lower solderability than copper or a copper alloy to a solder alloy disposed over the substrate. A solder alloy is formed directly over and in contact with an upper surface of the metal having the lower solderability than copper or a copper alloy. The pillar has a height of greater than 10 ?m.
    Type: Application
    Filed: October 24, 2018
    Publication date: May 30, 2019
    Inventors: Pei-Haw TSAO, Chen-Shien CHEN, Cheng-Hung TSAI, Kuo-Chin CHANG, Li-Huan CHU