Patents by Inventor CHENG HUNG WANG

CHENG HUNG WANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20170125310
    Abstract: The present disclosure relates to a semiconductor process, which includes: (a) providing a semiconductor element; (b) attaching the semiconductor element to a carrier by an adhesive layer, so that the adhesive layer is sandwiched between the semiconductor element and the carrier; and (c) cutting the semiconductor element to form a plurality of semiconductor units. Thereby, the gaps between the semiconductor units are fixed after the cutting process, so as to facilitate testing the semiconductor units.
    Type: Application
    Filed: January 18, 2017
    Publication date: May 4, 2017
    Applicant: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Yu-Cheng TSAO, Cheng-Hung WANG, Chun-Chieh LIN, Hsiu-Hsiung YANG, Yu-Pin TSAI
  • Patent number: 9564376
    Abstract: The present disclosure relates to a semiconductor process, which includes: (a) providing a semiconductor element; (b) attaching the semiconductor element to a carrier by an adhesive layer, so that the adhesive layer is sandwiched between the semiconductor element and the carrier; and (c) cutting the semiconductor element to form a plurality of semiconductor units. Thereby, the gaps between the semiconductor units are fixed after the cutting process, so as to facilitate testing the semiconductor units.
    Type: Grant
    Filed: September 23, 2014
    Date of Patent: February 7, 2017
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Yu-Cheng Tsao, Cheng-Hung Wang, Chun-Chieh Lin, Hsiu-Hsiung Yang, Yu-Pin Tsai
  • Patent number: 9101057
    Abstract: A micro secure digital (SD) adapter, for adapting a micro SD card to an SD interface, the micro SD adapter comprising a micro SD slot, for disposing the micro SD card; a pin module, comprising a plurality of signal pins, a first ground pin, and a second ground pin; a plurality of connectors, for conducting the plurality of signal pins and the first ground pin to the micro SD card according to a pin configuration of the micro SD card when the micro SD card is disposed in the micro SD slot; and a conducting module, electrically connected between a terminal of a first connector corresponding to the first ground pin and the second ground pin.
    Type: Grant
    Filed: January 17, 2013
    Date of Patent: August 4, 2015
    Assignee: Skymedi Corporation
    Inventors: Chun-Lung Chuang, Chien-Cheng Chen, Cheng-Hung Wang, Yun-Ting Wang, Ming-Chung Chen, Yen-Chi Peng, Tsai-Jung Hung, Yu-Fen Chang
  • Publication number: 20150132867
    Abstract: The present disclosure relates to a semiconductor process, which includes: (a) providing a semiconductor element; (b) attaching the semiconductor element to a carrier by an adhesive layer, so that the adhesive layer is sandwiched between the semiconductor element and the carrier; and (c) cutting the semiconductor element to form a plurality of semiconductor units. Thereby, the gaps between the semiconductor units are fixed after the cutting process, so as to facilitate testing the semiconductor units.
    Type: Application
    Filed: September 23, 2014
    Publication date: May 14, 2015
    Inventors: Yu-Cheng TSAO, Cheng-Hung WANG, Chun-Chieh LIN, Hsiu-Hsiung YANG, Yu-Pin TSAI
  • Publication number: 20140198460
    Abstract: A micro secure digital (SD) adapter, for adapting a micro SD card to an SD interface, the micro SD adapter comprising a micro SD slot, for disposing the micro SD card; a pin module, comprising a plurality of signal pins, a first ground pin, and a second ground pin; a plurality of connectors, for conducting the plurality of signal pins and the first ground pin to the micro SD card according to a pin configuration of the micro SD card when the micro SD card is disposed in the micro SD slot; and a conducting module, electrically connected between a terminal of a first connector corresponding to the first ground pin and the second ground pin.
    Type: Application
    Filed: January 17, 2013
    Publication date: July 17, 2014
    Applicant: SKYMEDI CORPORATION
    Inventors: Chun-Lung Chuang, Chien-Cheng Chen, Cheng-Hung Wang, Yun-Ting Wang, Ming-Chung Chen, Yen-Chi Peng, Tsai-Jung Hung, Yu-Fen Chang
  • Publication number: 20140055940
    Abstract: A memory device includes a control board and a conductive housing. In one embodiment, a circuit ground in the control board is electrically coupled to the conductive housing to make a common ground contact. In another embodiment, differential impedances at different locations of a conductor are controllably maintained within a specified range by adjusting width of the conductor and/or spacing between the adjacent conductors of a differential pair.
    Type: Application
    Filed: August 21, 2012
    Publication date: February 27, 2014
    Applicant: SKYMEDI CORPORATION
    Inventors: Chien Cheng Chen, Chun-Lung Chuang, MING CHUNG CHEN, YUN-TING WANG, Yen-Chi Peng, CHENG HUNG WANG